公开(公告)号：US20090301765A1

公开(公告)日：2009-12-10

申请号：US12414780

申请日：2009-03-31

Applicant: Steffen Strauss ,  Michael Weis

Inventor： Steffen Strauss ,  Michael Weis

IPC: H05K7/20

CPC classification number: H05K1/0207 ,  F21K9/00 ,  H01L23/3677 ,  H01L2924/0002 ,  H05K1/0206 ,  H05K2201/09309 ,  H05K2201/09663 ,  H05K2201/10106 ,  H05K2201/10416 ,  H01L2924/00

Abstract: A printed circuit board is provided with at least one via hole, in which a heat dissipating element is arranged, wherein at least one radiant source is arranged on the heat dissipating element. The lighting device is provided with at least one such printed circuit board.

Abstract translation: 印刷电路板设置有至少一个通孔，其中布置有散热元件，其中至少一个辐射源设置在散热元件上。 照明装置设置有至少一个这样的印刷电路板。

公开(公告)号：US07543376B2

公开(公告)日：2009-06-09

申请号：US11622950

申请日：2007-01-12

Applicant: Toyokazu Yoshino ,  Katsuya Okamoto ,  Shigeki Ogata ,  Shinji Morimoto ,  Kouji Nakashima

Inventor： Toyokazu Yoshino ,  Katsuya Okamoto ,  Shigeki Ogata ,  Shinji Morimoto ,  Kouji Nakashima

IPC: H01K3/10

CPC classification number: H05K3/4046 ,  H05K1/0393 ,  H05K3/386 ,  H05K3/4084 ,  H05K3/4614 ,  H05K3/4617 ,  H05K3/462 ,  H05K3/4623 ,  H05K3/4635 ,  H05K2201/0195 ,  H05K2201/0221 ,  H05K2201/0379 ,  H05K2201/043 ,  H05K2201/096 ,  H05K2201/10234 ,  H05K2201/10416 ,  H05K2203/0278 ,  H05K2203/041 ,  H05K2203/082 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/49213

Abstract: Provided is an FPC, which comprises an insulating layer 2, wiring layers 3 and 4 laminated above and under the insulating layer 2, and a layer connection for connecting the wiring layers 3 and 4 electrically. The layer connection is constituted to comprise: a conductor press-fit hole 5 of a cone shape extending through the insulating layer 2 and the upper and lower wiring layers 3 and 4 and expanded to the side of one wiring layer 3; and a conductor 6 filled and press-fitted without any clearance in the conductor press-fit hole such that it is jointed to the wiring upper layer 3 deformed into the cone shape of the conductor press-fit hole 5, and is protruded from the other wiring lower layer 4 to have its surface partially coated and jointed. As a result, the contact area between the wiring layers 3 and 4 and the conductor 6 filled in the conductor press-fit hole 5 can be enlarged to retain the contact strength between the wiring layers 3 and 4 and the conductor 6 sufficiently thereby to provide a high connection reliability for the layer connection.

Abstract translation: 提供一种FPC，其包括绝缘层2，层叠在绝缘层2上方和下方的布线层3和4以及用于电连接布线层3和4的层连接。 层连接构成为包括：延伸穿过绝缘层2和上下布线层3和4的锥形导体压入孔5，并扩展到一个布线层3的侧面; 导体6在导体压配合孔内填充并压配合而没有任何间隙，使其接合到变形为导体压配合孔5的锥形的布线上层3，并从另一个突出 布线下层4以使其表面部分涂覆和接合。 结果，可以扩大布线层3和4与填充在导体压入孔5中的导体6之间的接触面积，以充分地保持布线层3和4与导体6之间的接触强度，从而提供 层连接的高连接可靠性。

公开(公告)号：US07528470B2

公开(公告)日：2009-05-05

申请号：US11292656

申请日：2005-12-02

Applicant: Jurgen Schulz-Harder ,  Andreas Meyer

Inventor： Jurgen Schulz-Harder ,  Andreas Meyer

IPC: H01L23/02

CPC classification number: H05K3/4084 ,  H05K1/0306 ,  H05K3/321 ,  H05K3/328 ,  H05K3/3484 ,  H05K3/4046 ,  H05K2201/0355 ,  H05K2201/0394 ,  H05K2201/068 ,  H05K2201/10416 ,  H05K2203/0195 ,  H05K2203/063 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49144 ,  Y10T29/49218

Abstract: The conductor board has at least one layer of a dielectric provided areally on two mutually opposed faces with at least one metalization on each. There is at least one through contacting in the region of an aperture. The metalizations are applied to cover at least one aperture and are electrically connected to each other through the aperture.

