公开(公告)号：US6110399A

公开(公告)日：2000-08-29

申请号：US98885

申请日：1998-06-17

Applicant: Ciaran Bernard McArdle ,  Joseph Burke

Inventor： Ciaran Bernard McArdle ,  Joseph Burke

IPC: H05K1/09 ,  C09J5/06 ,  C09J9/02 ,  C09J11/04 ,  C09J201/00 ,  H01B1/00 ,  H01B1/20 ,  H01B5/00 ,  H01B5/16 ,  H01F1/44 ,  H01F41/16 ,  H01L21/60 ,  H01R4/04 ,  H05K3/32 ,  H01B1/02

CPC classification number: H05K3/323 ,  H01F1/44 ,  H01F41/16 ,  H01R4/04 ,  H01L2224/293 ,  H01L2924/01019 ,  H01L2924/01079 ,  H01L2924/07811 ,  H01R12/57 ,  H05K2201/0221 ,  H05K2201/023 ,  H05K2201/0233 ,  H05K2201/083 ,  H05K2203/104 ,  Y10T428/12069 ,  Y10T428/12347

Abstract: The invention provides a composition (3) comprising:(i) a ferrofluid comprising a colloidal suspension (4) of ferromagnetic particles in a non-magnetic carrier liquid, and(ii) a plurality of electrically-conductive particles (5) having substantially uniform sizes and shapes, dispersed in the ferrofluid.Various types of substantially non-magnetic electrically-conductive particles (5) are described. Application of a substantially uniform magnetic field by magnet means (8) to the composition (3) causes the electrically-conductive particles (5) to form a regular pattern (9). The composition is used for providing anisotropic conductive pathways (9a, 9b) between two sets of conductors (2a, 2b; 7a, 7b) in the electronics industry.The composition may be a curable adhesive composition which bonds the conductors. Alternatively or in addition the electrically-conductive particles may have a latent adhesive property e.g. the particles may be solder particles.The ferrofluid may be a colloidal suspension of ferromagnetic particles in a liquid monomer.

Abstract translation: 本发明提供一种组合物（3），其包含：（i）含有非磁性载体液体中的铁磁颗粒的胶体悬浮液（4）的铁磁流体，和（ii）具有基本均匀的多个导电颗粒 尺寸和形状，分散在铁磁流体中。 描述了各种类型的基本上非磁性的导电颗粒（5）。 通过磁体装置（8）对组合物（3）施加基本均匀的磁场使得导电颗粒（5）形成规则图案（9）。 该组合物用于在电子工业中的两组导体（2a，2b; 7a，7b）之间提供各向异性导电通路（9a，9b）。 组合物可以是结合导体的可固化粘合剂组合物。 或者或另外，导电颗粒可以具有潜在的粘合性，例如 颗粒可以是焊料颗粒。 铁磁流体可以是液体单体中的铁磁颗粒的胶态悬浮液。

公开(公告)号：US5235741A

公开(公告)日：1993-08-17

申请号：US928036

申请日：1992-08-11

Applicant: Akira Mase

Inventor： Akira Mase

IPC: H01R4/04 ,  H05K1/00 ,  H05K3/32 ,  H05K3/36

CPC classification number: H01R12/62 ,  H01R4/04 ,  H05K3/323 ,  H05K1/0393 ,  H05K2201/0108 ,  H05K2201/0209 ,  H05K2201/0221 ,  H05K2201/023 ,  H05K2201/0233 ,  H05K2201/0272 ,  H05K3/361 ,  Y10T29/49126 ,  Y10T29/49201

Abstract: Electrical connection between electrode arrangements formed on first and second substrates is described. The first substrate is placed over the second substrate with a UV light curable adhesive between them. The UV light curable adhesive carries first and second particles dispersed therein. The first and second substrates are pressed against each other and exposed to UV light in order to harden the adhesive. The first particles are made from conductive particles and preferably resilient and function to form current paths between the electrodes of the first and second substrates. The second particles function to prevent the first particles from being destroyed by excess deformation.

