公开(公告)号：US11597052B2

公开(公告)日：2023-03-07

申请号：US16448980

申请日：2019-06-21

Applicant: Applied Materials, Inc.

Inventor： Hari Soundararajan ,  Shou-Sung Chang ,  Haosheng Wu ,  Jianshe Tang ,  Jeonghoon Oh ,  Rajeev Bajaj ,  Andrew Siordia

IPC: B24B49/00 ,  B24B37/015 ,  B24B37/20 ,  B24B57/02 ,  B24B37/27 ,  G05D23/24

Abstract: A chemical mechanical polishing apparatus includes a platen to hold a polishing pad, a carrier to hold a substrate against a polishing surface of the polishing pad during a polishing process, a dispenser to supply a polishing liquid to the polishing surface, and a temperature control system including a body configured to contact the polishing surface or the polishing liquid on the polishing surface. The body supports a thermal control module positioned over the polishing pad.

公开(公告)号：US11524384B2

公开(公告)日：2022-12-13

申请号：US16048574

申请日：2018-07-30

Applicant: Applied Materials, Inc.

Inventor： Ashwin Chockalingam ,  Rajeev Bajaj ,  Ashavani Kumar ,  Daniel Redfield

IPC: B24B37/26 ,  B24B37/24 ,  B24D3/34 ,  B24D11/04 ,  B24D3/20 ,  B24D3/28 ,  B24D11/00

Abstract: Embodiments of the present disclosure provide for abrasive delivery (AD) polishing pads and manufacturing methods thereof. In one embodiment, a method of forming a polishing article includes forming a sub-polishing element from a first curable resin precursor composition and forming a plurality of polishing elements extending from the sub-polishing element. Forming the plurality of polishing elements includes forming a continuous polymer phase from a second curable resin precursor composition and forming a plurality of discontinuous abrasive delivery features disposed within the continuous polymer phase. The sub-polishing element is formed by dispensing a first plurality of droplets of the first curable resin precursor composition. The plurality polishing elements are formed by dispensing a second plurality of droplets of the second curable resin precursor composition. In some embodiments, the discontinuous abrasive delivery features comprise a water soluble material having abrasive particles interspersed therein.

公开(公告)号：US20210379725A1

公开(公告)日：2021-12-09

申请号：US16897184

申请日：2020-06-09

Applicant: Applied Materials, Inc.

Inventor： Uma Sridhar ,  Sivapackia Ganapathiappan ,  Ashwin Murugappan Chockalingam ,  Mayu Felicia Yamamura ,  Daniel Redfield ,  Rajeev Bajaj ,  Yingdong Luo ,  Nag B. Patibandla

IPC: B24B37/24 ,  C09D11/102 ,  C09D11/101 ,  B33Y80/00 ,  B29C64/112 ,  B33Y10/00 ,  B33Y70/00

Abstract: Interpenetrating polymer networks (IPNs) for a forming polishing pad for a semiconductor fabrication operation are disclosed. Techniques for forming the polishing pads are provided. In an exemplary embodiment, a polishing pad includes an interpenetrating polymer network formed from a free-radically polymerized material and a cationically polymerized material.

公开(公告)号：US20210054222A1

公开(公告)日：2021-02-25

申请号：US16996744

申请日：2020-08-18

Applicant: Applied Materials, Inc.

Inventor： Yingdong Luo ,  Sivapackia Ganapathiappan ,  Ashwin Murugappan Chockalingam ,  Daihua Zhang ,  Uma Sridhar ,  Daniel Redfield ,  Rajeev Bajaj ,  Nag B. Patibandla ,  Hou T. Ng ,  Sudhakar Madhusoodhanan

IPC: C09D11/107 ,  C09K3/14 ,  B24B37/24 ,  B33Y70/10 ,  B33Y80/00 ,  B33Y40/10 ,  B29C64/112 ,  B33Y10/00

Abstract: A formulation, system, and method for additive manufacturing of a polishing pad. The formulation includes monomer, dispersant, and nanoparticles. A method of preparing the formulation includes adding a dispersant that is a polyester derivative to monomer, adding metal-oxide nanoparticles to the monomer, and subjecting the monomer having the nanoparticles and dispersant to sonication to disperse the nanoparticles in the monomer.

公开(公告)号：US20210046602A1

公开(公告)日：2021-02-18

申请号：US16831436

申请日：2020-03-26

Applicant: Applied Materials, Inc.

Inventor： Haosheng Wu ,  Hari Soundararajan ,  Jianshe Tang ,  Shou-Sung Chang ,  Brian J. Brown ,  Yen-Chu Yang ,  You Wang ,  Rajeev Bajaj

IPC: B24B37/015 ,  B24B55/03 ,  B24B37/10

Abstract: A chemical mechanical polishing system includes a platen to support a polishing pad having a polishing surface, a source of coolant, a dispenser having one or more apertures suspended over the platen to direct coolant from the source of coolant onto the polishing surface of the polishing pad; and a controller coupled to the source of coolant and configured to cause the source of coolant to deliver the coolant through the nozzles onto the polishing surface during a selected step of a polishing operation.

