公开(公告)号：US20130126217A1

公开(公告)日：2013-05-23

申请号：US13643051

申请日：2011-04-19

Applicant: Mao Yamaguchi ,  Tetsuya Arisawa ,  Syunji Araki ,  Keiko Kashihara ,  Takashi Sagara ,  Lin Lin

Inventor： Mao Yamaguchi ,  Tetsuya Arisawa ,  Syunji Araki ,  Keiko Kashihara ,  Takashi Sagara ,  Lin Lin

IPC: C08L85/02 ,  H05K1/03 ,  C08G79/04

CPC classification number: C08L85/02 ,  C08G59/4021 ,  C08G59/621 ,  C08G79/04 ,  C08J5/24 ,  C08J2363/00 ,  H05K1/0366 ,  H05K1/0373 ,  H05K2201/012 ,  Y10T428/31529

Abstract: Disclosed is an epoxy resin composition comprising: (A) a polymerized compound including, as structural components, phosphaphenanthrene and at least one constituent selected from a structural unit of a phenolic novolak polymer and a structural unit of a phenolic novolak polymer in which a hydrogen atom of a phenolic hydroxyl group is substituted by phosphaphenanthrene; (B) an epoxy resin having two or more epoxy groups in a molecule; and (C) a curing agent that cures the epoxy resin.

Abstract translation: 公开了一种环氧树脂组合物，其包含：（A）包含作为结构成分的磷菲和至少一种选自酚醛清漆聚合物的结构单元和酚醛清漆聚合物的结构单元的聚合化合物，其中氢原子 酚羟基被磷杂菲取代; （B）分子中具有两个以上环氧基的环氧树脂; 和（C）固化环氧树脂的固化剂。

公开(公告)号：US08445605B2

公开(公告)日：2013-05-21

申请号：US12861742

申请日：2010-08-23

Applicant: Yueshan He ,  Tao Cheng ,  Shiguo Su ,  Biwu Wang ,  Jie Li

Inventor： Yueshan He ,  Tao Cheng ,  Shiguo Su ,  Biwu Wang ,  Jie Li

IPC: B32B15/08 ,  B32B17/04 ,  B32B27/04 ,  B32B27/38 ,  C08K3/20 ,  C08K3/36 ,  C08L61/06 ,  C08L63/02 ,  C08L63/04 ,  C08K7/14

CPC classification number: C08K5/357 ,  C08G59/5073 ,  C08G59/621 ,  C08G59/686 ,  C08J5/24 ,  C08J2385/02 ,  C08J2463/00 ,  C08K5/5399 ,  C08L63/00 ,  H05K1/0326 ,  H05K1/0353 ,  H05K1/0366 ,  H05K2201/012 ,  H05K2201/0209 ,  Y10T428/24994 ,  Y10T428/31511 ,  Y10T428/31529

Abstract: The present invention provides a halogen-free flame retardant resin composition, and, a prepreg, a laminate, and a laminate for printed circuit that are made from the halogen-free flame retardant resin composition. The halogen-free flame retardant resin composition comprises: (A) 40-80 parts by weight of the mixture of a phenoxyphosphazene compound (A1) and a dihydrobenzoxazine ring-containing compound (A2), and, the weight ratio between the phenoxyphosphazene compound (A1) and the dihydrobenzoxazine ring-containing compound (A2) being between 1:10 and 1:2; (B) 15-45 parts by weight of a polyepoxy compound; (C) 5-25 parts by weight of a phenolic resin type hardener; and (D) 0.1-1 parts by weight of an imidazole type compound as the curing accelerator. The prepreg, the laminate, and the laminate for printed circuit that are made from the halogen-free flame retardant resin composition provided by the present invention, have excellent flame retardancy, as well as has high glass transition temperature (Tg), high thermal resistance, high flexural strength, high reliability, low dielectric dissipation factor, low moisture, low C.T.E, good chemical resistance, and good processability.

Abstract translation: 本发明提供一种无卤阻燃树脂组合物，以及由无卤阻燃树脂组合物制成的无卤阻燃树脂组合物，预浸料，层压材料和印刷电路用层压材料。 无卤阻燃树脂组合物包含：（A）40-80重量份的苯氧基磷腈化合物（A1）和含二氢苯并恶嗪环的化合物（A2）的混合物，以及苯氧基磷腈化合物（ A1）和含二氢苯并恶嗪环的化合物（A2）为1:10至1:2之间; （B）15-45重量份聚环氧化合物; （C）5-25重量份酚醛树脂型固化剂; 和（D）0.1-1重量份作为固化促进剂的咪唑型化合物。 由本发明提供的无卤阻燃树脂组合物制成的预浸料，层压板和印刷电路用层压板具有优异的阻燃性，并且具有高玻璃化转变温度（Tg），高耐热性 抗弯强度高，可靠性高，介电损耗因数低，水分低，CTE低，耐化学性好，加工性好。

