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    Semiconductor module with low inductance load connections
    4.
    发明授权
    Semiconductor module with low inductance load connections 有权

    公开(公告)号：US09668350B2

    公开(公告)日：2017-05-30

    申请号：US14709605

    申请日：2015-05-12

    Applicant: Infineon Technologies AG

    Inventor： Andre Arens

    IPC: H05K1/18 ,  H01L25/07 ,  H01L23/538 ,  H01L23/495 ,  H01L23/498

    CPC classification number: H05K1/185 ,  H01L23/4952 ,  H01L23/49541 ,  H01L23/49575 ,  H01L23/49844 ,  H01L23/5386 ,  H01L23/5389 ,  H01L25/072 ,  H01L2924/0002 ,  H05K2201/10507 ,  H01L2924/00

    Abstract: A semiconductor module includes a printed circuit board, and first and second embedded semiconductor chips. The first and second semiconductor chips each have a first load connection and a second load connection. The printed circuit board further includes a structured first metalization layer, which has a first section and a second section, and a structured second metalization layer, which has a first section, a second section and a third section. The first section of the second metalization layer and the second section of the first metalization layer have comb shaped structures having first and second protrusions. These first and second sections are electrically conductively connected to one another by a number of first plated-through holes each of which is permanently electrically conductively connected both at first protrusions to the first section of the second metalization layer and at second protrusions to the second section of the first metalization layer.

    COMPONENT-EMBEDDED RESIN SUBSTRATE
    7.
    发明申请
    COMPONENT-EMBEDDED RESIN SUBSTRATE 有权
    组分嵌入树脂基材

    公开(公告)号：US20140218884A1

    公开(公告)日：2014-08-07

    申请号：US14246682

    申请日：2014-04-07

    Applicant: MURATA MANUFACTURING CO., LTD.

    Inventor： Norio Sakai ,  Yoshihito Otsubo

    IPC: H05K1/18

    CPC classification number: H05K1/183 ,  H01L23/49822 ,  H01L23/50 ,  H01L24/95 ,  H01L2224/16225 ,  H01L2924/12042 ,  H01L2924/19105 ,  H05K1/0298 ,  H05K1/0306 ,  H05K1/186 ,  H05K3/4614 ,  H05K3/4697 ,  H05K2201/0195 ,  H05K2201/09027 ,  H05K2201/10507 ,  H05K2201/10636 ,  Y02P70/611 ,  H01L2924/00

    Abstract: A component-embedded resin substrate includes a resin structure including a plurality of laminated resin layers and having an end surface surrounding an outer periphery of the resin layers and a plurality of embedded components arranged as embedded in the resin structure. The plurality of embedded components include a first embedded component and a second embedded component. When viewed in a planar view, the first embedded component has a first outer side extending along a portion of an end surface 5 closest to the first embedded component. When viewed in a planar view, the second embedded component has a second outer side extending along a portion of the end surface closest to the second embedded component. When viewed in a planar view, the outer side is oblique to the second outer side.

    Abstract translation: 嵌入树脂组件的树脂基板包括树脂结构体，该树脂结构体包括多个层压树脂层，并且具有围绕树脂层的外周的端面和嵌入树脂结构体中的多个嵌入部件。 多个嵌入式组件包括第一嵌入组件和第二嵌入组件。 当在平面视图中观察时，第一嵌入部件具有沿最靠近第一嵌入部件的端面5的一部分延伸的第一外侧。 当在平面视图中观察时，第二嵌入部件具有沿最靠近第二嵌入部件的端表面的一部分延伸的第二外侧。 当在平面图中观察时，外侧与第二外侧倾斜。

    Wiring board with built-in electronic component
    10.
    发明授权
    Wiring board with built-in electronic component 有权

    公开(公告)号：US09699909B2

    公开(公告)日：2017-07-04

    申请号：US14455012

    申请日：2014-08-08

    Applicant: IBIDEN CO., LTD.

    Inventor： Naohito Ishiguro ,  Yasushi Inagaki

    IPC: H05K1/18 ,  H05K7/00 ,  H05K3/46

    CPC classification number: H05K1/185 ,  H01L2224/16227 ,  H01L2924/15311 ,  H05K3/4602 ,  H05K3/4644 ,  H05K2201/10 ,  H05K2201/10015 ,  H05K2201/10507 ,  H05K2203/0156

    Abstract: A wiring board with a built-in electronic component includes a core substrate, an electronic component in the substrate, a first upper-layer structure on first surface of the substrate, a second upper-layer structure on second surface of the substrate, and via conductors in the substrate and first upper-layer structure such that the via conductors are connected to an electrode of the component. The substrate has an accommodating layer, a first connection layer on first surface of the accommodating layer, and a second connection layer on second surface of the accommodating layer, the accommodating layer includes inner wiring and insulation layers and has cavity accommodating the component, the first connection layer includes inner wiring and insulation layers, and the second connection layer includes inner wiring and insulation layers such that the second connection layer includes greater number of inner wiring and insulation layers than the first connection layer.

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