公开(公告)号：US06225689B1

公开(公告)日：2001-05-01

申请号：US09639358

申请日：2000-08-14

Applicant: Walter L. Moden ,  Jerrold L. King ,  Jerry M. Brooks

Inventor： Walter L. Moden ,  Jerrold L. King ,  Jerry M. Brooks

IPC: H01L2302

CPC classification number: H05K1/181 ,  H01L25/105 ,  H01L2225/1029 ,  H01L2225/1064 ,  H01L2225/107 ,  H01L2225/1094 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K1/145 ,  H05K1/147 ,  H05K2201/049 ,  H05K2201/10515 ,  H05K2201/10689 ,  Y02P70/611 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49169 ,  H01L2924/00

Abstract: A low profile multi-IC chip package for high speed application comprises a connector for electrically connecting the equivalent outer leads of a set of stacked primary semiconductor packages. In one embodiment, the connector comprises a two-part sheet of flexible insulative polymer with buses formed on one side. In another embodiment, the connector comprises multiple buses formed from conductive polymer. In further embodiments, the primary packages are stacked within a cage and have their outer leads in unattached contact with buses within the cage or, alternatively, are directly fixed to leads or pads on the host circuit board.

公开(公告)号：US06198636B1

公开(公告)日：2001-03-06

申请号：US09461992

申请日：1999-12-15

Applicant: Warren M. Farnworth ,  Larry D. Kinsman ,  Walter L. Moden

Inventor： Warren M. Farnworth ,  Larry D. Kinsman ,  Walter L. Moden

IPC: H05K710

CPC classification number: H05K7/1007 ,  H01R12/89

Abstract: A socket that secures bare and minimally packaged semiconductor devices substantially perpendicularly relative to a carrier substrate. The socket includes intermediate conductive elements and a member which moves the intermediate conductive elements between an insertion position and a biased position. After placement of the intermediate conductive elements into an insertion position, a semiconductor device may be inserted into a receptacle of the socket with minimal insertion force. Movement of the member to a biased position facilitates biasing of the intermediate conductive elements against a bond pad of the semiconductor device. The intermediate conductive elements establish an electrical connection between the semiconductor device and the carrier substrate. A first embodiment of the socket includes a member which moves transversely relative to the remainder of the socket. In a second embodiment of the socket, the member moves vertically relative to the socket body.

公开(公告)号：US6066514A

公开(公告)日：2000-05-23

申请号：US963395

申请日：1997-11-03

Applicant: Jerrold L. King ,  J. Mike Brooks ,  Walter L. Moden

Inventor： Jerrold L. King ,  J. Mike Brooks ,  Walter L. Moden

IPC: H01L23/31 ,  H01L23/495 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC classification number: H01L23/3142 ,  H01L23/4951 ,  H01L2224/05599 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/48465 ,  H01L2224/73215 ,  H01L2224/85399 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/0102 ,  H01L2924/01029 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/1532 ,  H01L2924/1815 ,  Y10S438/926 ,  Y10S438/928

Abstract: A semiconductor die includes a metal layer deposited thereon for enhancing adhesion between the die and a mold compound package. The metal layer is substantially oxide free. The die is coated with a layer or layers of copper (Cu) and/or palladium (Pd) by electroplating or electroless coating techniques. The metal layer provides a uniform wetting surface for better adhesion of the die with the mold compound during encapsulation. The increased adhesion reduces the delamination potential of the die from the package.

公开(公告)号：US6064221A

公开(公告)日：2000-05-16

申请号：US994005

申请日：1997-12-18

Applicant: Walter L. Moden ,  John O. Jacobson

Inventor： Walter L. Moden ,  John O. Jacobson

IPC: G01R1/04 ,  G01R31/26 ,  H01L21/44 ,  H01L21/66 ,  G01R31/02

CPC classification number: G01R1/04 ,  G01R1/0483 ,  H01L2224/48091 ,  H01L2224/48472 ,  H01L2224/49171 ,  H01L2924/01019

Abstract: A method of using adhesive tape to temporarily retain a die being temporarily held in a fixture during testing and burn-in. The method of the present invention uses a die cut piece of adhesively coated tape to hold a die in a test and burn-in fixture. Upon subsequent heating of the tape beyond the normal operating range of the adhesive coating on the tape, the die is removed from the tape, the tape is removed from the test and burn-in fixture, and the remaining adhesive, if any, is removed from the test and burn-in fixture.

