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    Self-adhesive joint and adhesion method
    42.
    发明申请
    Self-adhesive joint and adhesion method 审中-公开
    自粘接头和粘接方法

    公开(公告)号：US20060078702A1

    公开(公告)日：2006-04-13

    申请号：US11227121

    申请日：2005-09-16

    Applicant: Philippe Velard

    Inventor： Philippe Velard

    IPC: B32B33/00

    CPC classification number: B60J10/34 ,  C09J7/38 ,  C09J2201/134 ,  C09J2483/00 ,  Y10T428/14

    Abstract: The present invention relates to a self-adhesive sealant for sealing a silicone element onto an application site, comprising: a support; a layer of adhesive on that side of the support which is intended to come into contact with the application site; and a layer of an ultraviolet-curable silicone bonding agent on that side of the support which is intended to come into contact with the silicone element. It also relates to a silicone element provided with such a sealant and to a method of applying adhesive to a silicone element using this sealant.

    Abstract translation: 本发明涉及一种用于将硅树脂元件密封到施加部位上的自粘合密封剂，包括：支撑体; 在该支撑体的该一侧的粘合剂层旨在与施加部位接触; 以及在与硅树脂元件接触的支撑体的该侧上的一层可紫外固化的硅氧烷粘合剂。 它还涉及一种设置有这种密封剂的硅树脂元件以及使用该密封剂将粘合剂施加到硅树脂元件的方法。

    Two-sided lamination tape for use in see through mounting
    43.
    发明申请
    Two-sided lamination tape for use in see through mounting 审中-公开
    双面胶带用于透视安装

    公开(公告)号：US20040081788A1

    公开(公告)日：2004-04-29

    申请号：US10690676

    申请日：2003-10-22

    Inventor： Michael Sudofsky

    IPC: B32B009/00

    CPC classification number: C09J7/22 ,  C09J7/35 ,  C09J7/38 ,  C09J2201/134 ,  C09J2201/606 ,  C09J2201/61 ,  C09J2423/00 ,  C09J2431/00 ,  C09J2433/00 ,  Y10T428/14

    Abstract: A two-sided lamination tape for high quality face mounting of graphics. The tape has a very clear thermally activated adhesive surface on one side of a support film and a perfectly clear pressure sensitive adhesive on the other side. The tape is laminated to the image surface of a graphic by means of the clear, thermally activated surface. The laminated graphic can then be face mounted by means of the perfectly clear, tacky pressure sensitive adhesive side. The tacky, pressure sensitive adhesive allows momentary repositioning, giving the graphic user the ability to correct and smooth the mounted graphic. In the preferred embodiment, there is also a removable, protective film liner. This protective film allows storage of the laminated graphic and is peeled off just prior to use to expose the PSA layer.

    Abstract translation: 双面胶带，用于高质量的图形安装。 胶带在支撑膜的一侧具有非常清晰的热活化粘合剂表面，另一侧具有完全透明的压敏粘合剂。 通过透明的热激活表面将胶带层压到图形的图像表面上。 然后可以通过完全透明，粘性的压敏粘合剂侧将层压图形面部安装。 粘性压敏粘合剂允许瞬时重新定位，使图形用户能够校正和平滑安装的图形。 在优选实施例中，还有可拆卸的保护膜衬里。 该保护膜允许层压图形的存储，并且在使用之前剥离以暴露PSA层。

    Continuous two-stage preparation of solvent-free polyacrylate hotmelt PSAs
    45.
    发明申请
    Continuous two-stage preparation of solvent-free polyacrylate hotmelt PSAs 有权
    无溶剂聚丙烯酸酯热熔体PSA的连续两阶段制备

    公开(公告)号：US20040024111A1

    公开(公告)日：2004-02-05

    申请号：US10436864

    申请日：2003-05-13

    Inventor： Marc Husemann ,  Stephan Zollner ,  Klaus Massow ,  Frank Henke

    IPC: C08L031/00

    CPC classification number: C09J133/08 ,  C08F6/10 ,  C09J7/385 ,  C09J2201/122 ,  C09J2201/134 ,  Y10S526/931 ,  Y10S526/935 ,  C08L33/08