Abstract translation: 导体板具有至少一层电介质，它们设置在两个相互相对的两个面上，每个上至少有一个金属化。 在孔的区域中至少有一个通过接触。 施加金属化以覆盖至少一个孔并且通过孔彼此电连接。

公开(公告)号：US20090040727A1

公开(公告)日：2009-02-12

申请号：US12187737

申请日：2008-08-07

Applicant: Michael Decker

Inventor： Michael Decker

IPC: H05K7/20

CPC classification number: H05K7/205 ,  H01L23/3677 ,  H01L2924/0002 ,  H05K1/0204 ,  H05K1/115 ,  H05K1/181 ,  H05K3/429 ,  H05K2201/0373 ,  H05K2201/10416 ,  H01L2924/00

Abstract: A circuit carrier structure has at least one electronic component and is formed using SMD technology. Underneath the at least one electronic component is arranged a continuous recess in a circuit carrier. A die made of a heat-conducting material is inserted with one end of a joining area into the recess and fixed in place with a layer of heat-conducting cement and connected to the component in a heat-conducting manner. Further the die has on its other side a linkage area, whose cross-sectional area is at least in part of larger dimensions than the recess in the circuit carrier and whose end is connected to a heat sink in a heat-conducting manner.

Abstract translation: 电路载体结构具有至少一个电子部件，并且使用SMD技术形成。 所述至少一个电子部件的下方在电路载体中布置有连续的凹部。 将由导热材料制成的模具插入到连接区域的一端到凹槽中，并用导电粘合剂层固定就位，并以导热方式与组件连接。 此外，模具的另一侧具有连接区域，其横截面积至少部分地大于电路载体中的凹部的尺寸，并且其端部以导热方式连接到散热器。

公开(公告)号：US07480988B2

公开(公告)日：2009-01-27

申请号：US09823464

申请日：2001-03-30

Applicant: Jerry Ok ,  Robert J. Greenberg

Inventor： Jerry Ok ,  Robert J. Greenberg

IPC: H05K3/30 ,  H01R9/00 ,  H01K3/00 ,  H01K3/10 ,  H01K3/22

CPC classification number: H05K3/4046 ,  H01L21/486 ,  H01L23/10 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K2201/10287 ,  H05K2201/10416 ,  Y10T29/49139 ,  Y10T29/49146 ,  Y10T29/49147 ,  Y10T29/49162 ,  Y10T29/49163 ,  Y10T428/24926 ,  H01L2924/00

Abstract: A method and apparatus suitable for forming hermetic electrical feedthroughs in a ceramic sheet having a thickness of ≦40 mils. More particularly, the method yields an apparatus including a hermetic electrical feedthrough which is both biocompatible and electrochemically stable and suitable for implantation in a patient's body. The method involves: (a) providing an unfired, ceramic sheet having a thickness of ≦40 mils and preferably comprising >99% aluminum oxide; (b) forming multiple blind holes in said sheet; (c) inserting solid wires, preferably of platinum, in said holes; (d) firing the assembly of sheet and wires to a temperature sufficient to sinter the sheet material but insufficient to melt the wires; and (e) removing sufficient material from the sheet lower surface so that the lower ends of said wires are flush with the finished sheet lower surface.

