公开(公告)号：US09040839B2

公开(公告)日：2015-05-26

申请号：US13097798

申请日：2011-04-29

Applicant: Lei Zhu ,  Motoyuki Furuta

Inventor： Norihiko Furuta ,  Lei Zhu

IPC: H05K1/00 ,  H05K3/36 ,  H05K3/32

CPC classification number: H05K3/361 ,  H05K3/323 ,  H05K2201/0133 ,  H05K2201/0162

Abstract: A wiring body connection structure includes a first wiring body and a second wiring body, the first wiring body having a first base material made of an elastomer and a first wiring containing an elastomer and a conductive material, the second wiring body having a second base material and a second wiring. In the wiring body connection structure, a laminated section is partitioned where a first end of the first wiring body and a second end of the second wiring body overlap in a front-rear direction. The wiring body connection structure further includes a cover member arranged on a front surface of the first wiring body, and a conductive adhesive layer bonding the first end and the second end in the laminated section while ensuring a conductive property. The cover member is interposed between a frontmost end of the second end and the first wiring in the laminated section.

Abstract translation: 布线体连接结构包括第一布线体和第二布线体，所述第一布线体具有由弹性体构成的第一基材和含有弹性体和导电材料的第一布线，所述第二布线体具有第二基材 和第二布线。 在布线体连接结构中，在第一布线体的第一端和第二布线体的第二端在前后方向上重叠的层叠部分分隔开。 布线体连接结构还包括布置在第一布线体的前表面上的覆盖件，以及在确保导电性的同时将层压部分中的第一端和第二端接合的导电粘合剂层。 盖构件插入在第二端的最前端和层压部中的第一布线之间。

公开(公告)号：US08987606B2

公开(公告)日：2015-03-24

申请号：US13511117

申请日：2011-12-13

Applicant: Eehern Jay Wong

Inventor： Eehern Jay Wong

IPC: H05K1/03 ,  H05K1/09 ,  H05K1/11 ,  H05K3/46 ,  H05K3/32 ,  H05K3/28 ,  H05K3/36 ,  H05K3/40

CPC classification number: H05K1/095 ,  H01L2224/83192 ,  H05K3/28 ,  H05K3/32 ,  H05K3/368 ,  H05K3/4007 ,  H05K2201/0133 ,  Y10T156/10

Abstract: Provided herein are technologies generally relating to creating connections and/or associations. In some examples, the embodiments can relate to a circuit that includes a surface, a first electrical contact that is attached to the surface, a glass substrate, a second electrical contact that is attached to the glass substrate, and at least one elastomer layer. In some embodiments, the elastomer layer can provide or assist in creating a contact between the first electrical contact and the second electrical contact.

Abstract translation: 这里提供了通常涉及创建连接和/或关联的技术。 在一些示例中，实施例可以涉及包括表面，附接到表面的第一电触点，玻璃基板，附接到玻璃基板的第二电触点和至少一个弹性体层的电路。 在一些实施例中，弹性体层可以提供或辅助在第一电触点和第二电接触之间产生接触。

公开(公告)号：US08966975B2

公开(公告)日：2015-03-03

申请号：US13002696

申请日：2009-07-27

Applicant: Curt Douglas Campbell ,  Neil Gordon Murray, Jr. ,  Dion Parker

Inventor： Curt Douglas Campbell ,  Neil Gordon Murray, Jr. ,  Dion Parker

IPC: G01P15/00 ,  H05K5/00 ,  B29C45/14 ,  B29C45/16 ,  G01P1/02 ,  H05K3/28

CPC classification number: H05K5/0034 ,  B29C45/14655 ,  B29C45/1671 ,  B29C45/1676 ,  G01P1/023 ,  H05K3/284 ,  H05K5/0078 ,  H05K2201/0133 ,  H05K2203/1316 ,  H05K2203/1322

Abstract: A crash sensor assembly including a printed circuit board and a crash sensor mounted on the printed circuit board, At least one connector pin is mounted to the printed circuit board so as to permit external electrical communication with the crash sensor. A first insert molded soft inner layer of material partially covers the printed circuit board and covers the crash sensor, and a second overmolded hard outer layer of material covers the first soft inner layer of material and bonded thereto and rigidly contacts the printed circuit board.

