公开(公告)号：US06334922B1

公开(公告)日：2002-01-01

申请号：US09283867

申请日：1999-04-01

Applicant: Yoshinobu Tanaka ,  Takeichi Tsudaka ,  Minoru Onodera ,  Toshiaki Sato

Inventor： Yoshinobu Tanaka ,  Takeichi Tsudaka ,  Minoru Onodera ,  Toshiaki Sato

IPC: B32B3108

CPC classification number: B32B15/08 ,  B32B38/10 ,  B32B2305/55 ,  B32B2309/02 ,  B32B2457/08 ,  H05K3/022 ,  H05K3/462 ,  H05K3/4635 ,  H05K2201/0141 ,  H05K2201/0358 ,  H05K2201/068 ,  H05K2203/0264 ,  H05K2203/1536 ,  Y10T156/1059 ,  Y10T156/1911 ,  Y10T428/10 ,  Y10T428/1005 ,  Y10T428/1086 ,  Y10T428/31681

Abstract: A coating layer of a polymer capable of forming an optically anisotropic melt phase is formed by heat-pressing to a base material a film made of the polymer and having a segment orientation ratio of not greater than 1.3 and then separating the film into two halves so as to leave one of the halves on the base material, thereby obtaining a coated material made of the base material and the thin coating layer.

Abstract translation: 能够形成光学各向异性熔融相的聚合物的被覆层通过将由聚合物制成的膜热压到片材取向比为1.3以下，然后将膜分离成两半来形成 将其中的一半留在基材上，从而获得由基材和薄涂层制成的涂层材料。

公开(公告)号：US20010055676A1

公开(公告)日：2001-12-27

申请号：US09075732

申请日：1998-05-11

Inventor： GORDON C. SMITH

IPC: B32B015/08

CPC classification number: B32B15/08 ,  B32B7/06 ,  B32B7/12 ,  B32B2307/202 ,  B32B2457/08 ,  H05K3/025 ,  H05K2201/0317 ,  H05K2201/0355 ,  H05K2201/0358 ,  H05K2203/0769 ,  H05K2203/0786 ,  Y10S428/901 ,  Y10T428/12556 ,  Y10T428/12569 ,  Y10T428/265 ,  Y10T428/2804 ,  Y10T428/2839 ,  Y10T428/31678 ,  Y10T428/31692

Abstract: Disclosed is a metal-clad laminate product having a carrier film, a aqueous soluble release or parting layer deposited onto the carrier film and which can be mechanically separated from the carrier film, and an ultra thin metal layer deposited onto the parting layer. Also disclosed is a method for making the metal-clad laminate product.

Abstract translation: 公开了一种覆金属层压制品，其具有载体膜，水溶性释放或分离层，其沉积在载体膜上并且可以与载体膜机械分离，以及沉积在分离层上的超薄金属层。 还公开了一种制造覆金属层压制品的方法。

公开(公告)号：US5976699A

公开(公告)日：1999-11-02

申请号：US728800

申请日：1996-10-10

Applicant: Takeshi Hosomi ,  Toyoaki Kishi ,  Tomoyoshi Honjoya ,  Sei Nakamichi ,  Masahiro Mitsui

Inventor： Takeshi Hosomi ,  Toyoaki Kishi ,  Tomoyoshi Honjoya ,  Sei Nakamichi ,  Masahiro Mitsui

IPC: H05K3/00 ,  H05K3/46 ,  B32B15/08

CPC classification number: H05K3/4655 ,  H05K2201/0195 ,  H05K2201/0358 ,  H05K2203/0759 ,  H05K3/0023 ,  H05K3/4652 ,  Y10S428/901 ,  Y10S525/93 ,  Y10T428/31529

Abstract: An insulating adhesive for a multilayer printed circuit board, which is to be laminated to an internal layer circuit board coated with an undercoating agent comprising an epoxy resin and a curing agent therefor, and which comprises as essential components:(a) a bisphenol type epoxy resin or phenoxy resin having a weight average molecular weight of at least 10,000,(b) a bisphenol type epoxy resin having an epoxy equivalent of not more than 500, and(c) an epoxy resin curing agent, said insulating adhesive being excellent in storage stability in the form of a varnish or as coated on a copper foil, and when coated on an internal layer circuit board coated with an undercoating agent, being able to be well integrally cured with the undercoating agent.