公开(公告)号：US20090008137A1

公开(公告)日：2009-01-08

申请号：US12216511

申请日：2008-07-07

Applicant: Takahiko Yokai ,  Toshiki Naito

Inventor： Takahiko Yokai ,  Toshiki Naito

IPC: H05K1/00 ,  H05K3/00

CPC classification number: H05K1/05 ,  H05K1/056 ,  H05K3/44 ,  H05K2201/09745 ,  H05K2201/10416 ,  H05K2203/0323 ,  H05K2203/0369 ,  H05K2203/0723 ,  Y10T29/49124

Abstract: A wired circuit board includes a metal supporting board having a depressed portion, a conductive portion embedded in the depressed portion and formed of a material having a higher conductivity than that of the metal supporting board, an insulating layer formed on the metal supporting board so as to cover the conductive portion, and a plurality of wired formed on the insulating layer in mutually spaced-apart relation so as to oppose to the conductive portion.

Abstract translation: 布线电路板包括具有凹陷部分的金属支撑板，嵌入在凹陷部分中的导电部分，并且由具有比金属支撑板导电性高的材料形成的导电部分形成在金属支撑板上的绝缘层， 覆盖导电部分，并且以互相间隔的关系形成在绝缘层上以与导电部分相对的多个布线。

公开(公告)号：US07468554B2

公开(公告)日：2008-12-23

申请号：US10587480

申请日：2005-03-11

Applicant: Kouji Harada ,  Hiroatsu Tokuda ,  Kazuo Ojima ,  Masayuki Kobayashi

Inventor： Kouji Harada ,  Hiroatsu Tokuda ,  Kazuo Ojima ,  Masayuki Kobayashi

IPC: H01L23/10 ,  H01L23/34

CPC classification number: H01L23/3735 ,  H01L23/36 ,  H01L2224/32225 ,  H05K1/0306 ,  H05K3/0061 ,  H05K3/341 ,  H05K2201/068 ,  H05K2201/10416

Abstract: A heat sink board having a first heat sink and a second heat sink with a smaller linear expansion coefficient than that of the first heat sink and being bonded to the first heat sink to form the heat sink board. The second heat sink is fitted to the first heat sink, and a material of the first heat sink in the vicinity of a boundary between the fitted heat sinks is plastically deformed for close adhesion to the second heat sink. A forming method makes bonding between the first and second heat sinks possible at room temperature, and the heat sink board made of a composite member having a high flat-surface accuracy can be easily and reliably obtained.

Abstract translation: 一种散热板，其具有第一散热器和具有比第一散热器的线膨胀系数小的线性膨胀系数的第二散热器，并且结合到第一散热器以形成散热板。 第二散热器安装在第一散热器上，并且第一散热器的材料在配合的散热器之间的边界附近被塑性变形以与第二散热器紧密附着。 成型方法能够在室温下实现第一和第二散热器之间的接合，并且可以容易且可靠地获得由具有高平面精度的复合部件制成的散热板。

公开(公告)号：US07428979B2

公开(公告)日：2008-09-30

申请号：US11012284

申请日：2004-12-16

Applicant: Bernard Glever ,  Erick Henry ,  José Chenot

Inventor： Bernard Glever ,  Erick Henry ,  José Chenot

IPC: B23K1/012 ,  B23K1/008

CPC classification number: B23K1/012 ,  B23K2101/40 ,  H01L2224/32225 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K1/0204 ,  H05K3/0061 ,  H05K3/341 ,  H05K3/3494 ,  H05K2201/10416 ,  H05K2201/10734 ,  H05K2203/081 ,  H05K2203/111 ,  H01L2924/00012

Abstract: A process for soldering an electronic component onto a support which includes at least one heat drain for the component. The method uses a solder paste which incorporates a stripping flux activated at a first temperature, and a solder alloy melted at a second temperature. The process includes preheating the support on the face opposite the component through the heat drain up to the first temperature, placing the component on the support with the solder paste, heating the component by applying a hot gas at a sufficiently high temperature to bring the solder alloy to the melting temperature.

