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公开(公告)号：US11594482B2
公开(公告)日：2023-02-28
申请号：US17368244
申请日：2021-07-06
Applicant: TactoTek Oy
Inventor： Jarmo Sääski , Mikko Heikkinen , Tero Heikkinen , Mika Paani , Jan Tillonen , Ronald Haag
IPC: H05K5/00 , H01L23/522 , H05K3/46 , H01L23/50 , H01L23/14 , H01L25/065 , H05K3/28 , H05K1/18 , H05K3/40
Abstract: An integrated multilayer structure, includes a substrate film having a first side and an opposite second side. The substrate film includes electrically substantially insulating material, a circuit design including a number of electrically conductive areas of electrically conductive material on the first and/or second sides of the substrate film, and a connector including a number of electrically conductive contact elements. The connector is provided to the substrate film so that it extends to both the first and second sides of the substrate film and the number of electrically conductive contact elements connect to one or more of the conductive areas of the circuit design while being further configured to electrically couple to an external connecting element responsive to mating the external connecting element with the connector on the first or second side of or adjacent to the substrate film.
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Patent Agency Ranking
公开(公告)号：US20190069409A1
公开(公告)日：2019-02-28
申请号：US16038864
申请日：2018-07-18
Applicant: TactoTek Oy
Inventor： Antti Keranen , Ronald Haag , Mikko Heikkinen
Abstract: A method for manufacturing a multilayer structure, includes obtaining a first substrate film for accommodating electronics, said first substrate film having a first side and an opposite second side, said first substrate film including electrically substantially insulating material, said first substrate film preferably being formable and/or thermoplastic, providing, optionally by mounting and/or by printed electronics technology, circuitry on at least said second side of the first substrate film, said circuitry being functionally connected to the first side of the first substrate film, and molding, optionally by injection molding or reactive molding, plastic material on the first side of the first substrate film so as to at least partially cover it.
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公开(公告)号：US10667396B2
公开(公告)日：2020-05-26
申请号：US15687095
申请日：2017-08-25
Applicant: TactoTek Oy
Inventor： Antti Keranen , Ronald Haag , Mikko Heikkinen
Abstract: Integrated multilayer structure (100, 200, 300, 400, 500, 600, 700) comprising a first substrate film (102) having a first side (102A), said first substrate film comprising electrically substantially insulating material, said first substrate film preferably being formable and optionally thermoplastic, a plastic layer (112) molded onto said first side of the first substrate film so as to at least partially cover it, and circuitry (104, 106, 204, 205), optionally comprising an electronic, electromechanical and/or electro-optical component, provided on the second side of the first substrate film, said circuitry being functionally connected to the first side of the first substrate film.
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公开(公告)号：US11088066B2
公开(公告)日：2021-08-10
申请号：US15924697
申请日：2018-03-19
Applicant: TactoTek Oy
Inventor： Jarmo Sääski , Mikko Heikkinen , Tero Heikkinen , Mika Paani , Jan Tillonen , Ronald Haag
IPC: H05K5/00 , H01L23/522 , H01L23/50 , H05K3/46 , H01L23/14 , H01L25/065 , H05K3/28 , H05K1/18 , H05K3/40
Abstract: An integrated multilayer structure, includes a substrate film having a first side and an opposite second side. The substrate film includes electrically substantially insulating material, a circuit design including a number of electrically conductive areas of electrically conductive material on the first and/or second sides of the substrate film, and a connector including a number of electrically conductive contact elements. The connector is provided to the substrate film so that it extends to both the first and second sides of the substrate film and the number of electrically conductive contact elements connect to one or more of the conductive areas of the circuit design while being further configured to electrically couple to an external connecting element responsive to mating the external connecting element with the connector on the first or second side of or adjacent to the substrate film.
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公开(公告)号：US10455702B2
公开(公告)日：2019-10-22
申请号：US16038864
申请日：2018-07-18
Applicant: TactoTek Oy
Inventor： Antti Keranen , Ronald Haag , Mikko Heikkinen
Abstract: A method for manufacturing a multilayer structure includes obtaining a first substrate film for accommodating electronics, providing circuitry on at least the second side of the first substrate film, forming the first substrate film to at least locally or more widely exhibit a selected non-planar three-dimensional shape subsequent to providing at least a portion of the circuitry on the at least the second side of the first substrate film, and melding plastic material on the first side of the first substrate film so as to at least partially cover the first side of the first substrate film.
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公开(公告)号：US20190069408A1
公开(公告)日：2019-02-28
申请号：US15687095
申请日：2017-08-25
Applicant: TactoTek Oy
Inventor： Antti KERANEN , Ronald Haag , Mikko HEIKKINEN
Abstract: Integrated multilayer structure (100, 200, 300, 400, 500, 600, 700) comprising a first substrate film (102) having a first side (102A), said first substrate film comprising electrically substantially insulating material, said first substrate film preferably being formable and optionally thermoplastic, a plastic layer (112) molded onto said first side of the first substrate film so as to at least partially cover it, and circuitry (104, 106, 204, 205), optionally comprising an electronic, electromechanical and/or electro-optical component, provided on the second side of the first substrate film, said circuitry being functionally connected to the first side of the first substrate film.
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