公开(公告)号：US20100165048A1

公开(公告)日：2010-07-01

申请号：US12346698

申请日：2008-12-30

Applicant: Gregory DeBrabander ,  Mark Nepomnishy

Inventor： Gregory DeBrabander ,  Mark Nepomnishy

IPC: B41J2/16 ,  H01L21/302

CPC classification number: B41J2/161 ,  B41J2/162 ,  B41J2/1623 ,  B41J2/1628 ,  B41J2/1629 ,  B41J2/1631 ,  B41J2/1632 ,  B41J2/1642 ,  B81B2201/052 ,  B81C1/00087

Abstract: Fluid ejection nozzles having a tapered section leading to a straight walled bore are described. Both the tapered section of the nozzle and the straight walled bore are formed from a single side of semiconductor layer so that the tapered section and the bore are aligned with one another, even when an array of nozzles are formed across a die and multiple dies are formed on a semiconductor substrate.

Abstract translation: 描述了具有导向直壁的锥形部分的流体喷射嘴。 喷嘴的锥形部分和直壁孔均由半导体层的单侧形成，使得锥形部分和孔彼此对准，即使在模具之间形成喷嘴阵列并且多个模具是 形成在半导体衬底上。

公开(公告)号：US20090032935A1

公开(公告)日：2009-02-05

申请号：US11831699

申请日：2007-07-31

Applicant: Siddhartha Bhowmik ,  Steven E. Kelly

Inventor： Siddhartha Bhowmik ,  Steven E. Kelly

IPC: H01L23/12 ,  B41J2/05 ,  H01L21/02

CPC classification number: B81B3/0072 ,  B41J2/1601 ,  B41J2/1628 ,  B41J2/1629 ,  B41J2/1642 ,  B81B2201/052

Abstract: Embodiments of a semiconductor device are disclosed.

Abstract translation: 公开了半导体器件的实施例。

公开(公告)号：US07464465B2

公开(公告)日：2008-12-16

申请号：US11246682

申请日：2005-10-11

Applicant: Kia Silverbrook

Inventor： Kia Silverbrook

IPC: B21D51/16 ,  G01D15/00 ,  B41J2/14

CPC classification number: B41J2/1404 ,  B41J2/1603 ,  B41J2/162 ,  B41J2/1628 ,  B41J2/1631 ,  B41J2/1639 ,  B41J2/1642 ,  B41J2/1645 ,  B41J2002/14403 ,  B41J2002/14475 ,  B81B3/0013 ,  B81B2201/052 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/4916 ,  Y10T29/49401 ,  Y10T29/49432

Abstract: A method of forming a low-stiction nozzle plate for an inkjet printhead, said nozzle plate having a plurality of nozzle apertures defined therein, each nozzle aperture having a respective nozzle rim, said method comprising the steps of: (a) providing a partially-fabricated printhead comprising a plurality of inkjet nozzle assemblies sealed with roof material; (b) etching partially into said roof material to define simultaneously said nozzle rims and a plurality of stiction-reducing formations; and (c) etching through said roof material to define said nozzle apertures, thereby forming said nozzle plate.

Abstract translation: 一种形成用于喷墨打印头的低粘度喷嘴板的方法，所述喷嘴板具有限定在其中的多个喷嘴孔，每个喷嘴孔具有相应的喷嘴边缘，所述方法包括以下步骤：（a） 制造的打印头包括用屋顶材料密封的多个喷墨喷嘴组件; （b）部分地蚀刻到所述屋顶材料中以同时限定所述喷嘴边缘和多个减少静电的地层; 和（c）通过所述屋顶材料蚀刻以限定所述喷嘴孔，从而形成所述喷嘴板。

公开(公告)号：US07432582B2

公开(公告)日：2008-10-07

申请号：US11012603

申请日：2004-12-14

Applicant: Diane Lai ,  Samson Berhane ,  Barry C. Snyder ,  Ronald A. Hellekson ,  Hubert Vander Plas

Inventor： Diane Lai ,  Samson Berhane ,  Barry C. Snyder ,  Ronald A. Hellekson ,  Hubert Vander Plas

IPC: H01L29/06

CPC classification number: B41J2/16 ,  B41J2/1628 ,  B41J2/1629 ,  B41J2/1631 ,  B41J2/1634 ,  B41J2/1642 ,  B41J2/1643 ,  B41J2/1646 ,  B41J2202/18 ,  B81B7/0006 ,  B81B2201/052 ,  H01L21/76898 ,  H01L23/481 ,  H01L2924/0002 ,  H05K1/112 ,  H05K2201/09518 ,  H01L2924/00

Abstract: A method of manufacturing a microelectronics device is provided, wherein the microelectronics device is formed on a substrate having a frontside and a backside. The method comprises forming a circuit element on the frontside of the substrate from a plurality of layers deposited on the frontside of the substrate, wherein the plurality of layers includes an intermediate electrical contact layer, and forming an interconnect structure after forming the electrical contact layer. The interconnect structure includes a contact pad formed on the backside of the substrate, and a through-substrate interconnect in electrical communication with the contact pad, wherein the through-substrate interconnect extends from the backside of the substrate to the electrical contact layer.

