公开(公告)号：US20040166305A1

公开(公告)日：2004-08-26

申请号：US10700343

申请日：2003-11-03

Inventor： Murali Sethumadhavan ,  Vincent R. Landi ,  Bruce G. Kosa

IPC: B32B015/06

CPC classification number: H05K1/032 ,  B32B27/04 ,  C08K3/22 ,  C08K3/36 ,  C08K5/14 ,  C08L9/00 ,  C08L27/12 ,  H05K1/0373 ,  H05K2201/015 ,  H05K2201/0158 ,  H05K2201/0209 ,  H05K2201/0212 ,  Y10T428/24917 ,  Y10T428/249933 ,  Y10T428/25 ,  Y10T428/3154 ,  Y10T428/31605 ,  Y10T428/31609 ,  Y10T428/31707 ,  C08L2666/04

Abstract: An electrical circuit material having a conductive layer disposed a substrate, wherein the substrate is formed from a thermosetting composition comprising a polybutadiene or polyisoprene resin; an optional, functionalized liquid polybutadiene or polyisoprene resin; an optional butadiene- or isoprene-containing copolymer; an optional low molecular weight polymer; an optional curing agent; a cross-linking agent; a particulate fluoropolymer; and about 20 to about 50 percent by weight, based on the total weight of the thermosetting composition, of a magnesium hydroxide having a low ionic content. Use of magnesium hydroxide allows the composition to attain a high level of flame retardancy without use of halogenated flame retardants, while maintaining good moisture absorption and other physical properties.

Abstract translation: 一种电路材料，其具有设置在衬底上的导电层，其中所述衬底由包含聚丁二烯或聚异戊二烯树脂的热固性组合物形成; 任选的官能化液体聚丁二烯或聚异戊二烯树脂; 任选的含丁二烯或含异戊二烯的共聚物; 任选的低分子量聚合物; 任选的固化剂; 交联剂; 颗粒状含氟聚合物; 和约20至约50重量％，基于热固性组合物的总重量，具有低离子含量的氢氧化镁。 使用氢氧化镁可使组合物达到高水平的阻燃性，而不使用卤化阻燃剂，同时保持良好的吸湿性和其他物理性能。

公开(公告)号：US06670101B2

公开(公告)日：2003-12-30

申请号：US10043839

申请日：2002-01-10

Applicant: Kaoru Ohba ,  Hideki Akimoto ,  Philip E. Garrou ,  Ying-Hung So ,  Britton Lee Kaliszewski

Inventor： Kaoru Ohba ,  Hideki Akimoto ,  Philip E. Garrou ,  Ying-Hung So ,  Britton Lee Kaliszewski

IPC: G03C500

CPC classification number: H05K3/4655 ,  C08G61/02 ,  H05K3/4652 ,  H05K2201/0158 ,  H05K2201/0358

Abstract: The invention is a process for building-up printed wiring boards using metal foil coated with toughened benzocyclobutene-based dielectric polymers. The invention is also a toughened dielectric polymer comprising benzocyclobutene-based monomers or oligomers, ethylenically unsaturated polymer additive, and, optionally, a photoactive compound.

公开(公告)号：US20020102494A1

公开(公告)日：2002-08-01

申请号：US10043839

申请日：2002-01-10

Inventor： Kaoru Ohba ,  Hideki Akimoto ,  Brian Martin ,  Albert Charles Marie Achen ,  Philip E. Garrou ,  Ying-Hung So ,  Britton Lee Kaliszewski

IPC: G03F007/004

CPC classification number: H05K3/4655 ,  C08G61/02 ,  H05K3/4652 ,  H05K2201/0158 ,  H05K2201/0358

Abstract: The invention is a process for building-up printed wiring boards using metal foil coated with toughened benzocyclobutene-based dielectric polymers. The invention is also a toughened dielectric polymer comprising benzocyclobutene-based monomers or oligomers, ethylenically unsaturated polymer additive, and, optionally, a photoactive compound.