Abstract translation: 一种碰撞传感器组件，包括印刷电路板和安装在印刷电路板上的碰撞传感器。至少一个连接器针安装到印刷电路板上，以允许与碰撞传感器的外部电气通信。 第一嵌入成型的软内层材料部分地覆盖印刷电路板并覆盖碰撞传感器，并且第二包覆成型的硬质外层材料覆盖第一软内层材料并结合到其上并刚性地接触印刷电路板。

公开(公告)号：US08956702B2

公开(公告)日：2015-02-17

申请号：US14136107

申请日：2013-12-20

Applicant: Ajinomoto Co., Inc.

Inventor： Kenji Kawai ,  Shigeo Nakamura

IPC: B05D3/12 ,  B05D7/14 ,  C08L63/00 ,  H05K3/46 ,  C08G59/62 ,  C08L71/00 ,  C08L21/00 ,  H05K3/38

CPC classification number: H05K3/4688 ,  C08G59/621 ,  C08L21/00 ,  C08L63/00 ,  C08L71/00 ,  H05K3/381 ,  H05K3/4632 ,  H05K3/4661 ,  H05K2201/0133 ,  H05K2201/0212 ,  C08L2666/14 ,  C08L61/04 ,  C08L2666/04

Abstract: Epoxy resin compositions, which comprise (A) en epoxy resin having two or more epoxy groups in a molecule; (B) a phenol type curing agent where an average hydroxyl group content in a molecule (a mean value of (the total number of hydroxyl groups)/(the total number of benzene rings)), P, satisfies the equation 0

Abstract translation: 环氧树脂组合物，其包含（A）在分子中具有两个或更多个环氧基的环氧树脂; （B）分子中的平均羟基含量（（羟基的总数）/（苯环的总数）的平均值）/（苯环的总数））的酚类固化剂满足式0

公开(公告)号：US20140376197A1

公开(公告)日：2014-12-25

申请号：US14483934

申请日：2014-09-11

Applicant: HARRIS CORPORATION

Inventor： MICHAEL RAYMOND WEATHERSPOON ,  DAVID B. NICOL ,  LOUIS JOSEPH RENDEK, JR.

IPC: H05K1/03 ,  H05K3/46 ,  H05K3/32 ,  H05K3/40 ,  H05K1/11 ,  H05K1/18

CPC classification number: H01L23/4985 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/486 ,  H01L21/6835 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/49894 ,  H01L23/5383 ,  H01L24/16 ,  H01L24/17 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/50 ,  H01L2221/68345 ,  H01L2221/68359 ,  H01L2221/68363 ,  H01L2221/68381 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/48 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48229 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06548 ,  H01L2225/06572 ,  H01L2924/01029 ,  H01L2924/0105 ,  H01L2924/01327 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1421 ,  H01L2924/1431 ,  H01L2924/1511 ,  H01L2924/1579 ,  H05K1/036 ,  H05K1/0393 ,  H05K1/115 ,  H05K1/181 ,  H05K1/189 ,  H05K3/32 ,  H05K3/3436 ,  H05K3/4038 ,  H05K3/4602 ,  H05K3/4632 ,  H05K3/467 ,  H05K3/4688 ,  H05K2201/0133 ,  H05K2201/0141 ,  H05K2201/10674 ,  Y10T29/4913 ,  Y10T29/49224 ,  Y10T428/24917 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A method is for making an electronic device and includes forming an interconnect layer stack on a sacrificial substrate and having a plurality of patterned electrical conductor layers, and a dielectric layer between adjacent patterned electrical conductor layers. The method also includes laminating and electrically joining through an intermetallic bond a liquid crystal polymer (LCP) substrate to the interconnect layer stack on a side thereof opposite the sacrificial substrate. The method further includes removing the sacrificial substrate to expose a lowermost patterned electrical conductor layer, and electrically coupling at least one first device to the lowermost patterned electrical conductor layer.

Abstract translation: 一种用于制造电子器件的方法，包括在牺牲衬底上形成互连层堆叠并且具有多个图案化的导电层，以及在相邻的图案化电导体层之间的介电层。 该方法还包括通过液晶聚合物（LCP）衬底的金属间键合层叠和电连接到与牺牲衬底相对的一侧上的互连层堆叠。 该方法还包括去除牺牲衬底以暴露最下图案化电导体层，并将至少一个第一器件电耦合到最下图案化电导体层。

公开(公告)号：US20140374872A1

公开(公告)日：2014-12-25

申请号：US14220910

申请日：2014-03-20

Applicant: THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOIS

Inventor： John A. ROGERS ,  Matthew MEITL ,  Yugang SUN ,  Heung Cho KO ,  Andrew CARLSON ,  Won Mook CHOI ,  Mark STOYKOVICH ,  Hanqing JIANG ,  Yonggang HUANG ,  Ralph G. NUZZO ,  Zhengtao ZHU ,  Etienne MENARD ,  Dahl-Young KHANG

