公开(公告)号：US06395991B1

公开(公告)日：2002-05-28

申请号：US08688073

申请日：1996-07-29

Applicant: Robert Charles Dockerty ,  Ronald Maurice Fraga ,  Ciro Neal Ramirez ,  Sudipta Kumar Ray ,  Gordon Jay Robbins

Inventor： Robert Charles Dockerty ,  Ronald Maurice Fraga ,  Ciro Neal Ramirez ,  Sudipta Kumar Ray ,  Gordon Jay Robbins

IPC: H05K103

CPC classification number: H01L23/49811 ,  H01L2224/16 ,  H05K3/3436 ,  H05K2201/094 ,  H05K2201/10992 ,  H05K2203/0415 ,  H05K2203/0465 ,  Y02P70/613

Abstract: Structure and method for reinforcing a solder column grid array attachment of a ceramic or the like substrate to a printed circuit board, the reinforcement providing support for a heat sink which is bonded or affixed by pressure to a structural element of the substrate. In one form, the invention involves the concurrent formation of materially larger solder columns along the perimeter of the substrate in conjunction with the array of thin electrically interconnecting solder columns on the substrate. The reinforcing and electrical signal columns are thereafter aligned and attached by solder reflow to a corresponding pattern of pads on the printed circuit board. The heat sink is thermally connected to a structural element of the substrate by bonding or mechanical compression. Stresses in the solder columns caused by heat sink compressive forces or vibration induced flexing are materially decreased without adding complex or unique manufacturing operations.

Abstract translation: 用于将陶瓷等衬底的焊料柱网格阵列附着加强到印刷电路板的结构和方法，所述加强件为散热器提供支撑，所述散热器通过压力结合或固定到所述衬底的结构元件。 在一种形式中，本发明涉及沿着衬底的周边同时形成物理上较大的焊料柱，同时与衬底上的薄的电互连焊料柱的阵列结合。 然后，加强和电信号柱通过焊料回流对准和附接到印刷电路板上的相应的焊盘图案。 散热器通过结合或机械压缩与衬底的结构元件热连接。 由于散热器的压缩力或振动引起的弯曲引起的焊料柱的应力大幅减少，无需增加复杂或独特的制造操作。

公开(公告)号：US20020059721A1

公开(公告)日：2002-05-23

申请号：US09938402

申请日：2001-08-24

Applicant: International Business Machines Corporation

Inventor： Alan Harris Crudo ,  John Gillette Davis ,  Christian Robert Le Coz ,  Mark Vincent Pierson ,  Amit Kumar Sarkhel ,  Ajit Kumar Trivedi

IPC: H05K003/30

CPC classification number: H05K3/3436 ,  H01L2224/16225 ,  H01L2924/15311 ,  H05K3/0047 ,  H05K3/225 ,  H05K3/341 ,  H05K3/429 ,  H05K2201/0949 ,  H05K2201/10287 ,  H05K2201/10734 ,  H05K2201/10992 ,  H05K2203/041 ,  H05K2203/175 ,  Y02P70/613 ,  Y10T29/49124 ,  Y10T29/49139 ,  Y10T29/49144 ,  Y10T29/49146 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49153 ,  Y10T29/49156 ,  Y10T29/49165 ,  Y10T29/49723 ,  Y10T29/49726 ,  Y10T29/49728 ,  Y10T29/4973 ,  Y10T29/49734 ,  Y10T29/49815 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53274

Abstract: A method and apparatus for efficiently repairing or reworking a printed circuit board having a solder ball grid array thereon efficiently and at minimum cost includes the steps of drilling out a plated-through hole to sever electrical connections between a ball grid array pad on one surface of the printed circuit board and internal circuits and circuits on an opposite surface of the printed circuit board; inserting a pin having an insulated sleeve surrounding a portion thereof into the drilled-out hole, the pin having attached to one end a wire for attachment to the ball grid array on one surface of the printed circuit board and a post at the other end of the pin for attachment of a wire to the post; the pin having a stop along its length to control vertical positioning of the pin in the drilled-out hole, the pin referred to as a via replacement (VR) pin. Alternately, after the plated through hole is drilled out, an insulated wire may be inserted into the hole with insulation removed from the length of the wire which extends beyond one surface of the printed circuit board. The bare length of wire is bent parallel to the surface of the printed circuit board and attached thereto by a solder reflow process. In a dog bone configuration, the wire is formed around a pad on the surface of the printed circuit board which receives the solder ball.