公开(公告)号：US06168855A

公开(公告)日：2001-01-02

申请号：US09418443

申请日：1999-10-15

Applicant: Yachin Cohen ,  Dmitry Rein ,  Lev Vaykhansky

Inventor： Yachin Cohen ,  Dmitry Rein ,  Lev Vaykhansky

IPC: B32B300

CPC classification number: B32B27/02 ,  B32B7/12 ,  B32B2323/043 ,  B32B2323/046 ,  B32B2457/08 ,  C08J5/04 ,  H05K1/028 ,  H05K1/032 ,  H05K1/0366 ,  H05K1/0393 ,  H05K2201/0129 ,  H05K2201/0158 ,  H05K2201/0278 ,  H05K2201/0287 ,  H05K2201/0293 ,  H05K2203/1105 ,  Y10S428/901 ,  Y10T428/24628 ,  Y10T428/24917 ,  Y10T428/249941 ,  Y10T428/249942 ,  Y10T428/2938 ,  Y10T428/31649 ,  Y10T428/31681

Abstract: A polyolefin composite for a printed circuit board or antenna base material, a base material including the composite and electronic modules including the base material. The base material includes at least one dielectric layer including a polyolefin composite and at least one electroconductive layer including an electroconductive material, the dielectric and electroconductive layers being intimately bonded to one another.

Abstract translation: 用于印刷电路板或天线基材的聚烯烃复合材料，包括复合材料的基材和包括基材的电子模块。 所述基材包括至少一个包括聚烯烃复合材料的介电层和至少一个包含导电材料的导电层，所述电介质层和导电层彼此紧密结合。

公开(公告)号：US6127633A

公开(公告)日：2000-10-03

申请号：US636959

申请日：1996-04-24

Applicant: Tohru Kinoshita

Inventor： Tohru Kinoshita

IPC: H05K3/38 ,  H05K3/42 ,  H05K3/46 ,  H05K1/02

CPC classification number: H05K3/381 ,  H05K3/421 ,  H05K3/4661 ,  H05K2201/0158 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/09509 ,  H05K2201/09518 ,  H05K2201/09827 ,  H05K2203/0773 ,  H05K2203/0796 ,  H05K3/426

Abstract: The present invention provides a multilayer print circuit board having at least an inner print circuit pattern and an outer print circuit pattern which are laminated on a substrate through an insulation layer and being electrically connected to each other through a blind hole provided in the insulation layer. The insulation layer is composed of a resin insoluble in an oxidization agent and inorganic powder dispersed in the resin. The inorganic powder is soluble in the oxidization agent. The surface of insulation layer and the wall of the blind hole are roughed by the oxidization agent before the outer print circuit pattern is formed on the surface of the insulation layer by plating, whereby the inorganic powder exposed to the oxidization agent is melted therein, resulting in the roughed surface of the insulation layer and the wall of the blind hole.

Abstract translation: 本发明提供一种具有至少内部印刷电路图案和外部印刷电路图案的多层印刷电路板，该印刷电路图案和外部印刷电路图案通过绝缘层层叠在基板上，并通过设置在绝缘层中的盲孔彼此电连接。 绝缘层由不溶于氧化剂的树脂和分散在树脂中的无机粉末组成。 无机粉末可溶于氧化剂。 在通过电镀在绝缘层的表面上形成外部印刷电路图案之前，绝缘层的表面和盲孔的壁被氧化剂粗糙化，由此暴露于氧化剂的无机粉末熔化，导致 在绝缘层的粗糙表面和盲孔的壁上。

公开(公告)号：US5972484A

公开(公告)日：1999-10-26

申请号：US980770

申请日：1997-12-01

Applicant: Yachin Cohen ,  Dimitri Rein ,  Lev Vaykhansky

Inventor： Yachin Cohen ,  Dimitri Rein ,  Lev Vaykhansky

IPC: B32B27/02 ,  C08J5/04 ,  H05K1/00 ,  H05K1/03 ,  B32B3/00 ,  B32B5/06

CPC classification number: H05K1/0366 ,  B32B27/02 ,  C08J5/04 ,  H05K1/028 ,  H05K1/032 ,  H05K1/0393 ,  H05K2201/0129 ,  H05K2201/0158 ,  H05K2201/0278 ,  H05K2201/0287 ,  H05K2201/0293 ,  H05K2203/1105 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/249941 ,  Y10T428/249942 ,  Y10T428/31681 ,  Y10T442/3415 ,  Y10T442/656

Abstract: An ultrahigh molecular weight polyethylene composite for a printed circuit board or antenna base material, a base material including the composite and electronic modules including the base material. The base material includes at least one dielectric layer including an ultrahigh molecular weight polyethylene composite and at least one electroconductive layer including an electroconductive material, the dielectric and electroconductive layers being intimately bonded to one another.

