公开(公告)号：US08911240B2

公开(公告)日：2014-12-16

申请号：US13843556

申请日：2013-03-15

Applicant: Samtec, Inc.

Inventor： Gary Ellsworth Biddle ,  Christopher Warren Shelly

IPC: H01R12/00 ,  H01R12/70 ,  H05K1/11

CPC classification number: H01R12/7005 ,  H01R24/50 ,  H05K1/0219 ,  H05K1/111 ,  H05K2201/09063 ,  H05K2201/09618 ,  H05K2201/10189 ,  Y02P70/611

Abstract: A connector includes a housing including a conductive material, a base connected to the housing and including a base center hole and a base groove extending from the base center hole to an edge of the base, a center pin including a first portion and a second portion extending perpendicular or substantially perpendicular to the first portion, and a dielectric. The dielectric includes a first portion extending through the base center hole and including a dielectric center hole through which the first portion of the center pin extends and a second portion extending perpendicular or substantially perpendicular to the first portion of the dielectric along the base groove and including a dielectric groove along which the second portion of the center pin extends.

Abstract translation: 连接器包括：壳体，其包括导电材料;基座，连接到所述壳体，并且包括基座中心孔和从所述基座中心孔延伸到所述基座的边缘的基部槽，所述中心销包括第一部分和第二部分 垂直于或基本上垂直于第一部分延伸的电介质。 电介质包括延伸穿过基座中心孔并且包括中心销的第一部分延伸的电介质中心孔的第一部分和沿着基底槽垂直或基本上垂直于电介质的第一部分延伸的第二部分，并且包括 电介质槽，中心销的第二部分沿其延伸。

公开(公告)号：US08894423B2

公开(公告)日：2014-11-25

申请号：US13780339

申请日：2013-02-28

Applicant: Samtec, Inc.

Inventor： John Mongold ,  Randall Musser ,  Brian Vicich ,  Neal Patterson

IPC: H01R12/00 ,  H01R13/02 ,  H01R13/428 ,  H01R13/41 ,  H01R12/57 ,  H01R13/11 ,  H01R12/71

CPC classification number: H01R13/02 ,  H01R9/091 ,  H01R12/57 ,  H01R12/716 ,  H01R13/11 ,  H01R13/41 ,  H01R13/428

Abstract: A contact includes a head, a tail including an opening, a body connected at one end thereof to the head and at another end thereof to the tail, a first lance and a second lance extending from the body, a dimple raised from the body, and a solder member attached to the tail such that the solder member engages at least a portion of the opening. The first lance and the second lance are arranged to deflect when the contact is inserted into a connector; and the first lance, the second lance, and the dimple are arranged to frictionally secure the contact to the connector.

Abstract translation: 触点包括头部，包括开口的尾部，在其一端连接到头部并且在其另一端连接到尾部的主体，从主体延伸的第一枪和第二枪，从主体升起的凹坑， 以及附接到尾部的焊料构件，使得焊料构件与开口的至少一部分接合。 第一喷枪和第二喷枪布置成当接触件插入连接器时偏转; 并且第一长矛，第二长矛和凹坑被布置成将触点摩擦地固定到连接器。

公开(公告)号：US20140286646A1

公开(公告)日：2014-09-25

申请号：US14295367

申请日：2014-06-04

Applicant: Samtec, Inc.

Inventor： Eric ZBINDEN ,  Randall MUSSER ,  Jean-Marc André VERDIELL ,  John MONGOLD ,  Brian VICICH ,  Keith GUETIG

IPC: H04B10/40

CPC classification number: G02B6/4284 ,  G02B6/4232 ,  G02B6/4246 ,  G02B6/4249 ,  G02B6/4261 ,  G02B6/4269 ,  G02B6/4278 ,  G02B6/4279 ,  G02B6/428 ,  G02B6/4292 ,  G02B6/4293 ,  H01L2224/48091 ,  H01L2224/49175 ,  H01R12/716 ,  H01R13/639 ,  H04B1/3833 ,  H04B10/2504 ,  H04B10/27 ,  H04B10/40 ,  H04B10/801 ,  H04B10/803 ,  H05K7/20418 ,  H01L2924/00014

Abstract: An interconnect system includes a first circuit board, first and second connectors connected to the first circuit board, and a transceiver including an optical engine and arranged to receive and transmit electrical and optical signals through a cable, to convert optical signals received from the cable into electrical signals, and to convert electrical signals received from the first connector into optical signals to be transmitted through the cable. The transceiver is arranged to mate with the first and second connectors so that at least some converted electrical signals are transmitted to the first connector and so that at least some electrical signals received from the cable are transmitted to the second connector.

Abstract translation: 互连系统包括第一电路板，连接到第一电路板的第一和第二连接器，以及收发器，包括光引擎，并被布置成通过电缆接收和发送电信号和光信号，以将从电缆接收的光信号转换为 电信号，以及将从第一连接器接收的电信号转换为通过电缆传输的光信号。 收发器布置成与第一和第二连接器配合，使得至少一些转换的电信号被传输到第一连接器，使得从电缆接收的至少一些电信号被传送到第二连接器。

公开(公告)号：US20140213124A1

公开(公告)日：2014-07-31

申请号：US13753715

申请日：2013-01-30

Applicant: SAMTEC, INC.

