公开(公告)号：US20230187850A1

公开(公告)日：2023-06-15

申请号：US17549427

申请日：2021-12-13

Applicant: Intel Corporation

Inventor： Ziyin Lin ,  Aaron Michael Garelick ,  Karumbu Meyyappan ,  Gregorio Murtagian ,  Srikant Nekkanty ,  Taylor Rawlings ,  Jeffory L. Smalley ,  Pooya Tadayon ,  Dingying Xu

IPC: H01R3/08 ,  H01L23/498 ,  H01L23/32 ,  H01R43/00

CPC classification number: H01R3/08 ,  H01L23/49816 ,  H01L23/32 ,  H01L23/49833 ,  H01R43/005

Abstract: An electronic device and associated methods are disclosed. In one example, the electronic device includes a socket that includes one or more liquid metal filled reservoirs. In selected examples, the electronic devices and sockets include configurations to aid in reducing ingress of moisture.

公开(公告)号：US11340258B2

公开(公告)日：2022-05-24

申请号：US16817480

申请日：2020-03-12

Applicant: INTEL CORPORATION

Inventor： Joseph D. Stanford ,  David Craig ,  Todd P. Albertson ,  Mohit Mamodia ,  Dingying Xu

IPC: G01R1/067 ,  G01R1/073 ,  G01R3/00

Abstract: A prober head to interface an E-testing apparatus to a device under test, which may be an unpackaged die, for example. In some embodiments, the prober head includes an array of conductive pins, each of the pins extending outwardly from a first pin end anchored to a substrate. At least a partial length of each of the pins is coated with a hydrophobic monolayer. The conductive pins may be composite metal wires including a core metal encased by one or more peripheral metal. At a tip of the pins, opposite the first pin end anchored to the substrate, the peripheral metals are recessed from the core metal. In further embodiments, the hydrophobic monolayer is disposed on an outer surface of the peripheral metals, but is substantially absent from a surface of the core metal exposed at the tip.

公开(公告)号：US20220102242A1

公开(公告)日：2022-03-31

申请号：US17032577

申请日：2020-09-25

Applicant: Intel Corporation

Inventor： Mitul Modi ,  Joseph Van Nausdle ,  Omkar Karhade ,  Edvin Cetegen ,  Nicholas Haehn ,  Vaibhav Agrawal ,  Digvijay Raorane ,  Dingying Xu ,  Ziyin Lin ,  Yiqun Bai

IPC: H01L23/42 ,  H01L23/31 ,  H01L21/48

Abstract: Techniques and mechanisms for facilitating heat conductivity in a packaged device with a dummy die. In an embodiment, a packaged device comprises a substrate and one or more IC die coupled to a surface thereof. A dummy die, adjacent to an IC die and coupled to a region of the substrate, comprises a polymer resin and a filler. A package mold structure of the packaged device adjoins respective sides of the IC die and the dummy die, and adjoins the surface of the substrate. In another embodiment, a first CTE of the dummy die is less than a second CTE of the package mold structure, and a first thermal conductivity of the dummy die is greater than a second thermal conductivity of the package mold structure.

公开(公告)号：US20200209280A1

公开(公告)日：2020-07-02

申请号：US16817480

申请日：2020-03-12

Applicant: INTEL CORPORATION

Inventor： Joseph D. Stanford ,  David Craig ,  Todd P. Albertson ,  Mohit Mamodia ,  Dingying Xu

IPC: G01R1/073 ,  G01R1/067 ,  G01R3/00

Abstract: A prober head to interface an E-testing apparatus to a device under test, which may be an unpackaged die, for example. In some embodiments, the prober head includes an array of conductive pins, each of the pins extending outwardly from a first pin end anchored to a substrate. At least a partial length of each of the pins is coated with a hydrophobic monolayer. The conductive pins may be composite metal wires including a core metal encased by one or more peripheral metal. At a tip of the pins, opposite the first pin end anchored to the substrate, the peripheral metals are recessed from the core metal. In further embodiments, the hydrophobic monolayer is disposed on an outer surface of the peripheral metals, but is substantially absent from a surface of the core metal exposed at the tip.

公开(公告)号：US20160375653A1

公开(公告)日：2016-12-29

申请号：US14752720

申请日：2015-06-26

Applicant: Intel Corporation

Inventor： Wen Yin ,  Dingying Xu ,  Luyin Zhao

IPC: B32B7/12 ,  B32B37/12

CPC classification number: B32B7/12 ,  B32B3/10 ,  B32B3/30 ,  B32B7/05 ,  B32B7/06 ,  B32B27/08 ,  B32B27/302 ,  B32B27/32 ,  B32B27/36 ,  B32B37/12 ,  B32B38/06 ,  B32B2250/44 ,  B32B2270/00 ,  B32B2274/00 ,  B32B2307/536 ,  B32B2307/54 ,  B32B2307/732 ,  B32B2307/748 ,  B32B2309/10 ,  B32B2457/08 ,  H01L21/6835 ,  H01L2221/68318

Abstract: Die transport apparatus and methods are disclosed herein. In some embodiments, a die transport apparatus may include: a plurality of regularly arranged adhesive areas, wherein individual adhesive areas have a die contact surface; and a relief area recessed from the die contact surfaces. Other embodiments may be disclosed and/or claimed.

Abstract translation: 本文公开了模具输送装置和方法。 在一些实施例中，模具输送装置可以包括：多个规则排列的粘合区域，其中各个粘合区域具有模具接触表面; 以及从模具接触表面凹陷的浮雕区域。 可以公开和/或要求保护其他实施例。