公开(公告)号：US10792710B2

公开(公告)日：2020-10-06

申请号：US15944986

申请日：2018-04-04

Applicant: SYSMEX CORPORATION

Inventor： Mitsuo Yamasaki ,  Noriyuki Nakanishi ,  Masahiko Fukushima ,  Hiroyuki Koga

IPC: B08B3/08 ,  G01N1/28 ,  C11D3/04 ,  B08B7/02 ,  B08B3/04 ,  B05C11/02 ,  G01N35/00 ,  G01N35/02 ,  G01N1/31

Abstract: Disclosed is a method for washing a smearing member, the method including: dropping a washing agent on a glass slide; and causing the smearing member to be in contact with the washing agent on the glass slide, to wash the smearing member.

公开(公告)号：US20200238607A1

公开(公告)日：2020-07-30

申请号：US16258111

申请日：2019-01-25

Applicant: Delavan Inc.

Inventor： Diana Giulietti ,  David W. Morganson

IPC: B29C64/188 ,  B29C64/153 ,  B05C11/02 ,  B22F3/105

Abstract: An additive manufacturing device includes a recoater configured to push powder onto a build platform. The recoater defines an advancing direction for pushing powder. A first baffle is mounted to a first end of a leading edge of the recoater and a second baffle mounted to a second end of the leading edge of the recoater opposite the first end. Each of the first and second baffles includes a base mounted to the recoater, a first wall that extends obliquely ahead of and laterally outward from the base relative to the advancing direction, and a second wall opposite the first wall. The second wall extends obliquely ahead of and laterally inward from the base relative to the advancing direction. A volume is defined between the first and second wall with capacity to collect powder as the recoater advances.

公开(公告)号：US10722964B2

公开(公告)日：2020-07-28

申请号：US16085867

申请日：2016-03-18

Applicant: FUJI CORPORATION

Inventor： Shoji Fukakusa ,  Kento Asaoka

IPC: B23K3/00 ,  B23K3/06 ,  H05K3/12 ,  B05C5/00 ,  B05C11/10 ,  G01F22/02 ,  B05C11/02 ,  H05K3/34 ,  B05C3/18 ,  B23K101/42

Abstract: In solder printer, solder supply device uses positive and negative pressure supply device to apply pressure inside air chamber to move solder cup inside outer tube, such that solder paste is supplied from supply nozzle. Controller, when supply of solder paste from supply nozzle is stopped, performs drive control of positive and negative pressure supply device to decrease the pressure inside air chamber, and uses timer to measure the time required from the starting of decreasing the pressure inside the air chamber to when the pressure inside air chamber has reached a set pressure. Because this required time corresponds to the movement amount of solder cup from the start of supply of the solder paste to when supply is stopped, controller using the measured required to estimate the remaining amount of the solder paste in detail with good accuracy.

公开(公告)号：US10699919B2

公开(公告)日：2020-06-30

申请号：US16111510

申请日：2018-08-24

Applicant: TOKYO ELECTRON LIMITED

Inventor： Ryoichi Uemura

IPC: H01L21/67 ,  H01L51/00 ,  B05B14/30 ,  B05C11/02 ,  H01L21/673 ,  H01L21/687

Abstract: A coating processing apparatus includes: a substrate holding part for horizontally holding a substrate and configured to rotate around a vertical axis; a coating liquid supply part for supplying a coating liquid onto the substrate; a cup body surrounding the substrate; an annular exhaust path formed along a circumferential direction of the cup body between an inner peripheral surface of the cup body and an inner member installed inside the cup body; a coating liquid collecting member installed to cover the exhaust path and having an opening, and configured to collect the coating liquid scattering from the substrate; at least one solvent storage portion formed in the coating liquid collecting member and configured to store a first solvent for dissolving the coating liquid collected in the coating liquid collecting member; and a solvent supply part for supplying the first solvent to the at least one solvent storage portion.

公开(公告)号：US10682663B2

公开(公告)日：2020-06-16

申请号：US16176875

申请日：2018-10-31

Applicant: The Boeing Company

Inventor： John W. Pringle, IV ,  Angelica Davancens ,  Branko Sarh

IPC: G01F11/02 ,  B05C1/04 ,  B05C1/00 ,  B05C11/02 ,  B05C11/10 ,  B05C5/02

Abstract: A method for dispensing a flowable material is disclosed. The method comprises holding a hydraulic fluid in a reservoir at a negative pressure, inserting a cartridge tube, having an interior, into a cartridge housing, locking an over-center mechanism relative to the cartridge housing so that a hermetic seal is created between a plunger and an interior of the cartridge tube and between an end-cap and the interior of the cartridge tube, and turning a rotary actuator in a rotational direction so that a linear actuator advances a piston within the reservoir to transfer at least a portion of the hydraulic fluid from the reservoir to a flowable-material dispenser through the end-cap and into the interior of the cartridge tube, causing the plunger to advance within the cartridge tube in a forward plunger direction, away from the end-cap.

