ELECTRODES FOR MICROELECTROMECHANICAL SYSTEM MICROPHONES

    公开(公告)号:US20240171917A1

    公开(公告)日:2024-05-23

    申请号:US18448601

    申请日:2023-08-11

    CPC classification number: H04R19/04 H04R7/04 H04R7/18 H04R2201/003 H04R2410/03

    Abstract: The present invention relates to split electrodes for microelectromechanical system (MEMS) microphones. In one embodiment, a MEMS sensor includes a membrane, a membrane electrode formed in a portion of the membrane, and a backplate situated parallel to the membrane and separated by a gap. The backplate includes a first region of the backplate, where the first region of the backplate has first perforations of a first density, a backplate electrode is formed in a portion of the first region of the backplate, and a portion of the membrane electrode overlaps a portion of the backplate electrode in a sensing region forming a sensing capacitor, the sensing capacitor being configured to sense motion of the membrane in response to acoustic pressure. The backplate also includes a second region of the backplate having second perforations of a second density, where the second density is greater than the first density.

    APPLYING A POSITIVE FEEDBACK VOLTAGE TO AN ELECTROMECHANICAL SENSOR UTILIZING A VOLTAGE-TO-VOLTAGE CONVERTER TO FACILITATE A REDUCTION OF CHARGE FLOW IN SUCH SENSOR REPRESENTING SPRING SOFTENING

    公开(公告)号:US20220413003A1

    公开(公告)日:2022-12-29

    申请号:US17894077

    申请日:2022-08-23

    Abstract: Reducing a sensitivity of an electromechanical sensor is presented herein. The electromechanical sensor comprises a sensitivity with respect to a variation of a mechanical-to-electrical gain of a sense element of the electromechanical sensor; and a voltage-to-voltage converter component that minimizes the sensitivity by coupling, via a defined feedback capacitance, a positive feedback voltage to a sense electrode of the sense element—the sense element electrically coupled to an input of the voltage-to-voltage converter component. In one example, the voltage-to-voltage converter component minimizes the sensitivity by maintaining, via the defined feedback capacitance, a constant charge at the sense electrode. In another example, the electromechanical sensor comprises a capacitive sense element comprising a first node comprising the sense electrode. Further, a bias voltage component can apply a bias voltage to a second node of the electromechanical sensor. In yet another example, the electromechanical sensor comprises a piezoelectric sense element.

    Elastic bump stops for MEMS devices

    公开(公告)号:US10527420B2

    公开(公告)日:2020-01-07

    申请号:US16044463

    申请日:2018-07-24

    Abstract: A MEMS device includes at least one proof mass, the at least one proof mass is capable of moving to contact at least one target structure. The MEMS device further includes at least one elastic bump stop coupled to the proof mass and situated at a first distance from the target structure. The MEMS device additionally includes at least one secondary bump stop situated at a second distance from the target structure, wherein the second distance is greater than the first distance, and further wherein the at least one elastic bump stop moves to reduce the first distance when a shock is applied.

    MEMS sensor compensation for off-axis movement

    公开(公告)号:US10421659B2

    公开(公告)日:2019-09-24

    申请号:US15811471

    申请日:2017-11-13

    Abstract: A microelectromechanical system (MEMS) sensor includes a MEMS layer that includes fixed and movable electrodes. In response to an in-plane linear acceleration, the movable electrodes move with respect to the fixed electrodes, and acceleration is determined based on the resulting change in capacitance. A plurality of auxiliary electrodes are located on a substrate of the MEMS sensor and below the MEMS layer, such that a capacitance between the MEMS layer and the auxiliary loads changes in response to an out-of-plane movement of the MEMS layer or a portion thereof. The MEMS sensor compensates for the acceleration value based on the capacitance sensed by the auxiliary electrodes.

    ON-CHIP GAP MEASUREMENT
    58.
    发明申请

    公开(公告)号:US20190178645A1

    公开(公告)日:2019-06-13

    申请号:US16130695

    申请日:2018-09-13

    CPC classification number: G01C19/5712 G01C19/5726 G01C19/5776 G01C25/005

    Abstract: A MEMS gyroscope includes a proof mass of a suspended spring mass system that is driven at a drive frequency. The proof mass moves relative to a sense electrode such that an overlap of the proof mass and sense electrode changes during the drive motion. A Coriolis force causes the proof mass to move relative to the sense electrode. The overlap and the movement due to the Coriolis force are sensed, and angular velocity is determined based on the magnitude of a signal generated due to a change in overlap and the Coriolis force.

    ELECTROSTATIC OFFSET CORRECTION
    59.
    发明申请

    公开(公告)号:US20190025056A1

    公开(公告)日:2019-01-24

    申请号:US15657054

    申请日:2017-07-21

    Abstract: A MEMS sensor has a proof mass, a sense electrode, and a shield. At least a portion of the proof mass and shield may form a capacitor that causes an offset movement of the proof mass. A series of test values may be provided in order to minimize the offset movement or compensate for the offset movement. In some embodiments, the shield voltage may be modified to reduce the offset movement. Residual offsets due to other factors may also be determined and utilized for compensation to reduce an offset error in a sensed signal.

    DRIVE AND SENSE BALANCED, SEMI-COUPLED 3-AXIS GYROSCOPE

    公开(公告)号:US20180216935A1

    公开(公告)日:2018-08-02

    申请号:US15940810

    申请日:2018-03-29

    CPC classification number: G01C19/5712 G01C19/5747 G01C19/5762

    Abstract: In a first aspect, the angular rate sensor comprises a substrate and a rotating structure anchored to the substrate. The angular rate sensor also includes a drive mass anchored to the substrate and an element coupling the drive mass and the rotating structure. The angular rate sensor further includes an actuator for driving the drive mass into oscillation along a first axis in plane to the substrate and for driving the rotating structure into rotational oscillation around a second axis normal to the substrate; a first transducer to sense the motion of the rotating structure in response to a Coriolis force in a sense mode; and a second transducer to sense the motion of the sensor during a drive mode. In a second aspect the angular rate sensor comprises a substrate and two shear masses which are parallel to the substrate and anchored to the substrate via flexible elements. In further embodiments, a dynamically balanced 3-axis gyroscope architecture is provided. Various embodiments described herein can facilitate providing linear and angular momentum balanced 3-axis gyroscope architectures for better offset stability, vibration rejection, and lower part-to-part coupling.

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