公开(公告)号：US08394911B2

公开(公告)日：2013-03-12

申请号：US13577235

申请日：2011-01-19

Applicant: Yutaka Satou ,  Kazuo Arita ,  Ichirou Ogura

Inventor： Yutaka Satou ,  Kazuo Arita ,  Ichirou Ogura

IPC: C08G8/04 ,  C08G14/04 ,  H01R12/00 ,  H05K1/00

CPC classification number: H05K1/0326 ,  C08G8/08 ,  C08G8/12 ,  C08K5/13 ,  H05K2201/012 ,  Y10T428/31515 ,  C08L61/06

Abstract: A phenol resin composition used as a curing agent for an epoxy resin includes a naphthol novolac resin (a1) represented by general formula (1) (wherein R1 and R2 each independently represent a hydrogen atom, an alkyl group, or an alkoxy group, and n is a repeating unit and an integer of 1 or more), and a compound (a2) represented by general formula (2) (wherein R1 and R2 each independently represent a hydrogen atom, an alkyl group, or an alkoxy group), wherein the total ratio of compounds with n=1 and n=2 in the general formula (1) present in the composition is in the range of 10 to 35%, the average of n in the general formula (1) is in the range of 3.0 to 7.0, and the content of the compound (a2) in the composition is 1 to 6%.

Abstract translation: 用作环氧树脂固化剂的酚醛树脂组合物包括由通式（1）表示的萘酚酚醛清漆树脂（a1）（其中R1和R2各自独立地表示氢原子，烷基或烷氧基，和 n为重复单元，1以上的整数）和通式（2）表示的化合物（a2）（式中，R 1和R 2各自独立地表示氢原子，烷基或烷氧基），式 存在于组合物中的通式（1）中n = 1且n = 2的化合物的总比例在10〜35％的范围内，通式（1）中n的平均值在 3.0〜7.0，组合物中化合物（a2）的含量为1〜6％。

公开(公告)号：US20120282549A1

公开(公告)日：2012-11-08

申请号：US13522227

申请日：2011-01-28

Applicant: Hideki Tomizawa ,  Kazumori Minami ,  Daisuke Arioka

Inventor： Hideki Tomizawa ,  Kazumori Minami ,  Daisuke Arioka

IPC: G03F7/004 ,  G03F7/20

CPC classification number: G03F7/027 ,  G03F7/031 ,  G03F7/035 ,  H05K3/287 ,  H05K2201/012

Abstract: A photosensitive composition including: a photosensitive polyurethane resin; a phosphorus-containing flame retardant; a polymerizable compound; and a photopolymerization initiator, wherein the photosensitive polyurethane resin contains an ethylenically unsaturated bond group and a carboxyl group, and contains a polyurethane skeleton which contains a polyol group as a repeating unit.

Abstract translation: 一种光敏组合物，包括：感光性聚氨酯树脂; 含磷阻燃剂; 可聚合化合物; 和光聚合引发剂，其中感光性聚氨酯树脂含有烯键式不饱和键和羧基，并含有含有多元醇基作为重复单元的聚氨酯骨架。

公开(公告)号：US20120277347A1

公开(公告)日：2012-11-01

申请号：US13411823

申请日：2012-03-05

Applicant: David Bedner ,  William D. Varnell

Inventor： David Bedner ,  William D. Varnell

IPC: C08L63/00 ,  C08K5/521

CPC classification number: C09K21/12 ,  B32B27/04 ,  C08G59/621 ,  C08K5/0066 ,  C08K5/1515 ,  C08K5/521 ,  C08L63/00 ,  C08L71/12 ,  H05K1/0373 ,  H05K2201/012 ,  H05K2203/122 ,  C08L2666/22

Abstract: Flame retardant compositions that are halogen-free or substantially halogen-free are disclosed. In certain examples, the compositions comprise a halogen-free or substantially halogen-free epoxide and one or more phosphorated compounds. In some examples, the phosphorated compound comprises an average particle size less than 10 microns. In other examples, the phosphorated compound provides a surface area of 78.5 μm2 to about 1965 μm2. Prepregs, laminates, molded articles and printed circuit boards using the compositions are also disclosed.