Abstract translation: 描述形成在第一和第二基板上的电极布置之间的电连接。 将第一衬底放置在第二衬底上，在它们之间具有UV光可固化粘合剂。 UV光固化型粘合剂携带分散在其中的第一和第二颗粒。 将第一和第二基板彼此挤压并暴露于UV光以使粘合剂硬化。 第一颗粒由导电颗粒制成并且优选地是弹性的并且用于在第一和第二基板的电极之间形成电流路径。 第二颗粒起到防止第一颗粒被过度变形破坏的作用。

公开(公告)号：US5130833A

公开(公告)日：1992-07-14

申请号：US575442

申请日：1990-08-30

Applicant: Akira Mase

Inventor： Akira Mase

IPC: G02F1/13 ,  H01R4/04 ,  H05K3/32 ,  H05K3/36

CPC classification number: G02F1/13452 ,  H01R4/04 ,  H05K3/323 ,  H05K3/361 ,  G02F2203/69 ,  H05K1/0306 ,  H05K1/148 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0221 ,  H05K2201/0233 ,  H05K2201/0272 ,  H05K2201/0326 ,  H05K2201/2036 ,  H05K3/368

Abstract: A liquid crystal device and a manufacturing method thereof are described. The device comprises a liquid crystal panel and an auxiliary panel formed with an IC circuit for supplying driving signals to the liquid crystal device. The auxiliary substrate is separately provided with the circuit and the function thereof is tested in advance of the assembling with the liquid crystal panel. By this procedure, the yield is substantially improved.

Abstract translation: 对液晶装置及其制造方法进行说明。 该装置包括液晶面板和形成有用于向液晶装置提供驱动信号的IC电路的辅助面板。 辅助基板分别设置有电路，其功能在与液晶面板组装之前进行测试。 通过该程序，产率大大提高。

公开(公告)号：US5034245A

公开(公告)日：1991-07-23

申请号：US485745

申请日：1990-02-27

Applicant: Hiroshi Matsubara

Inventor： Hiroshi Matsubara

IPC: G09F9/00 ,  G02F1/13 ,  H01L21/56 ,  H01L21/60 ,  H01L23/485 ,  H01R4/04 ,  H01R11/01 ,  H01R43/00 ,  H05K3/10 ,  H05K3/24 ,  H05K3/32

CPC classification number: H01L24/10 ,  G02F1/13452 ,  H01L21/563 ,  H01L24/13 ,  H01L24/81 ,  H05K3/247 ,  H05K3/321 ,  H01L2224/11015 ,  H01L2224/11332 ,  H01L2224/11334 ,  H01L2224/13 ,  H01L2224/1319 ,  H01L2224/136 ,  H01L2224/2929 ,  H01L2224/2939 ,  H01L2224/29399 ,  H01L2224/29409 ,  H01L2224/29411 ,  H01L2224/29416 ,  H01L2224/29439 ,  H01L2224/29444 ,  H01L2224/29447 ,  H01L2224/29455 ,  H01L2224/29464 ,  H01L2224/29469 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H05K2201/0221 ,  H05K2201/0233 ,  H05K2201/0373 ,  H05K3/06 ,  H05K3/102

Abstract: A connection electrodes producing method has a step of forming resin layer which can be softened after hardened, on a circuit substrate on which an electrode pattern is formed. Then, only the resin layer material on the electrode pattern is cured and left. Thereafter, conductive particles are adhered to only the resin layer on the electrode pattern by softening the resin layer and by scattering the conductive particles on the circuit substrate with the softened resin layer.

