公开(公告)号：US20220117091A1

公开(公告)日：2022-04-14

申请号：US17557104

申请日：2021-12-21

Applicant: TactoTek Oy

Inventor： Mikko Heikkinen ,  Jarmo Sääski ,  Jarkko Torvinen ,  Paavo Niskala ,  Mikko Sippari ,  Pasi Raappana ,  Antti Keränen

IPC: H05K3/00 ,  B29C45/14 ,  H05K1/02 ,  H05K1/03

Abstract: A system for manufacturing an electromechanical structure includes first, second, and third entities. The first entity produces conductors on a planar, flat film. The second entity attaches electronic elements at locations on the film in relation to a three-dimensional shape of the film. The electronic elements include a number of surface mount technology components. The locations of the electronic elements are selected to omit substantial deformation during subsequent forming of the film into the three-dimensional shape. The third entity forms the film into the three-dimensional shape when the electronic elements are supported on the film. The third entity includes one or more machines that are continuously roll-fed, automatically in-precut-pieces-fed, computer numerical control, thermoforming, vacuum former, pressure forming, or blow molding. The first, second, and third entities are arranged relative to one another to manufacture the electromechanical structure.

公开(公告)号：US11292166B2

公开(公告)日：2022-04-05

申请号：US15481976

申请日：2017-04-07

Applicant: TactoTek Oy

Inventor： Anne Isohätälä ,  Hasse Sinivaara ,  Mikko Heikkinen

IPC: B29C45/14 ,  B29C45/16 ,  G01D5/24 ,  H01F27/28 ,  H01F38/14 ,  H01F41/04 ,  B29L31/34 ,  H01Q9/04 ,  B29B11/06 ,  B29K705/00

Abstract: A method, for manufacturing an electronic assembly, such as an antenna or a capacitive sensing device or a coupled inductor, comprising at least a first electrically conductive element and a second electrically conductive element is presented. The method comprises obtaining said electrically conductive elements, such as patch elements, arranging said electrically conductive elements, such as inside of a cavity defined by a mold structure, at a pre-defined distance from each other for establishing an electromagnetic coupling between said electrically conductive elements, and molding, such as injection molding, a molding material layer at least between said electrically conductive elements, wherein the molding material layer has a thickness between said electrically conductive elements defined by the pre-defined distance. In addition, electronic assemblies, antennas, capacitive sensing devices and coupled inductors are presented.

公开(公告)号：US11287564B2

公开(公告)日：2022-03-29

申请号：US17152978

申请日：2021-01-20

Applicant: TACTOTEK OY

Inventor： Antti Keränen ,  Mikko Heikkinen

IPC: G02B6/00 ,  F21V8/00 ,  H05K1/02 ,  H05K1/18 ,  H05K3/12 ,  H05K3/28

Abstract: An electronic device includes a substrate film having a first side and a second side, and a number of light sources configured to emit light. A plastic lightguide layer is molded onto the first side of the substrate film. The plastic lightguide layer being of optically at least translucent material to transmit light. The device also includes a masking layer provided on the outer surface of the plastic lightguide layer. The masking layer defines a window for letting the light emitted by the embedded light sources to pass through the masking layer towards the environment.

公开(公告)号：US11285645B2

公开(公告)日：2022-03-29

申请号：US16561213

申请日：2019-09-05

Applicant: TactoTek Oy

Inventor： Anne Isohätälä ,  Hasse Sinivaara ,  Mikko Heikkinen

IPC: B29C45/14 ,  B29C45/16 ,  G01D5/24 ,  H01F27/28 ,  H01F38/14 ,  H01F41/04 ,  B29L31/34 ,  H01Q9/04 ,  B29B11/06 ,  B29K705/00

Abstract: A method, for manufacturing an electronic assembly, such as an antenna or a capacitive sensing device or a coupled inductor, comprising at least a first electrically conductive element and a second electrically conductive element is presented. The method comprises obtaining said electrically conductive elements, such as patch elements, arranging said electrically conductive elements, such as inside of a cavity defined by a mold structure, at a pre-defined distance from each other for establishing an electromagnetic coupling between said electrically conductive elements, and molding, such as injection molding, a molding material layer at least between said electrically conductive elements, wherein the molding material layer has a thickness between said electrically conductive elements defined by the pre-defined distance. In addition, electronic assemblies, antennas, capacitive sensing devices and coupled inductors are presented.

公开(公告)号：US11175014B1

公开(公告)日：2021-11-16

申请号：US17321692

申请日：2021-05-17

Applicant: TactoTek Oy

Inventor： Juha-Matti Hintikka ,  Miikka Kärnä ,  Heikki Tuovinen ,  Tuomas Nieminen ,  Johannes Soutukorva ,  Ville Wallenius ,  Tero Rajaniemi ,  Tomi Simula ,  Jari Lihavainen ,  Mikko Heikkinen ,  Jarmo Sääski ,  Hasse Sinivaara ,  Antti Keränen ,  Ilpo Hänninen

IPC: H05K1/02 ,  F21V11/08 ,  G02B5/00 ,  H05K1/18 ,  H05K3/46 ,  H05K3/00 ,  H05K3/30

Abstract: An optoelectronically functional multilayer structure as well as related methods of manufacturing an optoelectronically functional multilayer structure are described herein.