Inventor： Feng-Nan WU ,  Chia-Chi CHENG

IPC: H01R13/05

CPC classification number: H01R13/05 ,  H01R12/585 ,  H01R13/6467 ,  H01R2107/00

Abstract: A connector includes at least one first contact and at least one second contact. Each of the at least one first contact and the at least one second contact includes a tail with a leg extending therefrom and an arm with a contact section arranged to electrically couple with a corresponding contact when the connector is mated to an electrical device or another connector. The leg of each of the at least one first contact is offset with respect to the leg of each of the at least one second contact.

Abstract translation: 连接器包括至少一个第一接触件和至少一个第二接触件。 所述至少一个第一接触件和所述至少一个第二接触件中的每一个包括具有从其延伸的腿部的尾部和具有接触部分的臂，所述接触部分布置成当所述连接器配合到电气设备或另一连接器时与相应的接触件电耦合 。 所述至少一个第一接触件中的每一个的腿部相对于所述至少一个第二接触件中的每一个的腿部偏移。

公开(公告)号：USD708580S1

公开(公告)日：2014-07-08

申请号：US29478995

申请日：2014-01-10

Applicant: Samtec, Inc.

Designer： Douglas Edward McCartin ,  James Edward Borgelt ,  Dale Francis Schmelz ,  Joseph Travis Newton ,  Chunhsien Hsu

公开(公告)号：USD708145S1

公开(公告)日：2014-07-01

申请号：US29478997

申请日：2014-01-10

Applicant: Samtec, Inc.

Designer： Douglas Edward McCartin ,  James Edward Borgelt ,  Dale Francis Schmelz ,  Joseph Travis Newton ,  Chunhsien Hsu

公开(公告)号：US20140034363A1

公开(公告)日：2014-02-06

申请号：US13957089

申请日：2013-08-01

Applicant: Samtec, Inc.

Inventor： Gary Ellsworth BIDDLE

IPC: H05K1/02

CPC classification number: H01P3/081 ,  H01P3/026 ,  H01P5/028 ,  H01P5/08 ,  H05K1/0216 ,  H05K1/0219 ,  H05K1/0228 ,  H05K1/0237 ,  H05K1/0245 ,  H05K1/025 ,  H05K1/115 ,  H05K1/118 ,  H05K1/14 ,  H05K2201/09236 ,  H05K2201/09672 ,  H05K2201/097 ,  H05K2201/09781 ,  H05K2201/0979

Abstract: A substrate including a first transmission line arranged to transmit electrical signals and including first and second traces and a first dielectric layer. The first and second traces are separated from each other by the first dielectric layer. A printed circuit board includes a first transmission line arranged to transmit electrical signals and including first, second, and third traces; and a first dielectric layer. The first and second traces are separated from the third trace by the first dielectric layer.

公开(公告)号：US20040192081A1

公开(公告)日：2004-09-30

申请号：US10822340

申请日：2004-04-12

Applicant: SAMTEC, Inc.

Inventor： Stephen P. Koopman ,  Joshua Ferry

IPC: H01R012/00

CPC classification number: H01R13/2435

Abstract: A connector assembly for providing electrical continuity between an array of contacts on an electrical component and a corresponding array of contacts on a printed circuit board. The connector assembly includes a plurality of floating pins. Floatation of the pin within a receptacle of the component body provides a first mode of compliance for electrical components, connector assemblies and printed circuit boards that are not coplanar. For a second mode of compliance to account for non-planarity, each pin includes an elongated, elastically deformable cantilever beam. Each pin is adapted and configured to accommodate the deformed cantilever beam of an adjacent pin without mechanical or electrical contact or interference.

公开(公告)号：US20250149834A1

公开(公告)日：2025-05-08

申请号：US18833466

申请日：2023-01-27

Applicant: SAMTEC, INC.

Inventor： Randall Eugene MUSSER ,  Jonathan E. BUCK ,  Madhumitha RENGARAJAN

IPC: H01R13/6587 ,  H01R12/72 ,  H01R13/6477

Abstract: An electrical connector includes a connector housing that supports a plurality of leadframe assemblies that include a ground plate and a signal wafer that abuts the ground plate. The signal wafer of one leadframe assembly is spaced from the ground plate of an adjacent signal wafer so as to define an air gap therebetween. A housing portion defines at least one, at least two, at least three or three or more discrete, adjustable skew correction areas, skew voids or respective air voids.

公开(公告)号：US12244084B2

公开(公告)日：2025-03-04

申请号：US17768681

申请日：2020-11-12

Applicant: Samtec, Inc.

Inventor： Christina Kozlovsky ,  Jignesh H. Shah ,  Eric J. Zbinden

IPC: H01R12/70 ,  H01R12/71 ,  H01R12/75 ,  H01R13/6583 ,  H04B1/38

Abstract: An interconnection system is configured to be carried by a substrate and includes a cage that is configured to be connected to the substrate, that includes a first end and a second end opposed to the first end, and that is configured to receive an interconnection module; and an electrical connector located at the second end of the cage. The electrical connector includes a fixed connector that is configured to be rigidly attached to the substrate and a detachable connector that is configured to be mated and unmated from the fixed connector.