Abstract translation: 连接电极的制造方法具有在形成有电极图案的电路基板上形成硬化后可以软化的树脂层的工序。 然后，仅电极图案上的树脂层材料固化并残留。 此后，通过软化树脂层并且通过软化树脂层将导电颗粒散布在电路基板上，导电颗粒仅粘附到电极图案上的树脂层。

公开(公告)号：US4729809A

公开(公告)日：1988-03-08

申请号：US16496

申请日：1987-02-17

Applicant: Ronald A. Dery ,  Warren C. Jones ,  William J. Lynn ,  John R. Rowlette

Inventor： Ronald A. Dery ,  Warren C. Jones ,  William J. Lynn ,  John R. Rowlette

IPC: H01B1/20 ,  H01B1/22 ,  H01B1/24 ,  H01H1/029 ,  H05K3/32 ,  H05K3/36 ,  B29C65/02 ,  B29C65/54 ,  B32B5/16 ,  B32B7/12

CPC classification number: H05K3/323 ,  H01B1/20 ,  H01B1/22 ,  H01B1/24 ,  H01H1/029 ,  H05K2201/0221 ,  H05K2201/023 ,  H05K2201/0233 ,  H05K3/361 ,  Y10T156/109 ,  Y10T156/1093

Abstract: An anisotropically conductive adhesive composition (10) for use in electrically connecting at least one conductive area (14) on one substrate (12) with at least one conductive area (20) on a second substrate (18) is disclosed. The composition (10) is comprised of a mixture of conductive particles and a nonconductive adhesive binder (26). The conductive particles are dispersed throughout the binder in a plurality of noncontiguous conductive units (24) such that, upon applying a layer (30) of the composition (10) over both the conductive and insulating areas (14, 16) on one substrate (12) and positioning in a conducting relationship and adhering said at least one conductive area (20) on the second substrate (18) with said at least one conductive area (14) on the first substrate (12), the units (24) establish electrical connection between the adhered conductive areas (14, 20) on the two substrates (12, 18). The units (24) are sufficiently spaced apart, however, to preclude electrical conductivity between adjacent areas on the same substrate. A method for electrically connecting conductive areas on two substrates by means of said anisotropically conductive adhesive composition (10) and products produced by said method are also disclosed.

Abstract translation: 公开了一种用于将一个基板（12）上的至少一个导电区域（14）与第二基板（18）上的至少一个导电区域（20）电连接的各向异性导电粘合剂组合物（10）。 组合物（10）由导电颗粒和非导电粘合剂粘合剂（26）的混合物组成。 导电颗粒在多个不连续的导电单元（24）中分散在整个粘合剂中，使得当在一个基板上的导电和绝缘区域（14,16）上施加组合物（10）的层（30） 12）并且以导电关系定位并且将所述至少一个导电区域（20）与所述第一基板（12）上的所述至少一个导电区域（14）粘附在所述第二基板（18）上，所述单元（24）建立 在两个基板（12,18）上的粘合的导电区域（14,20）之间的电连接。 然而，单元（24）足够间隔开以排除相同基板上的相邻区域之间的导电性。 还公开了通过所述各向异性导电粘合剂组合物（10）和由所述方法产生的产品电连接两个基板上的导电区域的方法。

公开(公告)号：US20150230335A1

公开(公告)日：2015-08-13

申请号：US14618681

申请日：2015-02-10

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Kwang Jik LEE ,  Jin Gu KIM ,  Myung Jae YOO ,  Ichiro OGURA ,  Hye Suk SHIN

IPC: H05K1/05 ,  H05K3/38 ,  H05K1/03

CPC classification number: H05K1/0373 ,  H05K1/0366 ,  H05K3/022 ,  H05K3/381 ,  H05K2201/0209 ,  H05K2201/0233 ,  Y10T428/2495 ,  Y10T428/31678

Abstract: Embodiments of the invention provide a copper clad laminate, and more particularly, to a copper clad laminate and a method for manufacturing the same capable of increasing a peel strength by adding a stress relaxation filler to an insulating layer of a copper clad laminate, along with an inorganic filler. To improve an adhesion of a substrate, the stress relaxation filler is distributed into the resin, along with the inorganic filler, and is entirely distributed into the varnish, and is more effectively added to the vicinity of a bonded interface between the insulating layer and the copper clad layer, thereby improving the overall adhesion.