Abstract translation: 一种用于将电子部件焊接到支撑件上的工艺，所述支撑件包括用于所述部件的至少一个散热器。 该方法使用包含在第一温度下活化的剥离焊剂的焊膏，以及在第二温度下熔化的焊料合金。 该过程包括通过散热器将与元件相反的表面上的支撑件预热至第一温度，将该部件用焊膏放置在支撑体上，通过在足够高的温度下施加热气体来加热部件，以使焊料 合金熔化温度。

公开(公告)号：US07423884B2

公开(公告)日：2008-09-09

申请号：US11079373

申请日：2005-03-14

Applicant: Kouhei Enchi ,  Yoji Ueda

Inventor： Kouhei Enchi ,  Yoji Ueda

IPC: H05K1/18

CPC classification number: H05K1/165 ,  H01F17/0013 ,  H01F17/0033 ,  H05K3/4069 ,  H05K3/4614 ,  H05K2201/086 ,  H05K2201/097 ,  H05K2201/10416

Abstract: A multilayer circuit board includes: two or more layers of electrical insulative base members; and two or more layers of conductive patterned layers. At least two of the conductive patterned layers include coil patterns that will be a part of a coil, through holes are provided at predetermined positions of the electrical insulative base members, the positions being sandwiched between the coil patterns, so as to enable communication between respective end portions of the coil patterns, and conductive paste charged in the through holes allows electrical connection to be established between the respective end portions. The coil is formed so as to be wound in a direction perpendicular to a thickness direction of the multilayer circuit board. With this configuration, a multilayer circuit board can be provided, which facilitates increasing the winding number of a coil and has excellent flexibility of circuit design.

Abstract translation: 多层电路板包括：两层或多层电绝缘基底构件; 和两层或多层导电图案层。 导电图案化层中的至少两个包括将是线圈的一部分的线圈图案，通孔设置在电绝缘基底构件的预定位置处，该位置被夹在线圈图案之间，以便使各个 线圈图案的端部，以及填充在通孔中的导电浆料允许在各个端部之间建立电连接。 线圈被形成为沿与多层电路板的厚度方向垂直的方向缠绕。 利用这种结构，可以提供多层电路板，这有助于增加线圈的绕组数，并且具有优异的电路设计灵活性。

公开(公告)号：US07375288B1

公开(公告)日：2008-05-20

申请号：US10903694

申请日：2004-07-30

Applicant: Sheng Cheang Ch'ng ,  Azizi Abdul Rakman ,  Teik Sean Toh

Inventor： Sheng Cheang Ch'ng ,  Azizi Abdul Rakman ,  Teik Sean Toh

IPC: H05K1/16 ,  H05K3/30

CPC classification number: H05K1/0271 ,  H05K1/181 ,  H05K3/4602 ,  H05K2201/10416 ,  H05K2201/10734 ,  H05K2201/2009 ,  Y10T29/49128 ,  Y10T29/49155

Abstract: In some embodiments, apparatuses and methods for improving ball-grid-array solder joint reliability in printed circuit boards. Such apparatuses may comprise, in an exemplary embodiment, a stiffened printed circuit board defining one or more cavities therein and including one or more stiffening members positioned, respectively, in the one or more cavities. The cavities and embedded stiffening members may be located proximate a ball-grid-array device footprint so as to resist deflection caused by the application of forces to the board by test probe pins during testing. Such methods may include, in an exemplary embodiment, creating one or more cavities in a middle sub-layer of a core layer of a stiffened printed circuit board and inserting one or more stiffening members, respectively, therein. Top and bottom sub-layers may then be secured to top and bottom surfaces of the middle sub-layer to complete the core layer. Other embodiments are also described and claimed.

Abstract translation: 在一些实施例中，用于改善印刷电路板中的球栅阵列焊点可靠性的装置和方法。 在示例性实施例中，这样的装置可以包括在其中限定一个或多个空腔的加强印刷电路板，并且包括分别定位在一个或多个空腔中的一个或多个加强构件。 空腔和嵌入的加强构件可以位于靠近球栅阵列器件覆盖区域，以便抵抗在测试期间由测试探针引脚施加力而引起的偏移。 在示例性实施例中，这样的方法可以包括在加强的印刷电路板的芯层的中间子层中形成分别在其中插入一个或多个加强构件的一个或多个空腔。 然后可以将顶部和底部子层固定到中间子层的顶部和底部表面以完成芯层。 还描述和要求保护其他实施例。