    Abstract: In a continuous two-stage process for preparing solvent-free polyacrylate hotmelt pressure sensitive adhesives which is gentle on the polymer and redeploys the solvent used in the process the following steps are carried out: polymerizing a self-adhesive pressure sensitive adhesive in solution, the solvent having a low vapor pressure; continuously mixing the polymer solution with antioxidants and preheating the mixture under superatmospheric pressure without boiling it; concentrating the polymer solution to a residual solvent content of less than 0.1% by weight in a concentrating extruder under the effect of reduced pressure and elevated temperatures; condensing, collecting, and re-using the solvent stripped off in the extruder; compounding the abovementioned solvent-freed hotmelt pressure sensitive adhesive with tackifying resins, fillers, stabilizers, crosslinkers or other additives in a second extruder at a moderate melt temperature; transferring the blended solvent-free self-adhesive pressure sensitive adhesive to a downstream coating unit.

    Abstract translation: 在制备无溶剂的聚丙烯酸酯热熔压敏粘合剂的连续两阶段方法中，该粘合剂在聚合物上温和并重新部署该方法中使用的溶剂，进行以下步骤：在溶液中聚合自粘压敏粘合剂， 溶剂蒸气压低; 将聚合物溶液与抗氧化剂连续混合，并在超大气压下预热混合物而不煮沸; 在浓缩挤出机中在减压和升高的温度下将聚合物溶液浓缩至小于0.1重量％的残留溶剂含量; 冷凝，收集和重新使用在挤出机中剥离的溶剂; 在第二挤出机中以适度的熔融温度将上述溶剂自由热熔压敏粘合剂与增粘树脂，填料，稳定剂，交联剂或其它添加剂混合; 将混合无溶剂的自粘合压敏粘合剂转移到下游涂布单元。

    Adhesive bonding of printed circuit boards to heat sinks
    46.
    发明申请
    Adhesive bonding of printed circuit boards to heat sinks 审中-公开
    印刷电路板粘接到散热片上

    公开(公告)号：US20030019562A1

    公开(公告)日：2003-01-30

    申请号：US10247385

    申请日：2002-09-19

    Inventor： Kunno John Warn

    IPC: B32B031/00

    CPC classification number: H05K3/0061 ,  C09J5/06 ,  C09J7/22 ,  C09J7/35 ,  C09J7/38 ,  C09J2201/128 ,  C09J2201/134 ,  C09J2201/36 ,  C09J2201/606 ,  C09J2201/61 ,  H05K3/386 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2203/0278

    Abstract: Voids (26) at the interface of a printed circuit board (10) bonded to a heat sink (24) which impede heat transfer from a heat generating electronic component (12) mounted on the printed circuit board (10) to the heat sink (24), and thus limit the density of electronic components (12) that may be mounted to a given printed circuit board (10) are avoided by a method wherein the adhesive securing the printed circuit board (10) to the heat sink (24) is formed of a pressure sensitive adhesive layer (22) and a thermosetting adhesive layer (28). The latter fills the voids and thus provides for greater thermal conductivity from a heat generating component (12) to the heat sink (24) with the result in increase in heat rejection (30).

    Abstract translation: 在印刷电路板（10）的接合到散热器（24）的界面处的空隙（26），其阻止从安装在印刷电路板（10）上的发热电子部件（12）到散热器 24），并且因此通过其中将印刷电路板（10）固定到散热器（24）的粘合剂的方法避免了可以安装到给定印刷电路板（10）的电子部件（12）的密度， 由粘合剂层（22）和热固性粘合剂层（28）形成。 后者填充空隙，从而提供从发热部件（12）到散热器（24）的更高的导热性，从而导致散热（30）的增加。

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