Abstract translation: 本发明的实施方案提供一种覆铜层压板，更具体地说，涉及覆铜层压板及其制造方法，其能够通过向覆铜层压板的绝缘层添加应力松弛填料而提高剥离强度，以及 无机填料。 为了提高基材的粘附性，应力松弛填料与无机填料一起分配到树脂中，并且完全分散在清漆中，并且更有效地添加到绝缘层和绝缘层之间的键合界面附近 铜包覆层，从而提高整体粘合性。

公开(公告)号：US20120112215A1

公开(公告)日：2012-05-10

申请号：US12941799

申请日：2010-11-08

Applicant: Yan Chai ,  Calvin B. Ward

Inventor： Yan Chai ,  Calvin B. Ward

IPC: H01L33/08 ,  H01L33/50

CPC classification number: H01L25/0753 ,  H01L33/50 ,  H01L33/62 ,  H01L33/64 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/49107 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2933/0066 ,  H01L2933/0091 ,  H05K1/0274 ,  H05K1/111 ,  H05K3/284 ,  H05K3/323 ,  H05K2201/0209 ,  H05K2201/0221 ,  H05K2201/0233 ,  H05K2201/10106 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A light source and method for making the same are disclosed. The light source includes a plurality of surface mount LEDs that are bonded to a mounting substrate by a layer of asymmetric conductor. Each LED has surface mount contacts on a first surface thereof and emits light from a second surface thereof that is opposite the first surface. The mounting substrate includes a top surface having a plurality of connection traces. Each connection trace includes an n-trace positioned to underlie a corresponding one of the n-contacts and a p-trace positioned to underlie a corresponding one of the p-contacts, the p-trace having an area greater than the p-contact. The layer of asymmetric conductor is sandwiched between the surface mount contacts and the connection traces, and can optionally extend into the spaces between the LEDs to provide a scattering medium for redirecting light leaving the sides of the LEDs.

Abstract translation: 公开了一种光源及其制造方法。 光源包括通过不对称导体层结合到安装基板的多个表面贴装LED。 每个LED在其第一表面上具有表面安装触点，并且从与第一表面相对的第二表面发射光。 安装基板包括具有多个连接迹线的顶表面。 每个连接迹线包括定位成位于n个触点中的相应一个的下方的n迹线和位于相应一个p触点下方的p迹线，p迹线具有大于p触点的面积。 不对称导体层被夹在表面安装触点和连接迹线之间，并且可以可选地延伸到LED之间的空间中，以提供用于重定向离开LED侧面的光的散射介质。

公开(公告)号：US08129023B2

公开(公告)日：2012-03-06

申请号：US11763521

申请日：2007-06-15

Applicant: Jung Bae Jun ,  Jin Gyu Park ,  Jae Ho Lee ,  Tae Sub Bae

Inventor： Jung Bae Jun ,  Jin Gyu Park ,  Jae Ho Lee ,  Tae Sub Bae

IPC: B32B27/02 ,  B32B5/16 ,  B05D7/00 ,  H01B1/00

CPC classification number: H05K3/323 ,  H05K2201/0221 ,  H05K2201/0233 ,  Y10T428/2982 ,  Y10T428/2991 ,  Y10T428/2998

Abstract: Disclosed herein are anisotropic conductive particles contained in anisotropic conductive adhesive films which can be used in circuit board mounting applications. The conductive particles have a uniform shape, a narrow particle diameter distribution, and appropriate compressive de-formability and recoverability from deformation. In addition, the conductive particles exhibit enhanced conducting properties without being ruptured when interposed and compressed between connection substrates, thereby achieving a sufficient contact area between the particles and the connection substrates. Further disclosed are polymer-based particles used in the conductive particles.