Abstract translation: 一种用于多层印刷电路板的绝缘粘合剂，其将被层压到涂覆有包含环氧树脂及其固化剂的底涂剂的内层电路板，并且其包含作为必要组分的组分：（a）双酚型环氧树脂 重均分子量为10000以上的树脂或苯氧基树脂，（b）环氧当量不大于500的双酚型环氧树脂和（c）环氧树脂固化剂，所述绝缘胶粘剂的储存性优异 以清漆的形式的稳定性或涂覆在铜箔上，并且当涂覆在涂有底涂剂的内层电路板上时，能够与底涂剂一体地固化。

公开(公告)号：US5935452A

公开(公告)日：1999-08-10

申请号：US188905

申请日：1998-11-10

Applicant: Teiichi Inada ,  Yoshiyuki Tsuru ,  Shin Takanezawa

Inventor： Teiichi Inada ,  Yoshiyuki Tsuru ,  Shin Takanezawa

IPC: C08L13/00 ,  C08L33/08 ,  C08L63/00 ,  H05K1/03 ,  H05K3/00 ,  H05K3/46 ,  H01B13/00

CPC classification number: H05K3/4673 ,  C08L13/00 ,  C08L33/08 ,  C08L63/00 ,  H05K3/002 ,  H05K3/4655 ,  H05K2201/0133 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/0355 ,  H05K2201/0358 ,  H05K2203/063 ,  H05K2203/0759 ,  H05K2203/0783 ,  H05K2203/122 ,  H05K3/4644 ,  H05K3/4652

Abstract: A resin composition comprising (a) an epoxy resin having a number average molecular weight of 1200 or less, (b) a carboxylic acid-containing acrylic or acrylonitrile-butadiene rubber, (c) a curing agent for the epoxy resin, and (d) a curing accelerator is easily chemically etched and suitable as an insulating adhesive for producing multilayer printed circuit boards.

Abstract translation: 一种树脂组合物，其包含（a）数均分子量为1200以下的环氧树脂，（b）含羧酸的丙烯酸或丁腈橡胶，（c）环氧树脂的固化剂和（d ）固化促进剂易于化学蚀刻并适合作为制造多层印刷电路板的绝缘粘合剂。

公开(公告)号：US5879568A

公开(公告)日：1999-03-09

申请号：US870379

申请日：1997-06-06

Applicant: Naoyuki Urasaki ,  Kouichi Tsuyama ,  Kazuhito Kobayashi ,  Norio Okano ,  Hiroshi Shimizu ,  Nobuyuki Ogawa ,  Akishi Nakaso ,  Toyoki Ito ,  Daisuke Fujimoto ,  Kazuhisa Otsuka ,  Shigeharu Arike ,  Yoshiyuki Tsuru

Inventor： Naoyuki Urasaki ,  Kouichi Tsuyama ,  Kazuhito Kobayashi ,  Norio Okano ,  Hiroshi Shimizu ,  Nobuyuki Ogawa ,  Akishi Nakaso ,  Toyoki Ito ,  Daisuke Fujimoto ,  Kazuhisa Otsuka ,  Shigeharu Arike ,  Yoshiyuki Tsuru

IPC: H05K1/00 ,  H05K3/00 ,  H05K3/02 ,  H05K3/46 ,  B44C1/22

CPC classification number: H05K3/4655 ,  H05K3/0035 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/01078 ,  H05K2201/0209 ,  H05K2201/0248 ,  H05K2201/0355 ,  H05K2201/0358 ,  H05K2203/0554 ,  H05K3/0094 ,  H05K3/025 ,  H05K3/4652 ,  H05K3/4676

Abstract: A multilayer printed circuit board small in interlayer thickness, capable of fine wiring, minimized in IVH and BVH diameters, high in strength and also excellent in wire bonding workability can be produced by a process comprising the steps of coating a thermosetting resin varnish compounded with electrically insulating whiskers on a roughened side of a copper foil, semi-curing the resin by heating to form a thermosetting resin layer, integrally laminating it on an interlayer board in which plated through-holes and conductor circudits have been formed, and roughening the cured thermosetting resin layer on the via hole wall surfaces with a roughening agent.

Abstract translation: 可以通过包括以下步骤的方法制备层间厚度小的能够精细布线，IVH和BVH直径最小化，强度高以及引线键合加工性优异的多层印刷电路板，其中包括以下步骤：涂覆电化学复合的热固性树脂清漆 在铜箔的粗糙面上的绝缘晶须，通过加热半固化以形成热固性树脂层，将其整体地层压在已经形成电镀通孔和导体环形的夹层板上，并使固化的热固性树脂 树脂层在通孔壁表面上用粗糙剂。

公开(公告)号：US5806177A

公开(公告)日：1998-09-15

申请号：US740186

申请日：1996-10-28

Applicant: Takeshi Hosomi ,  Toyoaki Kishi ,  Tomoyoshi Honjoya ,  Sei Nakamichi ,  Masahiro Mitsui

Inventor： Takeshi Hosomi ,  Toyoaki Kishi ,  Tomoyoshi Honjoya ,  Sei Nakamichi ,  Masahiro Mitsui