公开(公告)号：US11166380B1

公开(公告)日：2021-11-02

申请号：US17072474

申请日：2020-10-16

Applicant: TactoTek Oy

Inventor： Tomi Simula ,  Mika Paani ,  Miikka Kärnä ,  Outi Rusanen ,  Johanna Juvani ,  Tapio Rautio ,  Marko Suo-Anttila ,  Mikko Heikkinen

IPC: H05K1/02 ,  H05K1/18 ,  H05K3/00 ,  H05K3/08 ,  H05K3/12 ,  H05K3/28 ,  H05K3/32 ,  H05K3/44 ,  H01L21/00 ,  H01L21/48 ,  H01L21/50 ,  H01L21/56 ,  H01L21/77 ,  H01L21/78 ,  H01L23/00 ,  H01L23/12 ,  H01L23/16 ,  H01L23/18 ,  H01L23/24 ,  H01L23/28 ,  H01L23/29 ,  H01L23/31 ,  H01L23/48 ,  H01L23/52 ,  H01L23/498 ,  H01L23/552 ,  H01L23/538 ,  H05K5/03 ,  B29C45/14 ,  H05K5/06 ,  B29K101/12 ,  B29L31/34

Abstract: A structure includes a first substrate film and a functional electronics assembly. The first substrate film comprises a recess defining a volume. The functional electronics assembly comprises at least a first substrate, at least one electronics component on the first substrate, and at least one connection portion. The functional electronics assembly is connected to the first substrate film via the at least one connection portion. The at least one electronics component is arranged at least partly into the volume. At least part of the at least one electronics component is embedded into a first material arranged into the recess.

公开(公告)号：US11088066B2

公开(公告)日：2021-08-10

申请号：US15924697

申请日：2018-03-19

Applicant: TactoTek Oy

Inventor： Jarmo Sääski ,  Mikko Heikkinen ,  Tero Heikkinen ,  Mika Paani ,  Jan Tillonen ,  Ronald Haag

IPC: H05K5/00 ,  H01L23/522 ,  H01L23/50 ,  H05K3/46 ,  H01L23/14 ,  H01L25/065 ,  H05K3/28 ,  H05K1/18 ,  H05K3/40

Abstract: An integrated multilayer structure, includes a substrate film having a first side and an opposite second side. The substrate film includes electrically substantially insulating material, a circuit design including a number of electrically conductive areas of electrically conductive material on the first and/or second sides of the substrate film, and a connector including a number of electrically conductive contact elements. The connector is provided to the substrate film so that it extends to both the first and second sides of the substrate film and the number of electrically conductive contact elements connect to one or more of the conductive areas of the circuit design while being further configured to electrically couple to an external connecting element responsive to mating the external connecting element with the connector on the first or second side of or adjacent to the substrate film.

公开(公告)号：US10670800B2

公开(公告)日：2020-06-02

申请号：US16155956

申请日：2018-10-10

Applicant: TACTOTEK OY

Inventor： Antti Keränen ,  Mikko Heikkinen

IPC: F21S10/00 ,  F21V8/00 ,  H05K1/02 ,  H05K1/18 ,  H05K3/12 ,  H05K3/28

Abstract: An electronic device includes a substrate film having a first side and a second side, and a number of light sources configured to emit light. A plastic lightguide layer is molded onto the first side of the substrate film. The plastic lightguide layer being of optically at least translucent material to transmit light. The device also includes a masking layer provided on the outer surface of the plastic lightguide layer. The masking layer defines a window for letting the light emitted by the embedded light sources to pass through the masking layer towards the environment.

公开(公告)号：US10667401B2

公开(公告)日：2020-05-26

申请号：US16045009

申请日：2018-07-25

Applicant: TactoTek Oy

Inventor： Mikko Heikkinen ,  Antti Keränen ,  Jarmo Sääski ,  Ronald H. Haag

IPC: H05K3/32 ,  H05K1/18 ,  H05K3/28 ,  H05K1/02 ,  H05K1/11 ,  H05K1/14 ,  H05K3/00 ,  H05K3/36

Abstract: A method for manufacturing a multilayer structure, includes obtaining a substrate film for accommodating electronics, providing, preferably at least in part by printed electronics technology, a number of conductive traces, and optionally electronic components, at least on a first side of the substrate film to establish a predetermined circuit design, providing a connector element to said substrate film to electrically connect to the circuit, wherein the substrate film is arranged with at least one hole, preferably through hole, substantially matching the location of the connector element so that a number of electrically conductive contact members of the connector element are accessible from a second, opposite side of the substrate film via said at least one hole, and molding thermoplastic material on said first side of the substrate film and said connector element to substantially cover the established circuit and the side of the connector element facing the material.

公开(公告)号：US10653004B2

公开(公告)日：2020-05-12

申请号：US15811889

申请日：2017-11-14

Applicant: TactoTek Oy

Inventor： Mikko Heikkinen ,  Jarmo Sääski

IPC: H05K1/11 ,  H05K1/02 ,  H05K3/28 ,  H05K3/40 ,  H05K3/12 ,  B29C45/14 ,  B29C45/26 ,  H05K1/03

Abstract: An electronic assembly includes a substrate film for accommodating electronics, an electrical contact pad coupled to the substrate film, an electrically conductive member coupled to the electrical contact pad, and a material layer molded onto the substrate film to embed the elastic electrically conductive member.