IPC: H01L27/12 ,  H01L21/02 ,  H01L29/06

CPC classification number: H01L29/72 ,  H01L21/02422 ,  H01L21/02628 ,  H01L21/4846 ,  H01L21/8258 ,  H01L23/5387 ,  H01L27/12 ,  H01L29/0657 ,  H01L2924/12041 ,  H01L2924/13091 ,  H05K1/0283 ,  H05K3/20 ,  H05K3/22 ,  H05K2201/0133 ,  H05K2201/09045 ,  H05K2203/0271 ,  H01L2924/00

Abstract: In an aspect, the present invention provides stretchable, and optionally printable, components such as semiconductors and electronic circuits capable of providing good performance when stretched, compressed, flexed or otherwise deformed, and related methods of making or tuning such stretchable components. Stretchable semiconductors and electronic circuits preferred for some applications are flexible, in addition to being stretchable, and thus are capable of significant elongation, flexing, bending or other deformation along one or more axes. Further, stretchable semiconductors and electronic circuits of the present invention are adapted to a wide range of device configurations to provide fully flexible electronic and optoelectronic devices.

Abstract translation: 一方面，本发明提供了拉伸，压缩，弯曲或其它变形时能够提供良好性能的可拉伸和可选择的可印刷的部件，例如半导体和电子电路，以及制造或调谐这种可拉伸部件的相关方法。 对于一些应用而言，优选的可拉伸半导体和电子电路除了是可拉伸的之外是柔性的，因此能够沿着一个或多个轴显着地伸长，弯曲，弯曲或其它变形。 此外，本发明的可拉伸半导体和电子电路适用于宽范围的器件配置，以提供完全灵活的电子和光电器件。

公开(公告)号：US08895864B2

公开(公告)日：2014-11-25

申请号：US13435372

申请日：2012-03-30

Applicant: Darryl Cotton ,  Samiul Md Haque ,  Piers Andrew

Inventor： Darryl Cotton ,  Samiul Md Haque ,  Piers Andrew

IPC: H05K3/20 ,  H05K1/00

CPC classification number: H05K3/0064 ,  H05K1/0283 ,  H05K2201/0133 ,  H05K2201/0394 ,  H05K2201/09045 ,  H05K2201/09109 ,  H05K2201/09263 ,  H05K2201/2036

Abstract: An apparatus and method wherein the apparatus includes a deformable substrate; a conductive portion; and at least one support configured to couple the conductive portion to the deformable substrate so that the conductive portion is spaced from the deformable substrate.

Abstract translation: 一种装置和方法，其中所述装置包括可变形基板; 导电部分; 以及至少一个支撑件，其构造成将所述导电部分耦合到所述可变形基板，使得所述导电部分与所述可变形基板间隔开。

公开(公告)号：US08883287B2

公开(公告)日：2014-11-11

申请号：US12822609

申请日：2010-06-24

Applicant: Mary C. Boyce ,  Simona Socrate ,  Christopher M. Boyce ,  Brian P. Greviskes

Inventor： Mary C. Boyce ,  Simona Socrate ,  Christopher M. Boyce ,  Brian P. Greviskes

IPC: B32B3/24 ,  B29C59/02 ,  B29C59/16 ,  H01L23/498 ,  H05K1/02 ,  B32B3/26

CPC classification number: B29C59/02 ,  B29C59/16 ,  B29C2791/009 ,  B29C2793/00 ,  B32B3/266 ,  H01L23/4985 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K1/0283 ,  H05K2201/0133 ,  H05K2201/046 ,  H05K2201/09063 ,  Y10T428/24314 ,  Y10T428/24479 ,  H01L2924/00

Abstract: A flexible and stretchable patterned substrate is provided having a strain-permitting material comprising a patterned conformation that allows the flexible patterned substrate to experience local strain or local strain domains lower than the macroscopic strain of the flexible and stretchable patterned substrate.