Abstract translation: 公开了无卤素或基本上不含卤素的阻燃组合物。 在某些实例中，组合物包含无卤素或基本上不含卤素的环氧化物和一种或多种磷酸化化合物。 在一些实例中，磷酸化化合物包含小于10微米的平均粒度。 在其他实施例中，磷酸化化合物的表面积为78.5μm2至约1965μm2。 还公开了使用该组合物的预浸料，层压板，模制品和印刷电路板。

公开(公告)号：US08269115B2

公开(公告)日：2012-09-18

申请号：US12584596

申请日：2009-09-09

Applicant: Min She Su

Inventor： Min She Su

IPC: H05K1/09

CPC classification number: C08J5/24 ,  C08J5/043 ,  C08J2309/06 ,  H05K1/024 ,  H05K1/0353 ,  H05K1/0366 ,  H05K2201/012 ,  H05K2201/0158 ,  H05K2201/0209 ,  H05K2201/029 ,  Y10T442/2672 ,  Y10T442/2713 ,  Y10T442/2934

Abstract: The invention relates to a composite material and a high-frequency circuit substrate made from the composite material. The composite material includes: a thermosetting composition in an amount of 20 to 70 by weight with respect to the composite material, a fiberglass cloth processed by a coupling agent; a powder filler; a fire retardant and a cure initiator. The thermosetting composition includes a resin with molecular weight thereof being less than 11,000, and a low-molecular-weight solid allyl resin. The resin is composed of carbon and hydrogen elements. More than 60 percent of the resin is vinyl. The high-frequency circuit substrate made from the composite material comprises: a plurality of prepregs mutually overlapped and copper foils covered on both sides of overlapped prepregs, wherein each prepeg is made from the composite material.

Abstract translation: 本发明涉及由复合材料制成的复合材料和高频电路基板。 复合材料包括：相对于复合材料为20〜70重量％的热固性组合物，由偶联剂处理的玻璃纤维布; 粉末填料; 阻燃剂和固化引发剂。 热固性组合物包括分子量小于11,000的树脂和低分子量固体烯丙基树脂。 树脂由碳和氢元素组成。 超过60％的树脂是乙烯基树脂。 由复合材料制成的高频电路基板包括：相互重叠的多个预浸料和覆盖在重叠的预浸料的两侧的铜箔，其中每个预成型件由复合材料制成。

公开(公告)号：US08198347B2

公开(公告)日：2012-06-12

申请号：US12588940

申请日：2009-11-03

Applicant: Dein-Run Fung ,  Te-Chao Liao ,  Hao-Sheng Chen

Inventor： Dein-Run Fung ,  Te-Chao Liao ,  Hao-Sheng Chen

IPC: C08L63/00 ,  C08G59/30 ,  C08G59/38 ,  B32B27/38

CPC classification number: C09K21/14 ,  C08G59/304 ,  C08G59/38 ,  C08L63/00 ,  H05K1/0373 ,  H05K2201/012 ,  H05K2201/0209 ,  C08L2666/22

Abstract: A high thermal-conductive, halogen-free and flame-retardant resin composition used as a dielectric layer of a printed circuit board comprises 5% to 70% of phosphorus-containing epoxy resin, at most 50% of multifunctional or bifunctional epoxy resin, 1% to 20% of curing agent, 0.01% to 10% of accelerant, at most 20% of inorganic powder, 5% to 85% of high thermal conductivity powder and 0.01% to 10% of processing aids, which resin composition has excellent thermal conductivity, heat resistance and flame retardancy as well as being environmentally friendly for free of halogen flame retardant and no toxic or corrosive gases when burning; the resin composition is used to form as a high thermal-conductive prepreg by impregnation or form as a high thermal-conductive coating by coating and then further used as a dielectric layer on a printed circuit board for demonstrating if electronic components formed thereon the printed circuit board has high thermal-conductivity and efficient heat dissipation capable of improving long service life and enhanced stability of electronic components.

Abstract translation: 用作印刷电路板的电介质层的高导热，无卤阻燃树脂组合物包含5％至70％的含磷环氧树脂，至多50％的多官能或双官能环氧树脂，1 固化剂的百分比至20％，促进剂的0.01％至10％，无机粉末的至多20％，高导热性粉末的5％至85％和加工助剂的0.01％至10％，该树脂组合物具有优异的热 导电性，耐热性和阻燃性，以及环保无卤素阻燃剂，燃烧时无毒性或腐蚀性气体; 树脂组合物用于通过浸渍形成高导热性预浸料，或通过涂布形成高导热涂层，然后进一步用作印刷电路板上的电介质层，以证明其上形成印刷电路的电子部件 板材具有高导热性和高效率的散热能力，可以延长电池寿命，延长电子元器件的稳定性。

公开(公告)号：US20120111618A1

公开(公告)日：2012-05-10

申请号：US13161760

申请日：2011-06-16

Applicant: Hyung Mi Jung ,  Jae Choon Cho ,  Choon Keun Lee

Inventor： Hyung Mi Jung ,  Jae Choon Cho ,  Choon Keun Lee

IPC: H05K1/02 ,  C08L63/04 ,  C08L63/10 ,  C08L63/00

CPC classification number: H05K1/0353 ,  C08G59/08 ,  C08G59/182 ,  C08G59/186 ,  C08G59/304 ,  C08G59/621 ,  H05K1/0326 ,  H05K3/4655 ,  H05K2201/012 ,  Y10T428/12396