公开(公告)号：US06380494B1

公开(公告)日：2002-04-30

申请号：US09559310

申请日：2000-04-27

Applicant: Allen Thomas Mays ,  Kris Allan Slesinger ,  Michael Camillo Weller

Inventor： Allen Thomas Mays ,  Kris Allan Slesinger ,  Michael Camillo Weller

IPC: H05K116

CPC classification number: B23K35/0222 ,  B23K35/268 ,  H01L2224/16225 ,  H01L2924/00013 ,  H05K3/3436 ,  H05K2201/10992 ,  H05K2203/0415 ,  Y02P70/613 ,  H01L2224/29099

Abstract: A solder interconnection between a module and printed circuit board or card is provided by a plurality of solder connections arranged in a micro grid array joining solder wettable pads on a major surface of the module to a corresponding set of solder wettable pads of the printed circuit board or card. The solder connections are column shaped with the height of each connection being at least about 1.4 times the diameter of the connection.

Abstract translation: 模块和印刷电路板或卡之间的焊料互连通过布置在微格栅阵列中的多个焊料连接来提供，所述微电网阵列将模块的主表面上的焊料可润湿焊盘连接到印刷电路板的相应的可焊接可湿性焊盘组 或卡片。 焊接连接是柱形的，每个连接的高度至少是连接直径的大约1.4倍。

公开(公告)号：US06358630B1

公开(公告)日：2002-03-19

申请号：US09424582

申请日：1999-11-26

Applicant: Kiyotaka Tsukada ,  Hiroyuki Kobayashi ,  Yoshikazu Ukai ,  Kenji Chihara ,  Yoshihide Tohyama ,  Yasuyoshi Okuda ,  Yoshihiro Kodera

Inventor： Kiyotaka Tsukada ,  Hiroyuki Kobayashi ,  Yoshikazu Ukai ,  Kenji Chihara ,  Yoshihide Tohyama ,  Yasuyoshi Okuda ,  Yoshihiro Kodera

IPC: B32B1501

CPC classification number: H05K3/244 ,  B23K35/007 ,  B23K35/262 ,  H01L23/49816 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13157 ,  H01L2224/1357 ,  H01L2224/136 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49109 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/0102 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/1532 ,  H01L2924/181 ,  H05K3/3436 ,  H05K3/3463 ,  H05K2201/0215 ,  H05K2201/10234 ,  H05K2201/10242 ,  H05K2201/10992 ,  H05K2203/041 ,  H05K2203/0415 ,  Y02P70/613 ,  Y10T428/12028 ,  Y10T428/12701 ,  Y10T428/12708 ,  Y10T428/12875 ,  Y10T428/12903 ,  Y10T428/12944 ,  H01L2924/014 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/85399

Abstract: This invention relates to a solder member for external connection joined to a connection terminal formed on a surface of a printed wiring board corresponding to a conductor pattern and having an electroless Ni/Au plated layer, wherein the solder member is a ball-shaped solder containing finely powdered copper and has an excellent joint strength to the connection terminal.