公开(公告)号：US6017776A

公开(公告)日：2000-01-25

申请号：US840403

申请日：1997-04-29

Applicant: Tongbi Jiang ,  Syed S. Ahmad ,  Walter L. Moden

Inventor： Tongbi Jiang ,  Syed S. Ahmad ,  Walter L. Moden

IPC: H01L21/66 ,  H01L23/495 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC classification number: H01L23/49513 ,  H01L23/4951 ,  H01L24/32 ,  H01L2224/05599 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/73215 ,  H01L2224/73257 ,  H01L2224/83855 ,  H01L2224/83856 ,  H01L2224/85399 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01077 ,  H01L2924/01082

Abstract: The present invention is directed to a method of attaching a leadframe to a singulated good die using a wet film adhesive applied in a predetermined pattern on the active surface of the good die, the lead finger of a leadframe, or both. By applying the adhesive only to identified good dice, time and material are saved over a process that applies adhesive to the entire wafer. By attaching the leadframe to the good die with a wet film, it is possible to remove the leadframe from the good die for rework if the good die subsequently tests unacceptable.

公开(公告)号：US6013535A

公开(公告)日：2000-01-11

申请号：US906673

申请日：1997-08-05

Applicant: Walter L. Moden ,  Syed S. Ahmad ,  Gregory M. Chapman ,  Tongbi Jiang

Inventor： Walter L. Moden ,  Syed S. Ahmad ,  Gregory M. Chapman ,  Tongbi Jiang

IPC: H01L21/58 ,  H01L23/495 ,  H01L21/56 ,  H01L21/60 ,  H01L21/66

CPC classification number: H01L24/27 ,  H01L23/4951 ,  H01L24/06 ,  H01L24/743 ,  H01L24/83 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/06136 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/4826 ,  H01L2224/48472 ,  H01L2224/49175 ,  H01L2224/73215 ,  H01L2224/743 ,  H01L2224/7565 ,  H01L2224/83194 ,  H01L2224/8385 ,  H01L2224/85399 ,  H01L2224/92147 ,  H01L24/48 ,  H01L24/49 ,  H01L2924/00014 ,  H01L2924/00015 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14

Abstract: A method for applying a viscous material to a lead frame element. A method of the invention includes positioning the lead frame facing downward and bringing the lead fingers into contact with a pool of adhesive material. The contact of the lead fingers to the adhesive material results in a portion of the lead fingers receiving a portion of the adhesive material from the pool of adhesive material. The gravitational forces on the adhesive material on the downward facing lead frame maintain the shape and boundary definition of the adhesive material.

Abstract translation: 一种将粘性材料施加到引线框架元件的方法。 本发明的一种方法包括将引线框架朝下定位并使引线指与一块粘合剂材料接触。 引线指与粘合剂材料的接触导致引线指的一部分从粘合剂材料池接收粘合材料的一部分。 面向下的引线框架上的粘合剂材料上的重力保持粘合剂材料的形状和边界限定。

公开(公告)号：US5733800A

公开(公告)日：1998-03-31

申请号：US651984

申请日：1996-05-21

Applicant: Walter L. Moden

Inventor： Walter L. Moden

IPC: H01L23/495 ,  H01L21/60

CPC classification number: H01L24/06 ,  H01L23/4951 ,  H01L2224/04042 ,  H01L2224/05647 ,  H01L2224/06136 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/48647 ,  H01L2224/48747 ,  H01L2224/49171 ,  H01L2224/73215 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/0102 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01073 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/181 ,  H01L2924/1815 ,  Y10T29/49121 ,  Y10T428/24165 ,  Y10T428/24207

Abstract: An LOC die assembly is disclosed including a die dielectrically adhered to the underside of a lead frame. An underfill material is introduced between each lead finger and semiconductor die, extending from the bonding location of the die and the edge of the die, in order to prevent filler particles from lodging between the leads and the active surface of the die during transfer molding of a plastic encapsulant. The seal created by the underfill material reduces point stresses on the active surface of the die usually caused by the filler particles. The decreased flexure in the leads further enhances the locking of the leads in position with respect to the die.

公开(公告)号：US5719440A

公开(公告)日：1998-02-17

申请号：US574662

申请日：1995-12-19

Applicant: Walter L. Moden

Inventor： Walter L. Moden

IPC: H01L21/56 ,  H01L21/60 ,  H01L23/13 ,  H01L23/31 ,  H01L23/495 ,  H01L23/498 ,  H05K1/14 ,  H05K3/32 ,  H05K3/34 ,  H05K3/36 ,  H01L28/48

CPC classification number: H01L24/81 ,  H01L21/563 ,  H01L23/13 ,  H01L23/3107 ,  H01L23/4951 ,  H01L23/49811 ,  H01L23/49827 ,  H01L24/75 ,  H01L24/85 ,  H05K3/328 ,  H05K3/3436 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48465 ,  H01L2224/49175 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/75 ,  H01L2224/81801 ,  H01L2224/85 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/85207 ,  H01L24/48 ,  H01L24/49 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15173 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/15312 ,  H05K1/141 ,  H05K2201/049 ,  H05K2201/10477 ,  H05K2203/0415 ,  H05K2203/049 ,  H05K3/368 ,  Y02P70/613

Abstract: A board connecting a bare semiconductor die with a bond pad arrangement which does not conform to a master printed circuit board with a specific or standardized pin out, connector pad, or lead placement arrangement. The board comprises a printed circuit board including first elements, such as minute solder balls, pins, or bond wires, for making electrical contact between the board and the master board, and second elements, such as minute solder balls, pins, or bond wires, for making electrical contact between the semiconductor die and the board. The board has circuit traces for electrical communication between the board/master board electrical contact elements, and the semiconductor die board electrical contact elements.

