公开(公告)号：US07943001B2

公开(公告)日：2011-05-17

申请号：US11649203

申请日：2007-01-04

Applicant: Takashi Nakagawa ,  Seiichi Sugano ,  Kenji Iida ,  Yasutomo Maehara ,  Hitoshi Suzuki ,  Kaoru Sugimoto ,  Kenji Fukuzono ,  Takashi Kanda ,  Hiroaki Date ,  Tomohisa Yagi

Inventor： Takashi Nakagawa ,  Seiichi Sugano ,  Kenji Iida ,  Yasutomo Maehara ,  Hitoshi Suzuki ,  Kaoru Sugimoto ,  Kenji Fukuzono ,  Takashi Kanda ,  Hiroaki Date ,  Tomohisa Yagi

IPC: H04K3/34

CPC classification number: H05K3/4614 ,  H05K3/321 ,  H05K3/361 ,  H05K3/4069 ,  H05K2201/0218 ,  H05K2203/0425 ,  H05K2203/0568 ,  H05K2203/063 ,  Y10T29/49117

Abstract: A process for producing a multilayer board includes the steps of applying a bonding ink to the terminal of the first substrate, the bonding ink including a thermosetting resin containing a filler and a curing agent, the filler being formed of metal particles plated with solder, the metal particles each having a first melting point, and the solder having a second melting point lower than the first melting point; bonding the second substrate to a bonding sheet composed of a thermosetting resin and having a through hole disposed in a portion corresponding to the terminal of the second substrate; and heating and pressurizing the first and second substrates with the bonding sheet in such a manner that the terminals are opposite each other to effect curing of the bonding sheet and the bonding ink and to form an integral structure.

Abstract translation: 一种制造多层板的方法包括以下步骤：将粘合油墨施加到第一基板的端子上，粘合油墨包括含有填料和固化剂的热固性树脂，填料由镀有焊料的金属颗粒形成， 金属颗粒各自具有第一熔点，并且焊料具有低于第一熔点的第二熔点; 将第二基板接合到由热固性树脂构成的接合片，并且具有设置在与第二基板的端子对应的部分中的通孔; 并且利用接合片以这样的方式对第一和第二基板进行加热和加压，使得端子彼此相对以实现粘合片和粘合油墨的固化并形成一体结构。

公开(公告)号：US20080081553A1

公开(公告)日：2008-04-03

申请号：US11882231

申请日：2007-07-31

Applicant: Takashi Kanda

Inventor： Takashi Kanda

IPC: H04B3/36

CPC classification number: H04W88/085 ,  H04B7/15507 ,  H04W16/26

Abstract: A broadcast wave retransmission system is provided at a low cost, in an extended radio base station system having a master base station for mobile communications and an extended radio base station that is connected to the master base station via a communication line and that has a radio transmitting/receiving function for the mobile communications, by receiving a broadcast wave, superposing a broadcast signal obtained from the received broadcast wave onto a mobile communication signal sent from the master base station to the extended radio base station, transmitting the resultant signal to the extended radio base station, and separating the broadcast signal from the superposed and transmitted signal and retransmitting the resultant signal as a broadcast wave in the extended radio base station.

Abstract translation: 在具有用于移动通信的主基站的扩展无线基站系统和经由通信线路连接到主基站的扩展无线基站中，以低成本提供广播波重发系统，并且具有无线电 通过接收广播波，将从接收到的广播波获得的广播信号叠加到从主基站发送到扩展无线电基站的移动通信信号上，发送/接收功能，将得到的信号发送到扩展 并且将广播信号与叠加和发送的信号分离，并在扩展无线电基站中作为广播波重传所得到的信号。