Abstract translation: 本文公开了各向异性导电粘合剂膜中包含的各向异性导电颗粒，其可用于电路板安装应用中。 导电颗粒具有均匀的形状，窄的粒径分布，以及适当的压缩成形性和可变形性。 此外，导电颗粒在连接基板之间插入和压缩时表现出增强的导电性能而不会破裂，从而实现了颗粒和连接基板之间的足够的接触面积。 进一步公开的是在导电颗粒中使用的基于聚合物的颗粒。

公开(公告)号：US20100080995A1

公开(公告)日：2010-04-01

申请号：US12631210

申请日：2009-12-04

Applicant: Tomoyuki Ishimatsu ,  Daisuke Sato ,  Hiroki Ozeki

Inventor： Tomoyuki Ishimatsu ,  Daisuke Sato ,  Hiroki Ozeki

IPC: B32B37/14 ,  B32B37/12 ,  B32B37/06 ,  B32B37/10

CPC classification number: H05K3/323 ,  C08K7/00 ,  C09J9/02 ,  C09J11/00 ,  H01L24/83 ,  H01L2224/2929 ,  H01L2224/29388 ,  H01L2224/2939 ,  H01L2224/29444 ,  H01L2224/29455 ,  H01L2224/29499 ,  H01L2224/83101 ,  H01L2224/83191 ,  H01L2224/83851 ,  H01L2924/01019 ,  H01L2924/01079 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/3011 ,  H01R4/04 ,  H01R12/52 ,  H01R13/2414 ,  H05K3/361 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0233 ,  Y10T156/10 ,  Y10T428/31504 ,  H01L2924/00014 ,  H01L2924/0665 ,  H01L2924/00

Abstract: A method for connecting an electronic part, which contains: mixing a dispersing solvent, an adhesive resin which is dissolved in the dispersing solvent, conductive particles, and insulating particles which have smaller particle diameters than those of the conductive particles so as to prepare an anisotropic conductive adhesive; placing a terminal of a substrate and a terminal of an electronic part so as to face each other via the anisotropic conductive adhesive, and applying heat and pressure to the substrate and the electronic part so as to sandwich the conductive particles between the terminal of the substrate and the terminal of the electronic part to thereby deform the conductive particles, in which the pressure is smaller than pressure at which the conductive particles are destroyed, and smaller than pressure at which the particle diameters of the conductive particles become equal to the particle diameters of the insulating particles.

Abstract translation: 一种连接电子部件的方法，其包括：将分散溶剂混合，溶解在分散溶剂中的粘合剂树脂，导电颗粒和具有比导电颗粒小的粒径的绝缘颗粒，以制备各向异性 导电胶; 将基板的端子和电子部件的端子通过各向异性导电粘合剂彼此面对，并且向基板和电子部件施加热和压力，以将导电颗粒夹在基板的端子之间 和电子部件的端子，使导电粒子的压力小于导电性粒子破坏的压力的导电性粒子变形，并且比导电粒子的粒径变得等于 绝缘颗粒。

公开(公告)号：US20090068916A1

公开(公告)日：2009-03-12

申请号：US12207138

申请日：2008-09-09

Applicant: Min-Sok JANG ,  Kyung-Hwan KO ,  Seung-Il LEE ,  Jin-Wook MOON ,  Jeong-Geun HAN

Inventor： Min-Sok JANG ,  Kyung-Hwan KO ,  Seung-Il LEE ,  Jin-Wook MOON ,  Jeong-Geun HAN

IPC: H01J9/24 ,  B05D5/12 ,  H01B1/20

CPC classification number: H05K3/323 ,  B22F1/025 ,  H05K2201/0218 ,  H05K2201/0233 ,  Y10T428/2991

Abstract: In an anisotropic conductive adhesive containing a conductive particle, the conductive particle includes a resin particle that is provided with a cavity formed therein and a conductive layer surrounding a surface of the resin particle. The cavity is formed by mixing the resin particle with a reactant and partially removing the reactant from the resin particle. Thus, the conductive particle may readily absorb an external pressure, thereby providing an improved malleability to the conductive particle.

Abstract translation: 在含有导电性粒子的各向异性导电性粘合剂中，导电性粒子包括树脂粒子，该树脂粒子形成有腔，该导电性层包围树脂粒子的表面。 通过将树脂颗粒与反应物混合并从树脂颗粒中部分除去反应物而形成空腔。 因此，导电性粒子可以容易地吸收外部压力，从而为导电性粒子提供改善的延展性。