Abstract translation: 提供了一种制造微电子器件的方法，其中微电子器件形成在具有前侧和背侧的衬底上。 该方法包括从沉积在基板的前侧上的多个层在基板的前侧形成电路元件，其中多个层包括中间电接触层，以及在形成电接触层之后形成互连结构。 所述互连结构包括形成在所述衬底的背面上的接触焊盘以及与所述接触焊盘电连通的贯穿衬底互连，其中所述贯通衬底互连件从所述衬底的背面延伸到所述电接触层。

公开(公告)号：US07338611B2

公开(公告)日：2008-03-04

申请号：US10793317

申请日：2004-03-03

Applicant: Jeffrey R. Pollard ,  Michael D. Miller

Inventor： Jeffrey R. Pollard ,  Michael D. Miller

IPC: G01D15/00

CPC classification number: B81C1/00087 ,  B41J2/1603 ,  B41J2/1628 ,  B41J2/1629 ,  B41J2/1631 ,  B41J2/1634 ,  B81B2201/052

Abstract: The described embodiments relate to slotted substrates and methods of forming same. One exemplary method forms a first slot portion into a first surface of a substrate, the first slot portion defining a footprint at the first surface. The method also forms a second slot portion through the first slot portion; and, forms a third slot portion through a second surface of the substrate sufficiently to intercept the second slot portion to form a fluid-handling slot through the substrate.

Abstract translation: 所描述的实施例涉及开槽衬底及其形成方法。 一种示例性方法形成到衬底的第一表面中的第一槽部分，第一槽部分在第一表面处限定占地面积。 该方法还通过第一槽部分形成第二槽部分; 并且通过所述基板的第二表面形成足以拦截所述第二槽部分以形成通过所述基板的流体处理槽的第三槽部分。

公开(公告)号：US07271104B2

公开(公告)日：2007-09-18

申请号：US11170895

申请日：2005-06-30

Applicant: David L. Bernard ,  John W. Krawczyk ,  Andrew L. McNees

Inventor： David L. Bernard ,  John W. Krawczyk ,  Andrew L. McNees

IPC: H01L21/302 ,  H01L21/462

CPC classification number: B41J2/1603 ,  B41J2/1628 ,  B81B2201/052 ,  B81C1/00087

Abstract: A method of micro-machining a semiconductor substrate to form one or more through slots therein. The semiconductor substrate has a device side and a fluid side opposite the device side. The method includes diffusing a p-type doping material into the device side of the semiconductor substrate in one or more through slot locations to be etched through a thickness of the substrate. The semiconductor substrate is then etched with a dry etch process from the device side of the substrate to the fluid side of the substrate so that one or more through slots having a reentrant profile are formed in the substrate.

公开(公告)号：US20070082422A1

公开(公告)日：2007-04-12

申请号：US11246684

申请日：2005-10-11

Applicant: Kia Silverbrook

Inventor： Kia Silverbrook

IPC: H01L21/00

CPC classification number: B81C1/00142 ,  B41J2/1404 ,  B41J2/1601 ,  B41J2/1628 ,  B41J2/1631 ,  B41J2/1639 ,  B41J2/1642 ,  B41J2/1645 ,  B41J2002/14403 ,  B41J2002/14475 ,  B41J2202/11 ,  B81B2201/052

Abstract: A method of fabricating a suspended beam in a MEMS process, said method comprising the steps of: (a) etching a pit in a substrate, said pit having a base and sidewalls; (b) depositing sacrificial material on a surface of said substrate so as to fill said pit; (c) removing said sacrificial material from a perimeter region within said pit and from said substrate surface surrounding said pit; (d) reflowing remaining sacrificial material within said pit such that said remaining sacrificial material contacts said sidewalls; (e) depositing beam material on said substrate surface and on said reflowed sacrificial material; and (f) removing said reflowed sacrificial material to form said suspended beam.