公开(公告)号：US20080009525A1

公开(公告)日：2008-01-10

申请号：US11888493

申请日：2007-07-31

Applicant: Shogo Sakuma ,  Tomio Yamakawa ,  Takashi Kanda ,  Seiichiro Masui

Inventor： Shogo Sakuma ,  Tomio Yamakawa ,  Takashi Kanda ,  Seiichiro Masui

IPC: A61K31/4439 ,  A61K31/422 ,  C07D263/02 ,  C07D403/00 ,  C07D417/00 ,  C07D413/00 ,  C07D277/04 ,  A61K31/427

CPC classification number: C07D263/62 ,  C07D263/32 ,  C07D277/24

Abstract: A compound represented by the following general formula (I): (wherein R1 represents phenyl, etc. which can have substituents selected from the group consisting of C1-8 alkyl, C1-8 alkyl having halogen, halogen, hydroxyl, etc.; R2 represents C1-8 alkyl, etc.; A represents oxygen, sulfur, etc.; X represents C1-8 alkylene chain, etc.; Y represents C(═O), CH═CH, etc.; R3, R4, and R5 each represents hydrogen, C1-8 alkyl, etc.; B represents CH or nitrogen; Z represents oxygen or sulfur; R6 and R7 each represents hydrogen, C1-8 alkyl, etc.; and R8 represents hydrogen or C1-8 alkyl; provided that at least one of R3, R4, and R5 is not hydrogen) or a salt of the compound; and a PPAR-δ activator which contains the compound or salt as the active ingredient.

Abstract translation: 由以下通式（I）表示的化合物：（其中R 1表示苯基等，其可以具有选自C 1-8烷基的取代基 具有卤素，卤素，羟基等的C 1-8烷基; R 2表示C 1-8烷基等; A 表示氧，硫等; X表示C 1-8亚烷基链等; Y表示C（-O），CH-CH等; R 3 O R 4，R 5和R 5各自表示氢，C 1-8烷基等; B表示CH或氮; Z表示 氧或硫; R 6和R 7各自表示氢，C 1-8烷基等;和R 8， / SUP>表示氢或C 1-8烷基，条件是R 3，R 4和R 4中的至少一个， 5不是氢）或化合物的盐; 和含有该化合物或盐作为活性成分的PPAR-δ活化剂。

公开(公告)号：US07291901B2

公开(公告)日：2007-11-06

申请号：US10803879

申请日：2004-03-19

Applicant: Masateru Koide ,  Misao Umematsu ,  Takashi Kanda ,  Yasuhiro Usui ,  Kenji Fukuzono

Inventor： Masateru Koide ,  Misao Umematsu ,  Takashi Kanda ,  Yasuhiro Usui ,  Kenji Fukuzono

IPC: H01L23/02 ,  H01L23/48

CPC classification number: H01L23/642 ,  H01L21/563 ,  H01L23/3128 ,  H01L23/4006 ,  H01L23/49833 ,  H01L23/50 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/15311 ,  H01L2924/19106 ,  H01L2924/3511 ,  H05K1/0231 ,  H05K1/141 ,  H05K1/182 ,  H05K3/3436 ,  H05K2201/049 ,  H05K2201/09072 ,  H05K2201/1053 ,  H05K2201/10734 ,  H05K2201/10977 ,  H01L2924/00015 ,  H01L2924/00 ,  H01L2224/0401

Abstract: A packaging method, a packaging structure and a package is substrate capable of restraining a warp of a thin film substrate, increasing a product yield, and building up a sufficient cooling capacity in the case of mounting an LSI having a high exothermic quantity. A package substrate 1 of the invention is such that an opening 11 is formed in a first substrate 12, a thin film substrate (a second substrate) 13 is laminated on the first substrate 12, the opening 11 is covered with the thin film substrate 13. Next, a capacitor (a first electronic part) 14 is inserted into the opening 11 and bonded to the thin film substrate, a resin 15 fills an interior of the opening 11 to a fixed or larger thickness and is hardened, the thin film substrate 13 and the capacitor 14 are thereby sustained by the resin 15, an LSI 16 (a second electronic part) that should be connected to the capacitor 14 is bonded to a surface, on an exposed side, of the thin film substrate 13, and the capacitor 14 is connected to the LSI 16.