Abstract translation: 用于印刷电路板或天线基材的超高分子量聚乙烯复合材料，包括复合材料的基材和包括基材的电子模块。 基材包括至少一个介电层，包括超高分子量聚乙烯复合材料和至少一个包含导电材料的导电层，电介质层和导电层彼此紧密结合。

公开(公告)号：US5965682A

公开(公告)日：1999-10-12

申请号：US37415

申请日：1998-03-10

Applicant: Curtis E. Peterson ,  Yi-Bin Huang ,  Roel H. Vossen ,  Paul J. Moses, Jr.

Inventor： Curtis E. Peterson ,  Yi-Bin Huang ,  Roel H. Vossen ,  Paul J. Moses, Jr.

IPC: C08J5/24 ,  C08J5/04 ,  C08L25/00 ,  D01F6/20 ,  D01F6/22 ,  D01F6/56 ,  D01F8/10 ,  H05K1/03 ,  C08F12/08 ,  B32B27/02 ,  C08L63/02

CPC classification number: C08J5/24 ,  C08J5/04 ,  C08J5/046 ,  D01F6/20 ,  D01F6/22 ,  D01F6/56 ,  D01F8/10 ,  H05K1/0366 ,  C08J2363/00 ,  H05K2201/0158 ,  H05K2201/0278 ,  Y10S428/901 ,  Y10T428/12222 ,  Y10T428/24994 ,  Y10T428/2929 ,  Y10T428/31511 ,  Y10T428/31721 ,  Y10T428/31855 ,  Y10T428/31913 ,  Y10T428/31931

Abstract: Fibers having increased strength and small diameters can be produced from compositions comprising long chain branched syndiotactic vinyl aromatic polymers derived from the polymerization of a vinyl aromatic monomer in the presence of from 10 to 1000 ppm, based on the amount of vinyl aromatic monomer, of a multifunctional monomer having more than one olefinic functionality. Due to the increased fiber strength, less strand breakage occurs during processing which increases process productivity and yield.

Abstract translation: 具有增加强度和小直径的纤维可以由包含长链支化间同立构乙烯基芳族聚合物的组合物制备，所述组合物衍生自乙烯基芳族单体的聚合，基于乙烯基芳族单体的量为10至1000ppm， 具有多于一个烯属官能团的多官能单体。 由于增加的纤维强度，在加工过程中发生较少的断裂，这提高了工艺生产率和产率。

公开(公告)号：US5753358A

公开(公告)日：1998-05-19

申请号：US591043

申请日：1996-01-25

Applicant: Joseph E. Korleski

Inventor： Joseph E. Korleski

IPC: C08L27/18 ,  C09J7/02 ,  H05K1/03 ,  B32B5/16 ,  B32B5/18 ,  B32B27/04 ,  B32B27/20

CPC classification number: C09J7/0289 ,  C09J7/0296 ,  H05K1/0353 ,  C08L27/18 ,  C09J2203/326 ,  C09J2400/163 ,  C09J2400/263 ,  C09J2427/006 ,  C09J2463/00 ,  H05K2201/0116 ,  H05K2201/015 ,  H05K2201/0158 ,  H05K2201/0209 ,  H05K2201/0278 ,  H05K2201/0293 ,  Y10T428/249953 ,  Y10T428/249958 ,  Y10T428/249978 ,  Y10T428/24998 ,  Y10T428/249982 ,  Y10T428/249985 ,  Y10T428/249986 ,  Y10T428/249987 ,  Y10T428/249991 ,  Y10T428/249992 ,  Y10T428/249993 ,  Y10T428/25 ,  Y10T428/256 ,  Y10T428/259 ,  Y10T428/31511 ,  Y10T428/31544 ,  Y10T428/31699 ,  Y10T428/31931

Abstract: An adhesive composite material comprises an expanded fluoropolymer with nodes and interconnected fibrils, the fluoropolymer having a void volume which is at least partially filled with a mixture containing a thermoset or thermoplastic adhesive and a particulate inorganic filler. The composite material contains sufficient adhesive and filler such that the composite contains between about 5 to about 40 volume percent expanded fluoropolymer; 5-85 volume percent inorganic filler; and 10-95 volume percent of adhesive and filler, the adhesive and filler being contained within the voids of the expanded fluoropolymer. In the composite, the ratio of the mean flow pore size of the expanded fluoropolymer to the largest particle size of the filler is at least about 2 and/or the ratio of the minimum pore size of the expanded fluoropolymer to the largest particle size of the filler is at least about 1.4.

