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    TRANSMISSION STRUCTURE OF ANTENNA AND PROXIMITY SENSING CIRCUIT
    51.
    发明申请
    TRANSMISSION STRUCTURE OF ANTENNA AND PROXIMITY SENSING CIRCUIT 有权

    公开(公告)号：US20220021408A1

    公开(公告)日：2022-01-20

    申请号：US17218625

    申请日：2021-03-31

    Applicant: SENSORTEK TECHNOLOGY CORP.

    Inventor： YU-MENG YEN ,  CHIH-YU LIN

    IPC: H04B1/3827 ,  H01Q1/24

    Abstract: The present application provides a transmission structure of an antenna and a proximity sensing circuit. The transmission structure includes a transmission line and at least one radio-frequency short-circuit element, a first coupling end of the transmission line is coupled to an antenna, and a second coupling end of the transmission line is coupled to a proximity sensing circuit, and the at least one radio-frequency short-circuit element is coupled between the transmission line and a ground, and is located between the antenna and the proximity sensing circuit. Utilizing the at least one radio-frequency short-circuit element in conjunction with the transmission line so that the transmission path between the antenna and the proximity sensing circuit has the high impedance, and hence preventing a radio-frequency signal from the antenna from affecting the sensing accuracy of the proximity sensing circuit.

    LIGHT SENSOR MODULE
    53.
    发明申请
    LIGHT SENSOR MODULE 有权

    公开(公告)号：US20210285816A1

    公开(公告)日：2021-09-16

    申请号：US17082373

    申请日：2020-10-28

    Applicant: SENSORTEK TECHNOLOGY CORP.

    Inventor： FENG-JUNG HSU ,  TSUNG-HUA WU

    IPC: G01J1/42 ,  G09G3/34

    Abstract: The present application provides a light sensor module, which comprise a display element, a first polarizing element, a light sensor, a transparent layer, and a second polarizing element. The display element emits a display light source. The first polarizing element covers the display element, and blocks a first phase portion of the display light source and allows a second phase portion of the display light source to penetrate. The transparent layer covers the first polarizing element. The light sensor is disposed on one side of the display element or the first polarizing element. The second polarizing element is disposed between the light sensor and the transparent layer and blocks a second phase portion of the display light source.

    LIGHT SENSOR CIRCUIT
    55.
    发明申请
    LIGHT SENSOR CIRCUIT 有权

    公开(公告)号：US20250007474A1

    公开(公告)日：2025-01-02

    申请号：US18594576

    申请日：2024-03-04

    Applicant: SENSORTEK TECHNOLOGY CORP.

    Inventor： Hsing-Chien Chu ,  Tsung-Han Wu ,  Chi-Hsuan Sun ,  Meng-Yong Lin

    IPC: H03F3/45 ,  G01J1/44 ,  G01J1/46

    Abstract: The present application discloses a light sensor circuit comprising a first amplifier, a second amplifier and an active load. An integration circuit is formed by the operation of this light sensor circuit and connected to a photodiode. The cathode of the photodiode is controlled to maintain an identical or approximate voltage level with the anode of the photodiode, which significantly reduces the influence of the dark current from the photodiode. Consequently, when applied to an analog-to-digital conversion device, the light sensor circuit effectively maintains the performance and accuracy of the device. Additionally, this design significantly reduces circuit complexity and manufacturing costs.

    Light Sensor Structure and Packaging Method thereof
    56.
    发明申请
    Light Sensor Structure and Packaging Method thereof 有权

    公开(公告)号：US20250006748A1

    公开(公告)日：2025-01-02

    申请号：US18597970

    申请日：2024-03-07

    Applicant: SENSORTEK TECHNOLOGY CORP.