Abstract translation: 包装方法，包装结构和包装是能够抑制薄膜基板翘曲的基板，提高产品收率，并且在安装具有高放热量的LSI的情况下建立足够的冷却能力的基板。 本发明的封装基板1使得在第一基板12中形成开口11，在第一基板12上层叠薄膜基板（第二基板）13，开口11被薄膜基板13覆盖 。 接下来，将电容器（第一电子部件）14插入到开口11中并且结合到薄膜基板上，树脂15将开口11的内部填充到固定或更大的厚度并被硬化，薄膜基板13 并且电容器14由树脂15维持，应该连接到电容器14的LSI 16（第二电子部件）被接合到薄膜基板13的暴露侧的表面上，并且电容器 14连接到LSI 16。

公开(公告)号：US20070232353A1

公开(公告)日：2007-10-04

申请号：US11455960

申请日：2006-06-20

Applicant: Nao Miyazaki ,  Masanori Hashimoto ,  Hidekazu Kuniyoshi ,  Yasuo Tezuka ,  Kayo Motohashi ,  Satoshi Maruyama ,  Takashi Kanda ,  Tadanori Yokosawa

Inventor： Nao Miyazaki ,  Masanori Hashimoto ,  Hidekazu Kuniyoshi ,  Yasuo Tezuka ,  Kayo Motohashi ,  Satoshi Maruyama ,  Takashi Kanda ,  Tadanori Yokosawa

IPC: H04B1/38

CPC classification number: H04W88/085 ,  H04L45/00 ,  H04W16/26 ,  H04W92/12

Abstract: A plurality of base transceiver stations and at least one extension device are connected, via an IP network that uses internet protocol. The extension device shares resources of the base transceiver stations by arbitrary changing a connection relationship between the base transceiver stations and the extension devices. When a mobile terminal communicates with a core network, the extension device uses the resources of at least one base transceiver stations according to fluctuation in the amount of traffic.

Abstract translation: 经由使用因特网协议的IP网络连接多个基站收发台和至少一个扩展装置。 扩展设备通过任意改变基站收发台与扩展装置之间的连接关系来共享基站收发信机的资源。 当移动终端与核心网络通信时，扩展设备根据业务量的波动使用至少一个基站收发信机的资源。

公开(公告)号：US07268002B2

公开(公告)日：2007-09-11

申请号：US11265107

申请日：2005-11-03

Applicant: Masateru Koide ,  Misao Umematsu ,  Takashi Kanda ,  Yasuhiro Usui ,  Kenji Fukuzono

Inventor： Masateru Koide ,  Misao Umematsu ,  Takashi Kanda ,  Yasuhiro Usui ,  Kenji Fukuzono

IPC: H01L21/66 ,  H01L21/44

CPC classification number: H01L23/642 ,  H01L21/563 ,  H01L23/3128 ,  H01L23/4006 ,  H01L23/49833 ,  H01L23/50 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/15311 ,  H01L2924/19106 ,  H01L2924/3511 ,  H05K1/0231 ,  H05K1/141 ,  H05K1/182 ,  H05K3/3436 ,  H05K2201/049 ,  H05K2201/09072 ,  H05K2201/1053 ,  H05K2201/10734 ,  H05K2201/10977 ,  H01L2924/00015 ,  H01L2924/00 ,  H01L2224/0401

Abstract: A packaging method, a packaging structure and a package is substrate capable of restraining a warp of a thin film substrate, increasing a product yield, and building up a sufficient cooling capacity in the case of mounting an LSI having a high exothermic quantity. A package substrate 1 of the invention is such that an opening 11 is formed in a first substrate 12, a thin film substrate (a second substrate) 13 is laminated on the first substrate 12, the opening 11 is covered with the thin film substrate 13. Next, a capacitor (a first electronic part) 14 is inserted into the opening 11 and bonded to the thin film substrate, a resin 15 fills an interior of the opening 11 to a fixed or larger thickness and is hardened, the thin film substrate 13 and the capacitor 14 are thereby sustained by the resin 15, an LSI 16 (a second electronic part) that should be connected to the capacitor 14 is bonded to a surface, on an exposed side, of the thin film substrate 13, and the capacitor 14 is connected to the LSI 16.