Abstract translation: 本发明涉及一种用于外部连接的焊料构件，其与形成在与导体图案相对应的印刷电路板的表面上的连接端子接合，并且具有无电镀Ni / Au镀层，其中，焊料构件是含有 细铜粉，对连接端子具有优异的接合强度。

公开(公告)号：US06358627B2

公开(公告)日：2002-03-19

申请号：US09768112

申请日：2001-01-23

Applicant: Joseph A. Benenati ,  Claude L. Bertin ,  William T. Chen ,  Thomas E. Dinan ,  Wayne F. Ellis ,  Wayne J. Howell ,  John U. Knickerbocker ,  Mark V. Pierson ,  William R. Tonti ,  Jerzy M. Zalesinski

Inventor： Joseph A. Benenati ,  Claude L. Bertin ,  William T. Chen ,  Thomas E. Dinan ,  Wayne F. Ellis ,  Wayne J. Howell ,  John U. Knickerbocker ,  Mark V. Pierson ,  William R. Tonti ,  Jerzy M. Zalesinski

IPC: H01L2144

CPC classification number: H01L24/16 ,  G01R1/0483 ,  H01L24/11 ,  H01L24/12 ,  H01L24/17 ,  H01L24/83 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/11003 ,  H01L2224/11334 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/1319 ,  H01L2224/17051 ,  H01L2224/2919 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/3025 ,  H01L2924/351 ,  H05K1/111 ,  H05K3/321 ,  H05K2201/0133 ,  H05K2201/0212 ,  H05K2201/0221 ,  H05K2201/0233 ,  H05K2201/10234 ,  H05K2201/10734 ,  H05K2201/10992 ,  H05K2203/0307 ,  Y10T428/12472 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00014

Abstract: An integrated circuit assembly has pads of a chip electrically connected to pads of a substrate with rolling metal balls. A pliable material bonds the balls in movable contact with pads of the chip and substrate. Because the balls are relatively free to move, thermal expansion differences that would ordinarily cause enormous stresses in the attached joints of the prior art, simply cause rolling of the balls of the present invention, avoiding thermal stress altogether. Reliability of the connections is substantially improved as compared with C4 solder bumps, and chips can be safely directly mounted to such substrates as PC boards, despite substantial thermal mismatch.

Abstract translation: 集成电路组件具有与滚动金属球电连接到衬底的焊盘的芯片焊盘。 柔韧的材料将球与芯片和衬底的焊盘可动地接触。 由于球相对自由移动，因此在现有技术的连接接头中通常会引起巨大应力的热膨胀差异简单地导致本发明的滚珠滚动，从而完全避免热应力。 与C4焊料凸块相比，连接的可靠性大大提高，尽管存在大量的热失配，芯片可以安全地直接安装到诸如PC板的基板上。

公开(公告)号：US20020028327A1

公开(公告)日：2002-03-07

申请号：US09911069

申请日：2001-07-23

Inventor： Charles H. Perry ,  Mark G. Courtney ,  Lewis S. Goldman ,  Gregory R. Martin

IPC: C09J001/00

CPC classification number: H01L24/10 ,  B23K2101/36 ,  H01L24/13 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/05001 ,  H01L2224/05023 ,  H01L2224/0508 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29364 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/09701 ,  H01L2924/14 ,  H05K3/321 ,  H05K3/3436 ,  H05K2201/0129 ,  H05K2201/10674 ,  H05K2201/10734 ,  H05K2201/10992 ,  Y02P70/613 ,  Y10T428/256 ,  Y10T428/26 ,  Y10T428/31678 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929

Abstract: A method of forming an electrical connection between two devices is disclosed. In an exemplary embodiment of the invention, the method includes soldering a second solderable cap of an interconnection to a first contact pad of a first component. The interconnection further includes a conductive polymer comprising a polymer component and a conductive component A first solderable cap is disposed in contact with the conductive polymer, and the second solderable cap is disposed in contact with the conductive polymer opposite the first solderable cap. The first solderable cap is then soldered to a second contact pad of a second component.