    Inventor： Ping-Jung Chiang ,  Liang-Kuang Wei ,  Yi-Feng Chang

    IPC: H01L27/144 ,  H01L25/16 ,  H01L33/00 ,  H01L33/62

    Abstract: A light sensor structure and a packaging method thereof are disclosed. The light sensor structure comprises a light emitting element, a light sensing element, an opaque molding substance, an insulation layer and a connection layer. The opaque molding substance encloses the light emitting element and the light sensing element, and the opaque molding substance is provided with a via. The insulation layer is disposed on the bottom surface of the light emitting element, and the insulation layer is provided with a number of connection pads on a side away from the light emitting element and the light sensing element. The connection pads are electrically connected to the contacts on the bottom surface of the light emitting element through the connection layer, and the connection pads are electrically connected to the contacts on the light sensing surface of the light sensing element through the connection layer and the via.

    Inertial Sensor
    57.
    发明申请
    Inertial Sensor 有权

    公开(公告)号：US20240425357A1

    公开(公告)日：2024-12-26

    申请号：US18242136

    申请日：2023-09-05

    Applicant: SENSORTEK TECHNOLOGY CORP.

    Inventor： Shih-Yuan LIU ,  Chao-Shiun WANG ,  Shih-Wei LEE

    IPC: B81B3/00

    Abstract: The present application provides an inertial sensor, which comprising an anchor point, a first sensing proof mass, and a second sensing proof mass. The first sensing proof mass and the second sensing proof mass are connected with the anchor point by a corresponding flexible member. Each of the first sensing proof mass and the second sensing proof mass is provided with a groove to create mass imbalance on two sides of the flexible member for sensing accelerations in an out-of-plane direction. By mounting electrodes in a plane direction and in the grooves, in-plane accelerations orthogonal to each other are sensed.

    Optoelectronic Semiconductor Structure
    58.
    发明公开
    Optoelectronic Semiconductor Structure 审中-公开

    公开(公告)号：US20240234618A1

    公开(公告)日：2024-07-11

    申请号：US18140692

    申请日：2023-04-28

    Applicant: SENSORTEK TECHNOLOGY CORP.

    Inventor： Ching-Kuan Chiu

    IPC: H01L31/113

    CPC classification number: H01L31/1136

    Abstract: The present invention provides an optoelectronic semiconductor structure, which comprises a first-type semiconductor substrate, a second-type semiconductor light-receiving region, and a second-type semiconductor conduction region. The first-type semiconductor substrate includes a top surface. The second-type semiconductor conduction region is used to conduct a photocurrent. The second-type semiconductor light-receiving region is located on the periphery of the second-type semiconductor conduction region. The second-type semiconductor conduction region and the second-type semiconductor light-receiving region are spaced by a distance. By dividing into the semiconductor conduction region and the light-receiving region, the effect of reducing the junction capacitance while maintaining the light-receiving capability can be achieved and thus further enhancing the photoelectric conversion efficiency of the optoelectronic semiconductor structure.

    Optical sensor module and packaging method thereof
    59.
    发明授权
    Optical sensor module and packaging method thereof 有权

    公开(公告)号：US12013284B2

    公开(公告)日：2024-06-18

    申请号：US18067066

    申请日：2022-12-16

    Applicant: SENSORTEK TECHNOLOGY CORP.

    Inventor： Yu-Min Lin ,  Feng-Jung Hsu

    IPC: G01J1/02 ,  G01J1/04

    CPC classification number: G01J1/0271 ,  G01J1/0459 ,  G01J2001/0276 ,  G01J1/0474

    Abstract: An optical sensor module and a packaging method thereof are disclosed, wherein the optical sensor module comprises a substrate having a light sensing element; and a housing made of a transparent material. The housing is connected to the substrate and covers the light sensing element. The housing has a light-receiving area facing the light sensing element, and the inner surface of the housing toward the substrate is provided with a light-shielding coating in a portion outside of the light-receiving area. In this way, optical components such as the light sensor can be effectively protected, and still retain the effect of avoiding noise light interference with the light sensor module.

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