公开(公告)号：US10821573B2

公开(公告)日：2020-11-03

申请号：US14887240

申请日：2015-10-19

Applicant: Applied Materials, Inc.

Inventor： Rajeev Bajaj ,  Daniel Redfield ,  Mahendra C. Orilall ,  Boyi Fu ,  Aniruddh Khanna ,  Jason G. Fung ,  Mario Cornejo ,  Ashwin Chockalingam ,  Mayu Yamamura ,  Veera Raghava Reddy Kakireddy ,  Ashavani Kumar ,  Venkat Hariharan ,  Gregory E. Menk ,  Fred C. Redeker ,  Nag B. Patibandla ,  Hou T. Ng ,  Robert E. Davenport ,  Amritanshu Sinha

IPC: B24B37/22 ,  B24B37/24 ,  B24D3/28 ,  B33Y80/00

Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one resin precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions.

公开(公告)号：US10399201B2

公开(公告)日：2019-09-03

申请号：US15296015

申请日：2016-10-17

Applicant: Applied Materials, Inc.

Inventor： Sivapackia Ganapathiappan ,  Boyi Fu ,  Ashwin Chockalingam ,  Daniel Redfield ,  Rajeev Bajaj ,  Mahendra C. Orilall ,  Hou T. Ng ,  Jason G. Fung ,  Mayu Yamamura

IPC: B24D3/28 ,  C09D4/00 ,  C09G1/16 ,  B24B37/22 ,  B24B37/24 ,  B24B37/26 ,  B24D11/00 ,  B24D11/04 ,  B33Y10/00 ,  B33Y80/00 ,  B29C64/112 ,  B29C35/08 ,  B29K33/04 ,  B33Y70/00

Abstract: Embodiments herein relate to advanced polishing pads with tunable chemical, material and structural properties, and manufacturing methods related thereto. According to one or more embodiments herein, a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments herein thus may provide an advanced polishing pad having discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, addition polymer precursor compounds, catalysts, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one polymer precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions. Embodiments herein further provide a polishing pad with polymeric layers that may be interpenetrating polymer networks.

公开(公告)号：US10322491B2

公开(公告)日：2019-06-18

申请号：US14885955

申请日：2015-10-16

Applicant: Applied Materials, Inc.

Inventor： Mahendra Christopher Orilall ,  Timothy Michaelson ,  Kasiraman Krishnan ,  Rajeev Bajaj ,  Nag B. Patibandla ,  Daniel Redfield ,  Fred C. Redeker ,  Gregory E. Menk

IPC: B24B37/22 ,  B24B37/24 ,  B24B37/26 ,  B33Y10/00 ,  B33Y80/00 ,  B24D18/00

Abstract: A method of fabricating a polishing layer of a polishing pad includes successively depositing a plurality of layers with a 3D printer, each layer of the plurality of polishing layers deposited by ejecting a base material from a first nozzle and an additive material from a second nozzle and solidifying the base and additive material to form a solidified pad material.

公开(公告)号：US10086500B2

公开(公告)日：2018-10-02

申请号：US14575608

申请日：2014-12-18

Applicant: Applied Materials, Inc.

Inventor： Mahendra Christopher Orilall ,  Rajeev Bajaj ,  Fred C. Redeker

IPC: B24D11/00 ,  B24D3/32 ,  B29C35/08

Abstract: A method of fabricating a chemical mechanical polishing pad includes introducing polymer precursors containing acrylate functional groups into a mold, providing abrasive particles and a photo-initiator in the polymer precursors to form a mixture, and while the mixture is contained between a bottom plate and a top cover of the mold, exposing the mixture to ultraviolet radiation through a transparent section of the mold to cause the polymer precursors to form radicals, forming a polymer matrix from the polymer precursor by causing the radicals to cross-link with one another. The polishing layer includes the polymer matrix having the abrasive particles dispersed therein.

公开(公告)号：US20170309494A1

公开(公告)日：2017-10-26

申请号：US15624682

申请日：2017-06-15

Applicant: Applied Materials, Inc.

Inventor： Thomas H. Osterheld ,  Rajeev Bajaj

IPC: H01L21/306 ,  H01L21/3105 ,  H01L21/321 ,  B24B37/04 ,  H01L21/67

CPC classification number: H01L21/30625 ,  B24B37/042 ,  B24B37/10 ,  B24B57/02 ,  H01L21/31055 ,  H01L21/3212 ,  H01L21/67075 ,  H01L21/67092

Abstract: Embodiments of the invention provide a non-uniform substrate polishing apparatus that includes a polishing pad with two or more zones, each zone adapted to apply a different slurry chemistry to a different area on a substrate to create a film thickness profile on the substrate having at least two different film thicknesses. Polishing methods and systems adapted to polish substrates are also provided, as are numerous other aspects.