Abstract translation: 公开了一种在两个装置之间形成电连接的方法。 在本发明的示例性实施例中，该方法包括将互连的第二可焊接帽焊接到第一部件的第一接触焊盘。 互连还包括包含聚合物组分和导电组分的导电聚合物。第一可焊接帽设置成与导电聚合物接触，并且第二可焊接帽设置成与第一可焊接帽相对的导电聚合物接触。 然后将第一可焊接帽焊接到第二部件的第二接触焊盘。

公开(公告)号：US06350669B1

公开(公告)日：2002-02-26

申请号：US09699888

申请日：2000-10-30

Applicant: Han-Ping Pu ,  Chien-Ping Huang

Inventor： Han-Ping Pu ,  Chien-Ping Huang

IPC: H01L2144

CPC classification number: H01L24/11 ,  H01L21/4846 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/11334 ,  H01L2224/13099 ,  H01L2224/14505 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H05K3/3436 ,  H05K3/3463 ,  H05K2201/094 ,  H05K2201/10234 ,  H05K2201/10992 ,  H05K2203/041 ,  Y02P70/613 ,  H01L2224/05599

Abstract: A method is proposed for bonding a BGA (Ball Grid Array) package to a circuit board without causing the collapsing of the BGA package against the circuit board. The proposed method is characterized in the use of two groups of solder balls of different reflow collapse degrees, which are arranged in an interspersed manner among each other in the ball grid array. In one embodiment, the first group of solder balls are homogenously made of a solder material of a specific melting point; and the second group of solder balls each include an outer portion and a core portion, with the outer portion having substantially the same melting point as the first group of solder balls, and the core portion being greater in melting point than the outer portion. In another embodiment, the second group of solder balls are greater in melting point than the first group of solder balls. During the solder-reflow process, when the first group of solder balls are entirely melted, the second group of solder balls are only partly melted or entirely unmelted and thus are capable of providing a solid support to the BGA package to prevent the collapsing of BGA package against circuit board.

Abstract translation: 提出了一种用于将BGA（球栅阵列）封装结合到电路板而不引起BGA封装相对于电路板折叠的方法。 所提出的方法的特征在于使用不同回流塌陷度的两组焊球，其在球栅阵列中以散布的方式相互排列。 在一个实施例中，第一组焊球由具有特定熔点的焊料均质地制成; 并且第二组焊球各自包括外部部分和芯部分，外部部分具有与第一组焊球基本相同的熔点，并且芯部分的熔点大于外部部分。 在另一个实施例中，第二组焊球的熔点高于第一组焊球。 在焊料回流工艺期间，当第一组焊球完全熔化时，第二组焊球仅部分熔化或完全未熔化，因此能够为BGA封装提供固体支撑以防止BGA的塌陷 封装电路板。

公开(公告)号：US06342443B1

公开(公告)日：2002-01-29

申请号：US09346735

申请日：1999-07-02

Applicant: Su Tao ,  Wei-Chung Wang ,  Jen-Kuang Fang

Inventor： Su Tao ,  Wei-Chung Wang ,  Jen-Kuang Fang

IPC: H01L2144

CPC classification number: H01L24/14 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/1131 ,  H01L2224/1184 ,  H01L2224/11849 ,  H01L2224/13111 ,  H01L2224/1357 ,  H01L2224/136 ,  H01L2224/81211 ,  H01L2224/81801 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15787 ,  H05K3/3436 ,  H05K3/3463 ,  H05K2201/0379 ,  H05K2201/10992 ,  H05K2203/013 ,  Y02P70/613 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2224/0401

Abstract: A packaging process providing a die with C4 solder bumps and a polymer substrate first. It then jets the melted second solder onto each of the C4 solder bumps forming a second solder bump. After reflowing and leveling the solder bumps, the die is flipped and combined with the substrate. Then heat treatment proceeds with the combination of the die and the substrate forming a flip chip package with collapse-controlled solder bump on the polymer substrate.