Abstract translation: 提供了一种柔性和可拉伸的图案化基底，其具有包含图案化构象的应变允许材料，其允许柔性图案化基底经历比柔性和可拉伸图案化基底的宏观应变低的局部应变或局部应变结构域。

公开(公告)号：US08759688B2

公开(公告)日：2014-06-24

申请号：US12159837

申请日：2007-09-21

Applicant: Seiichi Yoshinaga ,  Yoshiyuki Wada ,  Tadahiko Sakai

Inventor： Seiichi Yoshinaga ,  Yoshiyuki Wada ,  Tadahiko Sakai

IPC: H05K1/16

CPC classification number: H01L21/563 ,  H01L23/293 ,  H01L2224/73203 ,  H01L2924/15311 ,  H01L2924/3511 ,  H05K3/305 ,  H05K3/3436 ,  H05K2201/0133 ,  H05K2201/10734 ,  H05K2203/0545 ,  Y02P70/613 ,  Y10T428/23971 ,  Y10T428/31525

Abstract: The invention intends to provide an electronic component mounting structure where the repairability and the impact resistance are combined. In an electronic component mounting structure, a plurality of solder balls disposed in plane between an electronic component and a substrate is melted to bond the electronic component and the substrate and a resin of which tensile elongation after the curing is in the range of 5 to 40% is filled in portions that are gaps between the electronic component and the substrate and correspond to at least four corners of the electronic component to reinforce. Since the reinforcement area is small, the repairability such as the easy removability of the resin and the reusability of the substrate are excellent, the resin itself is allowed to expand to the impact at the drop to play a role of reinforcing the bonding without breaking, and the impact resistance is excellent as well.

Abstract translation: 本发明旨在提供组合可修复性和耐冲击性的电子部件安装结构。 在电子部件安装结构中，将电子部件与基板的平面内配置的多个焊锡球融化，使电子部件和基板接合，固化后的拉伸伸长率为5〜40的树脂 电子部件与基板之间的间隙部分被填充，并且对应于电子部件的至少四个角部以加强。 由于加强面积小，树脂的易去除性和基材的可再利用性等的可修复性优异，因此树脂本身能够在液滴下膨胀到冲击，起到加强粘合而不破裂的作用， 耐冲击性也优异。

公开(公告)号：US20140140020A1

公开(公告)日：2014-05-22

申请号：US13974963

申请日：2013-08-23

Applicant: John A. ROGERS ,  Yonggang HUANG ,  Heung Cho KO ,  Mark STOYKOVICH ,  Won Mook CHOI ,  Jizhou SONG ,  Jong Hyun AHN ,  Dae Hyeong KIM

Inventor： John A. ROGERS ,  Yonggang HUANG ,  Heung Cho KO ,  Mark STOYKOVICH ,  Won Mook CHOI ,  Jizhou SONG ,  Jong Hyun AHN ,  Dae Hyeong KIM

IPC: H05K1/02 ,  H05K1/03

CPC classification number: H05K1/0283 ,  B33Y80/00 ,  H01L21/4867 ,  H01L21/6835 ,  H01L23/4985 ,  H01L25/0655 ,  H01L25/50 ,  H01L27/14601 ,  H01L2221/68359 ,  H01L2224/05624 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01057 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/13091 ,  H01L2924/1461 ,  H01L2924/3025 ,  H05K1/03 ,  H05K1/036 ,  H05K1/0393 ,  H05K1/16 ,  H05K1/185 ,  H05K3/207 ,  H05K3/284 ,  H05K3/30 ,  H05K2201/0133 ,  H05K2203/0271 ,  Y10T29/49002 ,  Y10T29/4913 ,  Y10T29/49146 ,  H01L2924/00

Abstract: Disclosed herein are stretchable, foldable and optionally printable, processes for making devices and devices such as semiconductors, electronic circuits and components thereof that are capable of providing good performance when stretched, compressed, flexed or otherwise deformed. Strain isolation layers provide good strain isolation to functional device layers. Multilayer devices are constructed to position a neutral mechanical surface coincident or proximate to a functional layer having a material that is susceptible to strain-induced failure. Neutral mechanical surfaces are positioned by one or more layers having a property that is spatially inhomogeneous, such as by patterning any of the layers of the multilayer device.

Abstract translation: 本文公开了可拉伸，可折叠和任选可印刷的制造方法，用于制造当拉伸，压缩，弯曲或以其它方式变形时能够提供良好性能的诸如半导体，电子电路及其部件的装置和装置。 应变隔离层为功能器件层提供了良好的应变隔离。 多层器件被构造成将中性机械表面重合或接近具有易受应变引起的故障的材料的功能层。 中性机械表面由具有空间不均匀性质的一个或多个层定位，例如通过图案化多层器件的任何层。