Abstract translation: 一种在MEMS工艺中制造悬挂梁的方法，所述方法包括以下步骤：（a）蚀刻衬底中的凹坑，所述凹坑具有基底和侧壁; （b）在所述衬底的表面上沉积牺牲材料以填充所述凹坑; （c）从所述凹坑内的周边区域和围绕所述凹坑的所述衬底表面去除所述牺牲材料; （d）在所述凹坑内回流剩余的牺牲材料，使得所述剩余的牺牲材料接触所述侧壁; （e）在所述衬底表面和所述回流牺牲材料上沉积梁材料; 和（f）去除所述回流牺牲材料以形成所述悬挂梁。

公开(公告)号：US20070081028A1

公开(公告)日：2007-04-12

申请号：US11246711

申请日：2005-10-11

Applicant: Kia Silverbrook

Inventor： Kia Silverbrook

IPC: B41J2/16

CPC classification number: B41J2/1606 ,  B41J2/1433 ,  B81B3/001 ,  B81B2201/052

Abstract: An inkjet printhead with a nozzle plate that has an exterior surface with formations for reducing its co-efficient of static friction. By reducing the co-efficient of static friction, there is less likelihood that paper dust or other contaminants will clog the nozzles in the nozzle plate. Static friction, or “stiction” as it has become known, allows dust particles to “stick” to nozzle plates and thereby clog nozzles. By patterning the exterior of the nozzle plate with raised formations, dust particles can only contact the outer extremities of each formation. This reduces friction between the particles and the nozzle plate so that any particles that contact the plate are less likely to attach, and if they do attach, they are more likely to be removed by printhead maintenance cleaning cycles.

Abstract translation: 具有喷嘴板的喷墨打印头，其具有用于降低其静摩擦系数的地层的外表面。 通过降低静摩擦的有效性，纸屑或其他污染物将堵塞喷嘴板中的喷嘴的可能性较小。 静摩擦或“静摩擦”已经知道，使得灰尘颗粒“粘”到喷嘴板上，从而阻塞喷嘴。 通过用凸起的地层图案化喷嘴板的外部，灰尘颗粒只能接触每个地层的外部末端。 这减少了颗粒和喷嘴板之间的摩擦，使得接触板的任何颗粒不太可能附着，并且如果它们附着，则它们更可能通过打印头维护清洁循环被去除。

公开(公告)号：US20070079509A1

公开(公告)日：2007-04-12

申请号：US11246682

申请日：2005-10-11

Applicant: Kia Silverbrook

Inventor： Kia Silverbrook

IPC: B21K21/08

CPC classification number: B41J2/1404 ,  B41J2/1603 ,  B41J2/162 ,  B41J2/1628 ,  B41J2/1631 ,  B41J2/1639 ,  B41J2/1642 ,  B41J2/1645 ,  B41J2002/14403 ,  B41J2002/14475 ,  B81B3/0013 ,  B81B2201/052 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/4916 ,  Y10T29/49401 ,  Y10T29/49432

Abstract: A method of forming a low-stiction nozzle plate for an inkjet printhead, said nozzle plate having a plurality of nozzle apertures defined therein, each nozzle aperture having a respective nozzle rim, said method comprising the steps of: (a) providing a partially-fabricated printhead comprising a plurality of inkjet nozzle assemblies sealed with roof material; (b) etching partially into said roof material to define simultaneously said nozzle rims and a plurality of stiction-reducing formations; and (c) etching through said roof material to define said nozzle apertures, thereby forming said nozzle plate.

Abstract translation: 一种形成用于喷墨打印头的低粘度喷嘴板的方法，所述喷嘴板具有限定在其中的多个喷嘴孔，每个喷嘴孔具有相应的喷嘴边缘，所述方法包括以下步骤：（a） 制造的打印头包括用屋顶材料密封的多个喷墨喷嘴组件; （b）部分地蚀刻到所述屋顶材料中以同时限定所述喷嘴边缘和多个减少静电的地层; 和（c）通过所述屋顶材料蚀刻以限定所述喷嘴孔，从而形成所述喷嘴板。

公开(公告)号：US07155911B2

公开(公告)日：2007-01-02

申请号：US11107787

申请日：2005-04-18

Applicant: Kia Silverbrook

Inventor： Kia Silverbrook

IPC: F01B29/10

CPC classification number: B41J2/1645 ,  B41J2/14427 ,  B41J2/1623 ,  B41J2/1626 ,  B41J2/1631 ,  B41J2/1639 ,  B41J2/1648 ,  B81B3/007 ,  B81B2201/031 ,  B81B2201/036 ,  B81B2201/052 ,  Y10T29/42 ,  Y10T29/49083 ,  Y10T29/49401

Abstract: A thermal bend actuator (6) is provided with a group of upper arms (23, 25, 26) and a group of lower arms (27, 28) which are non planar, so increasing the stiffness of the arms. The arms (23, 25, 26,27,28) may be spaced transversely of each other and do not overly each other in plan view, so enabling all arms to be formed by depositing a single layer of arm forming material

Abstract translation: 热弯曲致动器（6）设置有一组上臂（23,25,26）和一组非平面的下臂（27,28），因此增加了臂的刚度。 臂（23,25,26,27,28）可以彼此横向间隔开，并且在平面图中不会彼此过多，因此能够通过沉积单层臂形成材料来形成所有臂