Abstract translation: 首先提供具有C4焊料凸块的模具和聚合物基板的封装工艺。 然后将熔化的第二焊料喷射到形成第二焊料凸块的每个C4焊料凸块上。 在回流和调平焊料凸块之后，将模具翻转并与基板组合。 然后热处理随着管芯和衬底的组合进行，在聚合物衬底上形成具有塌陷控制的焊料凸块的倒装芯片封装。

公开(公告)号：US20010050181A1

公开(公告)日：2001-12-13

申请号：US09811445

申请日：2001-03-20

Inventor： Kazuma Miura ,  Hanae Shimokawa ,  Koji Serizawa ,  Tasao Soga ,  Tetsuya Nakatsuka

IPC: H05K001/03

CPC classification number: H05K3/3463 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05644 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2924/15311 ,  H05K3/3436 ,  H05K2201/10992 ,  Y02P70/613 ,  Y10T428/12715 ,  H01L2924/00014 ,  H01L2924/00

Abstract: The object of the invention is to obtain solder bonding of high reliability in which the heat resisting properties of a circuit substrate and electronic parts are taken into consideration. In order to achieve the object, there are provided semiconductor devices each having solder bumps as external pads, and a circuit substrate bonded to the external pads of each of the semiconductor devices through a solder paste, each of the solder bumps being made of a first lead-free solder, the solder paste being made of a second lead-free solder having a melting point lower than that of the first lead-free solder.

Abstract translation: 本发明的目的是获得考虑到电路基板和电子部件的耐热性能的高可靠性的焊接接合。 为了实现该目的，提供了各自具有作为外部焊盘的焊料凸块的半导体器件，以及通过焊膏将每个半导体器件的外部焊盘接合的电路基板，每个焊料凸块由第一 无铅焊料，焊膏由熔点低于第一无铅焊料的第二无铅焊料制成。

公开(公告)号：US06281105B1

公开(公告)日：2001-08-28

申请号：US09382401

申请日：1999-08-24

Applicant: John Michael Cotte ,  Judith Marie Roldan ,  Carlos Juan Sambucetti ,  Ravi F. Saraf

Inventor： John Michael Cotte ,  Judith Marie Roldan ,  Carlos Juan Sambucetti ,  Ravi F. Saraf

IPC: H01L2144

CPC classification number: H01L24/12 ,  H01L23/49816 ,  H01L23/49883 ,  H01L24/11 ,  H01L24/83 ,  H01L2224/11822 ,  H01L2224/13099 ,  H01L2224/13311 ,  H01L2224/13411 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/81011 ,  H01L2224/83193 ,  H01L2224/838 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/157 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/1579 ,  H01L2924/19043 ,  H05K3/284 ,  H05K3/288 ,  H05K3/3436 ,  H05K3/3484 ,  H05K2201/035 ,  H05K2201/10977 ,  H05K2201/10992 ,  Y02P70/613 ,  Y10T29/49165 ,  Y10T428/12063 ,  Y10T428/12104 ,  Y10T428/12528 ,  Y10T428/12569 ,  Y10T428/12687 ,  Y10T428/12701 ,  Y10T428/12708 ,  Y10T428/12889 ,  Y10T428/31678 ,  H01L2924/00 ,  H01L2224/0401

Abstract: A paste is described for capping electrodes with an oxide free metal layer incorporating a solvent, an unzippable polymer and particles. The electrode could be an interconnect such as a C4 bump. A method for forming a coating and for testing integrated circuit chips is also described. The invention overcomes the problem of interconnecting Pb containing electrodes that are covered with an insulating oxide on integrated circuit chips by coating the Pb containing electrode with Au to provide an oxide free surface for testing and interconnection.

Abstract translation: 描述了一种糊状物，用掺有溶剂的无氧化物金属层，不可剥离的聚合物和颗粒来覆盖电极。 电极可以是诸如C4凸起的互连。 还描述了用于形成涂层的方法和用于测试集成电路芯片的方法。 本发明克服了通过用含有Pb的电极与Au一起涂覆由集成电路芯片上的绝缘氧化物覆盖的含Pb电极来提供无氧化物表面进行测试和互连的问题。