Abstract: There are provided a flame-retardant resin composition for a multilayer wiring board and a multilayer wiring board having the same. The flame-retardant resin composition for a multilayer wiring board according to an exemplary embodiment of the present invention includes a composite epoxy resin including a naphthalene modified epoxy resin, a cresol novolac epoxy resin, a rubber modified epoxy resin and a phosphorous-based epoxy resin, as well as a flame retardant represented by a specific chemical formula. The flame-retardant resin composition for a multilayer wiring board and the multilayer wiring board having the same disclosed herein exhibits excellent flame retardancy, moisture resistance and peel strength.

Abstract translation: 提供了一种用于多层布线板的阻燃树脂组合物和具有该阻燃树脂组合物的多层布线板。 根据本发明的示例性实施方案的用于多层布线板的阻燃树脂组合物包括包含萘改性环氧树脂，甲酚酚醛环氧树脂，橡胶改性环氧树脂和磷基环氧树脂的复合环氧树脂 ，以及由特定化学式表示的阻燃剂。 用于多层布线板的阻燃树脂组合物和其中所公开的多层布线板具有优异的阻燃性，耐湿性和剥离强度。

公开(公告)号：US20120064231A1

公开(公告)日：2012-03-15

申请号：US13235060

申请日：2011-09-16

Applicant: Jae-Choon Cho ,  Myeong-Ho Hong ,  Hwa-Young Lee ,  Hee-Sun Chun ,  Choon-Keun Lee

Inventor： Jae-Choon Cho ,  Myeong-Ho Hong ,  Hwa-Young Lee ,  Hee-Sun Chun ,  Choon-Keun Lee

IPC: H05K3/46

CPC classification number: C09K21/14 ,  C08G59/182 ,  C08K3/00 ,  C08K3/36 ,  C08L63/00 ,  H05K1/0326 ,  H05K1/036 ,  H05K1/0373 ,  H05K1/0393 ,  H05K2201/012 ,  H05K2201/0145 ,  H05K2201/0209

Abstract: The present invention relates to a method for manufacturing a printed circuit board including a flame retardant insulation layer. The printed circuit board of the present invention exhibits excellent thermal stability and excellent mechanical strength, is suitable for imprinting lithography process, provides improved reliability by reducing coefficient of thermal expansion, and has excellent adhesion between circuit patterns and an insulation layer.

Abstract translation: 本发明涉及包含阻燃绝缘层的印刷电路板的制造方法。 本发明的印刷电路板显示出优异的热稳定性和优异的机械强度，适用于压印光刻工艺，通过降低热膨胀系数提供改进的可靠性，并且在电路图案和绝缘层之间具有优异的粘附性。

公开(公告)号：US08093609B2

公开(公告)日：2012-01-10

申请号：US12434242

申请日：2009-05-01

Applicant: Mark Anthony Hand ,  Daniel Sekowski ,  Frederick Lloyd Carpenter ,  Bernhard Bachl ,  Bernd Bienek ,  Olaf Cladders ,  Henning Dieker ,  Christian Miesner ,  Peter Schöpper ,  Lothar Schopmann ,  Herfried Zimmer

Inventor： Mark Anthony Hand ,  Daniel Sekowski ,  Frederick Lloyd Carpenter ,  Bernhard Bachl ,  Bernd Bienek ,  Olaf Cladders ,  Henning Dieker ,  Christian Miesner ,  Peter Schöpper ,  Lothar Schopmann ,  Herfried Zimmer

IPC: H01L33/00

CPC classification number: H05K3/284 ,  F21K9/00 ,  H05K1/0256 ,  H05K3/301 ,  H05K3/3421 ,  H05K2201/012 ,  H05K2201/10977 ,  H05K2201/2018

Abstract: In a light emitting diode arrangement for lighting purposes, comprising a circuit board with at least one light generating semiconductor element disposed on the circuit board and conductors extending on the circuit board to the semiconductor element and being electrically connected to terminals of the semiconductor element, a light transmissive element is disposed on the circuit board and covers the semiconductor element and a flame resistant cover element is disposed below the light transmissive element and on top of the terminals to cover the terminals to provide for electrical and flame insulation thereof.

Abstract translation: 在用于照明目的的发光二极管装置中，包括具有设置在电路板上的至少一个光产生半导体元件的电路板和在电路板上延伸到半导体元件并与半导体元件的端子电连接的导体， 透光元件设置在电路板上并覆盖半导体元件，并且阻燃覆盖元件设置在透光元件下方并且在端子的顶部上以覆盖端子以提供其电气和火焰绝缘。