公开(公告)号：US20200086341A1

公开(公告)日：2020-03-19

申请号：US16694616

申请日：2019-11-25

Applicant: IO Tech Group Ltd.

Inventor： Michael Zenou ,  Ziv Gilan

IPC: B05D1/26 ,  B05D1/40 ,  B05D7/00 ,  B05C11/02 ,  B05C11/10 ,  B05C5/02

Abstract: Systems and methods for dispensing liquid materials as may be used in applications for coating flexible films and the like. Such a film may be coated by dispensing a rheological material onto its surface while drawing the film through a gap between a pair of rollers. The gap defines the thickness of a layer of the material applied to the film and is maintained at a desired width by microwires positioned through the gap. Another film across the gap from that to which the rheological material is applied aids in the coating of the layer and a contact area of the second film may be adjusted relative to the gap, e.g., when changing materials or when the coating film becomes abraded or deformed.

公开(公告)号：US10576494B2

公开(公告)日：2020-03-03

申请号：US15601653

申请日：2017-05-22

Applicant: CORNING INCORPORATED

Inventor： Michael Timothy Brennan ,  Brian Charles Cook ,  Sean Thomas Miller ,  Brian Christopher Sheehan ,  Christopher Lee Timmons

IPC: B05C13/00 ,  B05C13/02 ,  B05C11/02 ,  C03C17/00 ,  B65D23/08 ,  C03C17/32 ,  B65D65/42 ,  B65B21/12 ,  B05B13/02 ,  B65B21/18 ,  A61J1/14 ,  B65D23/02 ,  B65G47/90

Abstract: A glass body support assembly that supports a glass container body in an upright position includes a collet body and clamping fingers that clamp onto a necked-down portion of the glass container body. The collet body has a gas purge passageway extending therethrough to deliver pressurized gas to an interior of the glass container body.

公开(公告)号：US10427177B2

公开(公告)日：2019-10-01

申请号：US15338572

申请日：2016-10-31

Applicant: Corning Optical Communications LLC

Inventor： Bradley Jerome Blazer ,  Craig Miller Conrad ,  Ming Li ,  Warren Welborn McAlpine

IPC: B05B7/14 ,  B05C19/04 ,  H01B13/14 ,  B05B14/48 ,  B05B16/40 ,  B05B16/00 ,  B05D1/12 ,  B21C23/30 ,  G02B6/44 ,  B05C11/02

Abstract: A recirculating powder applicator includes an applicator body having an inlet on an upstream surface and an outlet on a downstream surface, wherein the inlet and outlet define a passage that extends transversely through the thickness of the applicator body, a powder conduit, an air inlet, an exhaust aperture located on one of the upstream or downstream surfaces, and a circulation chamber located on the interior of the applicator body. The powder conduit and air inlet are in fluid communication with the passage and the passage is in fluid communication with the circulation chamber. A method of applying powder to a substrate during a continuous process includes using a recirculating powder applicator.

公开(公告)号：US20190291310A1

公开(公告)日：2019-09-26

申请号：US16338481

申请日：2017-09-25

Applicant: UNIWERSYTET JAGIELLONSKI

Inventor： Kamil AWSIUK ,  Jakub RYSZ ,  Mateusz MARZEC ,  Andrzej BUDKOWSKI

IPC: B29C41/50 ,  B29C41/12 ,  B29D7/01 ,  B05C11/02 ,  C08J5/18

Abstract: A device for producing polymer films having a predefined spatial structure. The device includes: a linear stage, a platform for a substrate, a cylinder for spreading a polymer solution layer over the substrate to deposit a polymer film onto the substrate, a cylinder height adjustment system, a control system for adjusting a height and tilt of the cylinder in relation to the substrate, a controllable voltage source, one or more metallic electrodes fixed onto the cylinder. The substrate onto which the polymer film is deposited is conductive for electric current. Electric voltage from the controllable voltage source is applied between the metallic electrode and the substrate during deposition of the polymer film onto the substrate.

公开(公告)号：US10265720B2

公开(公告)日：2019-04-23

申请号：US15841746

申请日：2017-12-14

Applicant: SIKA TECHNOLOGY AG

Inventor： Bruce Baker

IPC: B05C11/02 ,  E04D15/06 ,  B05C3/12 ,  B05C3/08 ,  H01B13/32 ,  B05C11/10 ,  E04D15/04 ,  B05C9/08 ,  B05C9/04

Abstract: A device for coating material with resin and subsequently laying the material saturated with the resin onto a surface, the device comprising a vessel for retaining the resin, the vessel having a slot sized and configured so that the material is passable through the slot after being coated with resin retained in the vessel, and a first and a second roller being arranged on either side of the slot or behind the slot.