公开(公告)号：US20070027196A1

公开(公告)日：2007-02-01

申请号：US11544505

申请日：2006-10-06

Applicant: Shogo Sakuma ,  Tomio Yamakawa ,  Takashi Kanda ,  Seiichiro Masui

Inventor： Shogo Sakuma ,  Tomio Yamakawa ,  Takashi Kanda ,  Seiichiro Masui

IPC: A61K31/427 ,  A61K31/422 ,  C07D417/02 ,  C07D413/02

CPC classification number: C07D403/06 ,  A61K31/00 ,  A61K31/423 ,  A61K31/427 ,  A61K31/454 ,  C07D405/06 ,  C07D409/06 ,  C07D413/06 ,  C07D413/12 ,  C07D413/14 ,  C07D417/06 ,  C07D417/12 ,  C07D417/14

Abstract: A compound represented by the formula (I) or a salt of the compound, and a PPAR-δ activator which contains the compound or salt as the active ingredient: (wherein A represents O or S; B1 represents N, etc.; B2 represents O, etc.; each of X1 and X2 represents O, S, a bond, etc.; Y represents C1-8 alkylene chain; z represents O or S; R1 represents aryl, etc. which can have substituents; R2 represents C1-8 alkyl, etc.; R3 represents C1-8 alkyl, C2-8 alkenyl, etc.; each of R4 and R5 represents hydrogen, C1-8 alkyl, etc.; and R6 represents hydrogen, etc.; provided that each of Z and R3 is attached to the benzene ring, and X2 is not attached to the benzene ring).

Abstract translation: 由式（I）表示的化合物或化合物的盐和含有该化合物或盐作为活性成分的PPAR-δ活化剂：（其中A表示O或S; B < 表示N等; B 2表示O等; X 1和X 2各自表示O，S，键， Y表示C 1-8亚烷基链; z表示O或S; R 1表示可具有取代基的芳基等; R 2， / SUP表示C 1-8烷基等; R 3表示C 1-8烷基，C 2-8 链烯基等; R 4和R 5各自代表氢，C 1-8烷基等;和 R 6表示氢等;条件是Z和R 3各自连接到苯环上，并且X 2不连接 到苯环）。

公开(公告)号：US07119104B2

公开(公告)日：2006-10-10

申请号：US10491935

申请日：2002-10-09

Applicant: Shogo Sakuma ,  Tomio Yamakawa ,  Takashi Kanda ,  Seiichiro Masui

Inventor： Shogo Sakuma ,  Tomio Yamakawa ,  Takashi Kanda ,  Seiichiro Masui

IPC: C07D413/06 ,  C07D413/14 ,  C07D417/06 ,  A61K31/4178 ,  A61K31/423 ,  A61K31/427

CPC classification number: C07D403/06 ,  A61K31/00 ,  A61K31/423 ,  A61K31/427 ,  A61K31/454 ,  C07D405/06 ,  C07D409/06 ,  C07D413/06 ,  C07D413/12 ,  C07D413/14 ,  C07D417/06 ,  C07D417/12 ,  C07D417/14

Abstract: A compound represented by the formula (I) or a salt of the compound, and a PPAR-δ activator which contains the compound or salt as the active ingredient: (wherein A represents O or S; B1 represents N, etc.; B2 represents O, etc.; each of X1 and X2 represents O, S, a bond, etc.; Y represents C1-8 alkylene chain; Z represents O or S; R1 represents aryl, etc. which can have substituents; R2 represents C1-8 alkyl, etc.; R3 represents C1-8 alkyl, C2-8 alkenyl, etc.; each of R4 and R5 represents hydrogen, C1-8 alkyl, etc.; and R6 represents hydrogen, etc.; provided that each of Z and R3 is attached to the benzene ring, and X2 is not attached to the benzene ring).