Abstract translation: 粘合剂复合材料包括具有节点和相互连接的原纤维的膨胀氟聚合物，所述含氟聚合物具有至少部分地填充有含有热固性或热塑性粘合剂和颗粒状无机填料的混合物的空隙体积。 复合材料包含足够的粘合剂和填料，使得复合材料含有约5至约40体积％的膨胀氟聚合物; 5-85体积％无机填料; 和10-95体积％的粘合剂和填料，粘合剂和填料包含在膨胀的含氟聚合物的空隙内。 在复合材料中，膨胀的含氟聚合物的平均流量孔径与填料的最大粒度的比率至少为约2和/或膨胀的含氟聚合物的最小孔径与最大颗粒尺寸之比 填料至少约为1.4。

公开(公告)号：US5733823A

公开(公告)日：1998-03-31

申请号：US706691

申请日：1996-09-06

Applicant: Taizou Sugioka ,  Shinobu Yamao

Inventor： Taizou Sugioka ,  Shinobu Yamao

IPC: B32B27/04 ,  C08J5/24 ,  C08K3/22 ,  C08K3/24 ,  C08L21/00 ,  C08L25/00 ,  C08L25/04 ,  C08L25/18 ,  C08L101/00 ,  H05K1/03 ,  B32B7/00 ,  B32B17/10

CPC classification number: C08J5/24 ,  B32B27/04 ,  H05K1/0373 ,  C08J2325/00 ,  H05K1/0353 ,  H05K2201/012 ,  H05K2201/0129 ,  H05K2201/0133 ,  H05K2201/0158 ,  H05K2201/0209 ,  H05K2201/0212 ,  Y10S428/901 ,  Y10T428/31518 ,  Y10T428/31522 ,  Y10T428/31627 ,  Y10T428/31681 ,  Y10T428/31761 ,  Y10T428/31964 ,  Y10T442/2418 ,  Y10T442/2426 ,  Y10T442/2475 ,  Y10T442/2631 ,  Y10T442/3447

Abstract: There are provided a prepreg for a printed circuit board which comprises a glass cloth impregnated with a flame retardative resin composition comprising a (A) resin composed of a (a) styrenic polymer having syndiotactic configuration, a (b) polymer having compatibility with or affinity for the component (a) and further containing polar group, and a (c) thermoplastic resin other than the components (a) and (b) and/or a rubbery elastomer; a (B) halogenated polystyrene in which the amount of halogen atoms contained in halogen compounds generated under specific conditions is at most 1000 ppm by weight; a (C) flame retardant aid; an (D) organic filler or inorganic filler; and the above glass cloth, and also a substrate for printed circuit which comprises the prepreg or a laminate comprising a plurality of the prepregs laminated on each other, at least one side of the prepreg or laminate being laminated with a metallic layer. The above substrate is greatly improved in resistance to electrolytic corrosion and imparted with high reliability, and thus can cope with high density commercial devices.

Abstract translation: 提供一种用于印刷电路板的预浸料，其包括浸渍有阻燃树脂组合物的玻璃布，所述阻燃树脂组合物包含（A）由（a）间同立构构型的（a）苯乙烯聚合物组成的树脂，（b）与 （a）成分，还含有极性基团和（c）成分（a）和（b）以外的热塑性树脂和/或橡胶状弹性体; （B）卤化聚苯乙烯，其中在特定条件下产生的卤素化合物中所含的卤素原子的量为至多1000重量ppm; （C）阻燃助剂; （D）有机填料或无机填料; 以及上述玻璃布，还有一种印刷电路用基板，该基板包括预浸料或层叠有多个预浸料的层叠体，预浸料坯或层合体的至少一侧与金属层层叠。 上述基板在耐电腐蚀性方面大大提高，并且具有高可靠性，因此可以应对高密度商业装置。

公开(公告)号：US5080979A

公开(公告)日：1992-01-14

申请号：US458423

申请日：1989-12-28

Applicant: Hiromi Shigemoto ,  Mikio Katagiri

Inventor： Hiromi Shigemoto ,  Mikio Katagiri

IPC: B32B27/28 ,  B32B27/32 ,  H05K1/00 ,  H05K3/00 ,  H05K3/28 ,  H05K3/38

CPC classification number: B29C33/68 ,  B32B27/32 ,  H05K3/281 ,  H05K1/0393 ,  H05K2201/0158 ,  H05K2203/066 ,  H05K3/386 ,  Y10T428/31913 ,  Y10T428/31928

Abstract: A release film composed of a laminate comprising(A) a layer of a flexible polyolefin as an interlayer, and(B) two layers of crystalline polymethylpentene formed on both sides of the interlayer.