公开(公告)号：US20150043181A1

公开(公告)日：2015-02-12

申请号：US14523245

申请日：2014-10-24

Applicant: TESSERA, INC.

Inventor： Belgacem Haba ,  Wael Zohni ,  Richard Dewitt Crisp

IPC: H05K1/11 ,  H05K1/18

CPC classification number: H05K1/11 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/50 ,  H01L24/29 ,  H01L24/30 ,  H01L24/32 ,  H01L24/33 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0657 ,  H01L2224/06136 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45014 ,  H01L2224/45144 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48465 ,  H01L2224/48599 ,  H01L2224/49111 ,  H01L2224/49175 ,  H01L2224/49427 ,  H01L2224/73215 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2225/06575 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/1205 ,  H01L2924/1206 ,  H01L2924/1207 ,  H01L2924/1434 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19103 ,  H01L2924/19107 ,  H01L2924/30107 ,  H05K1/115 ,  H05K1/181 ,  H05K2201/10507 ,  H05K2201/10628 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/85399 ,  H01L2224/05599 ,  H01L2924/206

Abstract: The present disclosure is directed to a microelectronic assembly that includes first and second microelectronic elements, signal leads, one or more jumper leads, and a dielectric element that has first and second apertures. The signal leads may be connected to one or more of the microelectronic elements and extend through the one or more of the first or second apertures to conductive elements on the dielectric element. The jumper leads may extend through the first aperture and be connected to a contact of the first microelectronic element. The one or more jumper leads may span over the second aperture and be connected to a conductive element on the dielectric element.

Abstract translation: 本公开涉及包括第一和第二微电子元件，信号引线，一个或多个跳线以及具有第一和第二孔的电介质元件的微电子组件。 信号引线可以连接到一个或多个微电子元件，并且延伸通过第一或第二孔中的一个或多个到电介质元件上的导电元件。 跳线可以延伸穿过第一孔径并连接到第一微电子元件的触点。 一个或多个跨接线可以跨过第二孔并且连接到电介质元件上的导电元件。

公开(公告)号：US20140291871A1

公开(公告)日：2014-10-02

申请号：US14306947

申请日：2014-06-17

Applicant: Tessera, Inc.

Inventor： Belgacem Haba ,  Ellis Chau ,  Wael Zohni ,  Philip Damberg ,  Richard Dewitt Crisp

IPC: H01L23/00 ,  H01L23/64

CPC classification number: H01L23/64 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/552 ,  H01L24/06 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/0657 ,  H01L2224/02311 ,  H01L2224/02313 ,  H01L2224/02375 ,  H01L2224/02379 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06537 ,  H01L2225/06575 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/10161 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/43

Abstract: A microelectronic assembly is disclosed that is capable of achieving a desired impedance for raised conductive elements. The microelectronic assembly may include an interconnection element, a surface conductive element, a microelectronic device, a plurality of raised conductive elements, and a bond element. The microelectronic device may overlie the dielectric element and at least one surface conductive element attached to the front surface. The plurality of raised conductive elements may connect the device contacts with the element contacts. The raised conductive elements may have substantial portions spaced a first height above and extending at least generally parallel to at least one surface conductive element, such that a desired impedance may be achieved for the raised conductive elements. A bond element may electrically connect at least one surface conductive element with at least one reference contact that may be connectable to a source of reference potential.

Abstract translation: 公开了能够实现用于凸起的导电元件的期望阻抗的微电子组件。 微电子组件可以包括互连元件，表面导电元件，微电子器件，多个凸起的导电元件和接合元件。 微电子器件可以覆盖在电介质元件和附接到前表面的至少一个表面导电元件。 多个凸起的导电元件可以将元件触点与元件触点连接。 升高的导电元件可以具有在第一高度之上并且至少大致平行于至少一个表面导电元件延伸的基本部分，使得可以为凸起的导电元件实现期望的阻抗。 键合元件可以将至少一个表面导电元件与可连接到参考电位源的至少一个参考触点电连接。

公开(公告)号：US20140131849A1

公开(公告)日：2014-05-15

申请号：US14156967

申请日：2014-01-16

Applicant: Tessera, Inc.

Inventor： Wael Zohni ,  Belgacem Haba

IPC: H01L23/495 ,  H01L25/00

CPC classification number: H01L23/49575 ,  G11C5/04 ,  G11C5/06 ,  H01L23/13 ,  H01L23/4951 ,  H01L23/49541 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L24/92 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/06135 ,  H01L2224/06136 ,  H01L2224/06156 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45099 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/73203 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06562 ,  H01L2225/06565 ,  H01L2225/1023 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/07811 ,  H01L2924/1434 ,  H01L2924/181 ,  H01L2924/207 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2924/014

Abstract: A module can include a module card and first and second microelectronic elements having front surfaces facing a first surface of the module card. The module card can also have a second surface and a plurality of parallel exposed edge contacts adjacent an edge of at least one of the first and second surfaces for mating with corresponding contacts of a socket when the module is inserted in the socket. Each microelectronic element can be electrically connected to the module card. The front surface of the second microelectronic element can partially overlie a rear surface of the first microelectronic element and can be attached thereto.

Abstract translation: 模块可以包括模块卡和具有面向模块卡的第一表面的前表面的第一和第二微电子元件。 模块卡还可以具有邻近第一和第二表面中的至少一个表面的边缘的第二表面和多个平行的暴露的边缘接触件，用于当模块插入插座时与插座的相应接触件配合。 每个微电子元件可以电连接到模块卡。 第二微电子元件的前表面可以部分地覆盖在第一微电子元件的后表面上并且可以附接到第一微电子元件的后表面。

公开(公告)号：US20140021641A1

公开(公告)日：2014-01-23

申请号：US14034265

申请日：2013-09-23

Applicant: TESSERA, INC.

Inventor： Ilyas Mohammed ,  Belgacem Haba ,  Wael Zohni ,  Philip R. Osborn

IPC: H01L23/00

CPC classification number: H01L24/46 ,  H01L23/49811 ,  H01L23/49838 ,  H01L23/5226 ,  H01L23/5386 ,  H01L24/16 ,  H01L24/48 ,  H01L24/49 ,  H01L24/85 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05147 ,  H01L2224/05568 ,  H01L2224/05569 ,  H01L2224/056 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32014 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48101 ,  H01L2224/48105 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/484 ,  H01L2224/49175 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/85 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06548 ,  H01L2225/06562 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/15153 ,  H01L2924/15156 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/18165 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

Abstract: Packaged microelectronic elements are provided which include a dielectric element, a cavity, a plurality of chip contacts and a plurality of package contacts, and microelectronic elements having a plurality of bond pads connected to the chip contacts.

Abstract translation: 提供封装的微电子元件，其包括电介质元件，空腔，多个芯片触点和多个封装触点，以及具有连接到芯片触点的多个键合焊盘的微电子元件。