Abstract:
A cold-cathode discharge device for emitting light. The device has a fluorescent tube and electrodes containing R.sub.2 O.sub.3-z (where R is an atom or an atom group of rare earth elements, O is oxygen, and z is 0.0 to 1.0). The electrodes are made by oxidation of the rare earth elements under an atmosphere in which oxygen and/or oxygen-containing substance is 1% or less by volume, in order to control the stoichiometry of the oxide.
Abstract translation:一种用于发光的冷阴极放电装置。 该装置具有荧光管和含有R 2 O 3 -z的电极(其中R为稀土元素的原子或原子团,O为氧,z为0.0〜1.0)。 为了控制氧化物的化学计量,在氧和/或含氧物质为1体积%以下的气氛下,通过稀土元素的氧化来制造电极。
Abstract:
A field emitter element comprising a bottom layer of material shaping the overall emitter element, and a top layer of low work function material or otherwise of high electron emissivity characteristic. The low work function top layer preferably is shaped to a sharp point. The bottom layer may be formed of a material such as tantalum, molybdenum, gold, or silicon (or alloys thereof), and the top layer may be formed of a material such as Cr.sub.3 Si, Cr.sub.3 Si.sub.2, CrSI.sub.2, Nb.sub.3 Si.sub.2, Nb, Cr.sub.2 O.sub.3 or SiC. In a specific aspect, at least one of the first and second emitter materials is chromium oxide (Cr.sub.2 O.sub.3). In another variant, the first emitter material is an insulator of leaky dielectric, e.g., SiO with a 10-60% Cr by weight based on the weight of SiO, and the second emitter material is SiO+50-90% Cr by weight, based on the weight of SiO.
Abstract translation:场致发射体元件包括形成整个发射体元件的底层材料,以及低功函数材料的顶层或具有高电子发射率特性的顶层。 低功函数顶层优选成形为尖锐点。 底层可以由诸如钽,钼,金或硅(或其合金)的材料形成,并且顶层可以由诸如Cr 3 Si,Cr 3 Si 2,CrSi 2,Nb 3 Si 2,Nb,Cr 2 O 3或SiC的材料形成 。 在具体方面,第一和第二发射体材料中的至少一个是氧化铬(Cr 2 O 3)。 在另一个变型中,第一发射极材料是漏电介质的绝缘体,例如,以SiO的重量为基准的重量为10-60%的Cr的SiO,第二发射极材料为SiO + 50-90%Cr, 基于SiO的重量。
Abstract:
A field emitter including an exposed wide band gap emission area in contact with and protruding from a planar surface of a conductive metal, and a method of making is disclosed. Suitable wide band gap materials (2.5-7.0 electron-volts) include diamond, aluminum-nitride and gallium-nitride; suitable conductive metals include titanium, tungsten, gold and graphite. The method includes disposing the wide band gap material on a substrate, disposing the conductive metal on the wide band gap material, and etching the conductive metal to expose wide band gap emission areas. The emission areas are well suited for large area flat panel displays.
Abstract:
A field-emission structure suitable for large-area flat-panel televisions centers around an insulating porous layer that overlies a lower conductive region situated over insulating material of a supporting substrate. Electron-emissive filaments occupy pores extending through the porous layer. A conductive gate layer through which openings extend at locations centered on the filaments typically overlies the porous layer. Cavities are usually provided in the porous layer along its upper surface at locations likewise centered on the filaments.
Abstract:
A field emitter device includes a column conductor, an insulator, and a resistor structure for advantageously limiting current in a field emitter array. A wide column conductor is deposited on an insulating substrate. An insulator is laid over the column conductor. A high resistance layer is placed on the insulator and is physically isolated from the column conductor. The high resistance material may be chromium oxide or 10%-50% wt % Cr+SiO. A group of microtip electron emitters is placed over the high resistance layer. A low resistance strap interconnects the column conductor with the high resistance layer to connect in an electrical series circuit the column conductor, the high resistance layer, and the group of electron emitters. One or more layers of insulator and a gate electrode, all with cavities for the electron emitters, are laid over the high resistance material. One layer of insulator is selected from a group of materials including SiC, SiO, and Si.sub.3 N.sub.4. An anode plate is attached with intermediate space between the anode plate and the microtip electron emitters being evacuated.
Abstract:
A field emission type electron source capable of permitting a resistance value between a cathode wiring and each of emitter cones to be set at substantially the same level and increasing packaging density of the emitter cones. The electron source includes stripe-like cathode wirings arranged on an insulating substrate. The cathode wirings each are formed with a plurality of windows, so that a plurality of island-like cathode conductors and resistance layers different in resistance value from each other are formed separate from the cathode wiring. Then, a resistance layer, an insulating layer and a gate electrode are formed thereon. The gate electrode and insulating layer are formed with apertures in a manner to be common to both, in which the emitter cones are arranged, resulting in emission of electrons from the emitter cones of each group unit being rendered uniform.
Abstract:
A cold electron emitting device has an emitter base portion, an emitter projection portion and a source region, each of which is an n-type semiconductor, formed on a p-type silicon substrate. A metal film which serves as an extraction electrode and a gate electrode of FET is formed via an insulating layer on the region of the substrate which includes the peripheral regions of the emitter base portion and source region. This cold electron emitting device can be manufactured as follows. First, a conical emitter having an emitter projection portion and emitter base portion and a source region are formed on a p-type semiconductor substrate. Next, an insulating layer and a metal film, which becomes an extraction electrode and a gate electrode of FET, is formed on the substrate which includes peripheral regions of the emitter base portion and source region. Then, an n-type impurity is doped in the emitter and the source region to form an n-type emitter and an n-type source region. In this manner, it is possible to manufacture a cold electron emitting device, which has an excellent work precision for the sharp tip of the emitter projection portion and an excellent uniform structure and can stably emit a current.
Abstract:
A field emitter is disclosed comprising a graded electron affinity surface ayer. The graded electron affinity layer provides for increased transconductance, reduced energy distribution of emitted electrons, reduced noise and increased uniformity in its operation.
Abstract:
A micropoint assembly of a field emission device ("FED") including a baseplate, one or more conductors formed over the baseplate, and one or more micropoints formed over the conductor(s) is disclosed. The micropoint assembly further includes resistive structures associated with specific FED elements that limit current to a maximum level and minimize impact to remaining elements of the device. Any variation in resistivity is uniformly distributed since the same process is consistently applied across a plurality of element locations.
Abstract:
The invention relates to the structure of a field emitter device, to the method of fabricating a field emitter device and to the use of the field emitter device in the technical field of flat panel displays. The field emission device comprises an array (1) of widely-spaced tips (2) for emitting electrons and a perforated extracting electrode (3) facing the array of tips. An individual series resistor is formed by each of said tips itself. The widely-spaced tips are not surrounded by a layer of electrically insulating material. The tips are not surrounded by an insulating layer and the tip end is not surrounded by a gate or extraction electrode. This avoids failures like shorts between the cathode electrode and the gate or extraction electrode which could occur due to inaccurate coating or etching processes, and enhances the reliability and the life-time of the array of tips. To fabricate the field emission device, a micromechanically manufactured array (1) of widely-spaced tips (2) and a micromechanically manufactured perforated extracting electrode (3) are provided. The outer sides of the perforated extracting electrode are bonded to the array in a way that the perforated extracting electrode is facing the array. With the array of widely-spaced tips and the perforated extracting electrode being fabricated separately and bonded together subsequently, both the number of process steps required for each of the two parts and the manufacturing process costs are reduced.