Abstract translation: 由式（I）表示的化合物或化合物的盐和含有该化合物或盐作为活性成分的PPAR-δ活化剂：（其中A表示O或S; B < 表示N等; B 2表示O等; X 1和X 2各自表示O，S，键， Y表示C 1-8亚烷基链; Z表示O或S; R 1表示可具有取代基的芳基等; R 2， / SUP表示C 1-8烷基等; R 3表示C 1-8烷基，C 2-8 链烯基等; R 4和R 5各自代表氢，C 1-8烷基等;和 R 6表示氢等;条件是Z和R 3各自连接到苯环上，并且X 2不连接 到苯环）。

公开(公告)号：US20050266213A1

公开(公告)日：2005-12-01

申请号：US10998062

申请日：2004-11-29

Applicant: Takashi Kanda ,  Kenji Fukuzono ,  Manabu Watanabe

Inventor： Takashi Kanda ,  Kenji Fukuzono ,  Manabu Watanabe

IPC: H05K1/09 ,  B32B3/00 ,  H05K1/00 ,  H05K1/11 ,  H05K3/32 ,  H05K3/40 ,  H05K3/46

CPC classification number: H05K3/462 ,  H05K3/321 ,  H05K3/4069 ,  H05K3/4602 ,  H05K2201/0218 ,  H05K2201/068 ,  H05K2203/0425 ,  Y10T29/49126 ,  Y10T428/24917

Abstract: A layered board includes a core layer that serves as a printed board, a buildup layer that is electrically connected to the core layer, the buildup layer including an insulation part and a wiring part, and a junction layer that electrically connects and bonds the core layer with the buildup layer, wherein the junction layer includes an adhesive and metallic particles contained in the adhesive, wherein each of the metallic particles has a first melting point, serves as a filler, and is plated with solder having a second melting point lower than the first melting point.

Abstract translation: 分层板包括用作印刷电路板的芯层，与芯层电连接的积层，积层层包括绝缘部分和布线部分，以及将芯层电连接和结合的接合层 其中所述接合层包括粘合剂和包含在所述粘合剂中的金属颗粒，其中所述金属颗粒具有第一熔点，用作填料，并且镀有第二熔点低于所述粘合剂的焊料 第一熔点

公开(公告)号：US06959125B2

公开(公告)日：2005-10-25

申请号：US10341437

申请日：2003-01-14

Applicant: Takashi Kanda ,  Kiyotaka Seyama ,  Kaoru Sugimoto ,  Souichi Obata ,  Yasutomo Maehara

Inventor： Takashi Kanda ,  Kiyotaka Seyama ,  Kaoru Sugimoto ,  Souichi Obata ,  Yasutomo Maehara

IPC: G02B6/42 ,  G02B6/43 ,  G02B6/12

CPC classification number: G02B6/43 ,  G02B6/42 ,  H01L2224/48091 ,  H01L2224/73257 ,  H01L2924/00014

Abstract: It is an object of the present invention to enhance laser beam transmitting efficiency by accurately controlling an interval between a light emitting (light receiving) element (20) and an optical wave-guide substrate (1) without causing any fluctuation in the interval in a mounting structure of the light transmitting element in which the light emitting (light receiving) element (20) is mounted on the optical wave-guide substrate (1). When the light emitting (light receiving) element is joined to the sub-mount chip (4) and when the sub-mount chip (4) is joined to the optical wave-guide while the element is being directed to the substrate side, the sub-mount chip and the optical wave-guide substrate are joined to each other by the solder bump (6). A post (5) is arranged for regulating an interval between the light emitting (light receiving) element and the optical wave-guide substrate.

Abstract translation: 本发明的目的是通过精确地控制发光（光接收）元件（20）和光波导基板（1）之间的间隔而不会引起在 其中发光（光接收）元件（20）安装在光波导基板（1）上的透光元件的安装结构。 当发光（光接收）元件接合到子安装芯片（4）时，并且当元件被引导到基板侧时，子安装芯片（4）接合到光波导上时， 副安装芯片和光波导基板通过焊料凸块（6）相互连接。 布置用于调节发光（光接收）元件和光波导基板之间的间隔的柱（5）。