IPC: H05K3/00 ,  H05K3/46 ,  H05K3/02

CPC classification number: H05K3/4655 ,  H05K2201/0195 ,  H05K2201/0355 ,  H05K2201/0358 ,  H05K2203/0759 ,  H05K3/0023 ,  H05K3/4652 ,  Y10T29/49155

Abstract: A process for producing a multilayer printed circuit board which comprises coating a light and heat curable undercoating agent on an internal layer circuit board, irradiating the undercoating agent with active energy beams to make the same tack-free, then laminating thereto a metal foil having an insulating adhesive layer and subsequently heating the resulting assembly to integrally cure the same. When the undercoating agent is coated on an internal layer circuit board and irradiated with a light to be made tack-free, and thereto is laminated a copper foil having a thermosetting insulating adhesive by a rigid roll or the like, the undercoating agent is softened or fluidized and the surface is smoothened. When the resulting laminate is thereafter heated, the undercoating agent coated on the internal layer circuit board and the insulating adhesive coated on the copper foil are integrally cured. Since the insulating adhesive coated on the metal foil keeps the thickness, a multilayer printed circuit board having an excellent board thickness precision can be produced without depending on the percentage of the remaining copper foil in the internal layer.

Abstract translation: 一种多层印刷电路板的制造方法，其特征在于，在内层电路基板上涂布光固化性可热固化的底涂剂，用活性能量射线照射底涂剂，制成相同的无粘性， 绝缘粘合剂层，随后加热所得组件以使其一体地固化。 当将底涂剂涂覆在内层电路板上并用无粘性的光照射时，通过刚性辊等层压具有热固性绝缘粘合剂的铜箔时，底涂剂软化或 流化并使表面平滑。 然后加热所得的层压体后，涂覆在内层电路板上的底涂剂和涂在铜箔上的绝缘胶粘剂整体固化。 由于涂覆在金属箔上的绝缘粘合剂保持厚度，所以可以制造出具有优异的板厚精度的多层印刷电路板，而不依赖于内层中剩余的铜箔的百分比。

公开(公告)号：US5756190A

公开(公告)日：1998-05-26

申请号：US734874

申请日：1996-10-22

Applicant: Takeshi Hosomi ,  Toyoaki Kishi ,  Tomoyoshi Honjoya ,  Sei Nakamichi ,  Masahiro Mitsui

Inventor： Takeshi Hosomi ,  Toyoaki Kishi ,  Tomoyoshi Honjoya ,  Sei Nakamichi ,  Masahiro Mitsui

IPC: C08G59/14 ,  C08G59/40 ,  C09D163/00 ,  C09D163/04 ,  H05K3/00 ,  H05K3/46 ,  B32B3/00 ,  B32B7/12 ,  G03C5/00

CPC classification number: H05K3/4655 ,  H05K2201/0195 ,  H05K2201/0355 ,  H05K2201/0358 ,  H05K2203/0759 ,  H05K3/0023 ,  H05K3/4652 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/2809

Abstract: An undercoating agent for a multilayer printed circuit board which comprises: (a) a normally solid epoxy resin having a softening point of 45.degree. to 120.degree. C., (b) an epoxy resin curing agent, (c) a diluent in which the epoxy resin is dissolved and which consists of a photopolymerizable monomer, and (d) a photopolymerization initiator, said undercoating agent being effectively used in the production of a multilayer printed circuit board which utilizes making the undercoating agent tack-free by irradiation with active energy beams and the main curing of the undercoating agent by heating.

Abstract translation: 一种多层印刷电路板用底漆剂，其特征在于：（a）软化点为45〜120℃的常规固体环氧树脂，（b）环氧树脂固化剂，（c）稀释剂， 环氧树脂溶解，由光聚合性单体构成，（d）光聚合引发剂，所述底涂剂有效地用于多层印刷电路板的制造，该多层印刷电路板通过照射活性能量束使底涂剂无粘性 并通过加热主要固化底漆。

公开(公告)号：US5707729A

公开(公告)日：1998-01-13

申请号：US524802

申请日：1995-09-07

Applicant: Tetsuro Satoh

Inventor： Tetsuro Satoh

IPC: C09J163/00 ,  H05K3/02 ,  H05K3/38 ,  B32B7/12 ,  B32B27/38

CPC classification number: H05K3/386 ,  C09J163/00 ,  H05K2201/0133 ,  H05K2201/0355 ,  H05K2201/0358 ,  H05K3/022 ,  Y10S428/921 ,  Y10T428/2804 ,  Y10T428/287 ,  Y10T428/2883 ,  Y10T428/31511 ,  Y10T428/31529 ,  Y10T428/31551 ,  Y10T428/31681 ,  Y10T428/31696

Abstract: An adhesive composition and foils coated with the adhesive, wherein the adhesive consisting essentially of: (I) a fist amount of a non-modified epoxy resin and a second amount of a rubber-modified epoxy resin in a total amount of 60-100 parts by weight, wherein the amount of rubber-modified epoxy resin is 0.5 to 20 parts by weight; (II) 5-30 parts by weight of a polyvinyl acetal resin; and optionally contains (III) at least one resin selected rom the group consisting of blocked isocyanate resins, polyester resins, polyester resins, melamine resins and urethane resins. The adhesive coating can optionally contain inorganic fillers, fire retardants, and curing agents.

Abstract translation: 粘合剂组合物和涂有粘合剂的箔，其中粘合剂基本上由以下组成：（I）第一量的未改性环氧树脂和第二量橡胶改性环氧树脂，总量为60-100份 ，其中橡胶改性环氧树脂的量为0.5-20重量份; （II）5-30重量份的聚乙烯醇缩醛树脂; 并且任选地含有（III）选自由封端异氰酸酯树脂，聚酯树脂，聚酯树脂，三聚氰胺树脂和聚氨酯树脂组成的组中的至少一种树脂。 粘合剂涂层可以任选地含有无机填料，阻燃剂和固化剂。

公开(公告)号：US5557843A

公开(公告)日：1996-09-24

申请号：US297792

申请日：1994-08-30

Applicant: Darryl J. McKenney ,  Robert D. Cyr

Inventor： Darryl J. McKenney ,  Robert D. Cyr

IPC: H05K3/00 ,  H05K3/46 ,  H05K3/28 ,  H05K3/38

CPC classification number: H05K3/4611 ,  H05K3/4626 ,  H05K3/4655 ,  H05K2201/0195 ,  H05K2201/0355 ,  H05K2201/0358 ,  H05K3/4652 ,  H05K3/4691 ,  Y10S428/901 ,  Y10T29/49126 ,  Y10T29/49163 ,  Y10T428/1438 ,  Y10T428/24917 ,  Y10T428/31515 ,  Y10T428/31522

Abstract: A printed circuit board and method of manufacture thereof is disclosed. The printed circuit board includes a first substrate provided from a conductive layer having disposed on a first surface thereof a cured adhesive layer, A semi-cured adhesive layer is then disposed over the cured adhesive layer and a second substrate is disposed against the semi-cured adhesive layer.

Abstract translation: 公开了一种印刷电路板及其制造方法。 印刷电路板包括由导电层提供的第一基板，第一基板在其第一表面上设置有固化的粘合剂层。然后将半固化粘合剂层设置在固化的粘合剂层上，并且将第二基板设置成抵抗半固化 粘合剂层。

公开(公告)号：US5544773A

公开(公告)日：1996-08-13

申请号：US252928

申请日：1994-06-02

Applicant: Youichi Haruta ,  Tomio Kambayashi ,  Hitoshi Kato ,  Hiromu Taguchi

Inventor： Youichi Haruta ,  Tomio Kambayashi ,  Hitoshi Kato ,  Hiromu Taguchi

IPC: H05K1/00 ,  H05K3/00 ,  H05K3/40 ,  H05K3/42 ,  H05K3/46 ,  C23F1/00

CPC classification number: H05K3/4655 ,  H05K3/002 ,  H05K2201/0195 ,  H05K2201/0355 ,  H05K2201/0358 ,  H05K2201/0376 ,  H05K2201/09509 ,  H05K2203/0793 ,  H05K3/4069 ,  H05K3/427 ,  H05K3/4652 ,  H05K3/4676

Abstract: Provided is a method for making a multilayer printed circuit board having blind holes which comprises heat laminating a copper foil and an inner layer panel previously provided with circuit patterns on one or both sides thereof by processing a copper-clad laminate, a resin layer soluble in an aqueous alkali solution and having a flowability upon heating being present between said copper foil and said inner layer panel, forming via holes in the surface copper foil by etching and then dissolving the resin layer under said via holes with an aqueous alkali solution and removing the resin layer, thereby to form blind holes in which the copper foil on the inner layer panel is exposed. Further provided is a copper foil used for making multilayer printed circuit boards, which is provided with a resin layer soluble in an aqueous alkali solution and having flowability upon heating on its roughened surface.

Abstract translation: 提供一种制造具有盲孔的多层印刷电路板的方法，该方法包括通过加工覆铜层压板将铜箔和预先在其一侧或两侧预先设置有电路图案的内层面板热层压，可溶于 在所述铜箔和所述内层板之间存在加热流动性的碱性水溶液，通过蚀刻在所述表面铜箔中形成通孔，然后用碱水溶液将所述树脂层溶解在所述通孔下方，并除去 从而形成露出内层面板上的铜箔的盲孔。 还提供了一种用于制造多层印刷电路板的铜箔，其具有可溶于碱性水溶液的树脂层，并且在其粗糙化表面上加热时具有流动性。