Abstract translation: 将裸半导体管芯与接合焊盘装置连接的板，其不符合具有特定或标准的引脚输出，连接器焊盘或引线放置布置的主印刷电路板。 板包括印刷电路板，其包括第一元件，例如用于在基板和母板之间进行电接触的微小焊球，引脚或接合线，以及第二元件，例如微小的焊球，引脚或接合线 用于在半导体管芯和电路板之间进行电接触。 电路板具有用于电路板/主板电接触元件之间的电气通信的电路迹线以及半导体裸片板电接触元件。

公开(公告)号：US08198138B2

公开(公告)日：2012-06-12

申请号：US11866065

申请日：2007-10-02

Applicant: Walter L. Moden

Inventor： Walter L. Moden

IPC: H01L21/00

CPC classification number: H01L24/81 ,  H01L21/485 ,  H01L21/563 ,  H01L23/13 ,  H01L23/3107 ,  H01L23/3128 ,  H01L23/4951 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/5382 ,  H01L24/06 ,  H01L24/48 ,  H01L24/49 ,  H01L24/75 ,  H01L24/85 ,  H01L25/0655 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/06136 ,  H01L2224/16 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48465 ,  H01L2224/49175 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/75 ,  H01L2224/81801 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/85207 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01076 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/19107 ,  H05K1/141 ,  H05K3/305 ,  H05K3/328 ,  H05K3/3436 ,  H05K3/368 ,  H05K2201/049 ,  H05K2201/10477 ,  H05K2201/10727 ,  H05K2203/0415 ,  H05K2203/049 ,  Y02P70/613 ,  H01L2224/78 ,  H01L2224/45099 ,  H01L2924/00

Abstract: Methods for providing and using semiconductor device assemblies or packages include providing or using various elements of a semiconductor device assembly or package. Such a semiconductor device package or assembly may include a substrate and a semiconductor die adjacent to a first surface of the substrate. The substrate of such a semiconductor device assembly or package may also include a second surface opposite from the first surface, an opening extending from the first surface and the second surface, contact pads on the second surface, and substrate pads on the second surface, adjacent to the opening. Bond pads of the semiconductor die may be aligned with the opening through the substrate. Intermediate conductive elements, such as bond wires, may extend from bond pads of the semiconductor die, extend through the opening, protrude beyond the second surface of the substrate, and extend to substrate pads on the second surface. An encapsulant, which may fill the opening and cover the intermediate conductive elements, protrudes beyond a plane in which the second surface of the substrate is located. Discrete conductive elements, such as solder balls, may protrude from the contact pads of the substrate.

Abstract translation: 提供和使用半导体器件组件或封装的方法包括提供或使用半导体器件组件或封装的各种元件。 这种半导体器件封装或组件可以包括与衬底的第一表面相邻的衬底和半导体管芯。 这种半导体器件组件或封装的衬底还可以包括与第一表面相对的第二表面，从第一表面和第二表面延伸的开口，第二表面上的接触焊盘和第二表面上的衬底焊盘 到开幕 半导体管芯的焊盘可以与通过衬底的开口对准。 中间导电元件（例如接合线）可以从半导体管芯的接合焊盘延伸，延伸穿过开口，突出超过衬底的第二表面，并延伸到第二表面上的衬底焊盘。 可以填充开口并覆盖中间导电元件的密封剂突出超过衬底的第二表面所在的平面。 离散导电元件，例如焊球，可能从基板的接触垫突出。

公开(公告)号：US08164175B2

公开(公告)日：2012-04-24

申请号：US12714193

申请日：2010-02-26

Applicant: Walter L. Moden

Inventor： Walter L. Moden

IPC: H01L23/04

CPC classification number: H01L24/81 ,  H01L21/485 ,  H01L21/563 ,  H01L23/13 ,  H01L23/3107 ,  H01L23/3128 ,  H01L23/4951 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/5382 ,  H01L24/06 ,  H01L24/48 ,  H01L24/49 ,  H01L24/75 ,  H01L24/85 ,  H01L25/0655 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/06136 ,  H01L2224/16 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48465 ,  H01L2224/49175 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/75 ,  H01L2224/81801 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/85207 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01076 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/19107 ,  H05K1/141 ,  H05K3/305 ,  H05K3/328 ,  H05K3/3436 ,  H05K3/368 ,  H05K2201/049 ,  H05K2201/10477 ,  H05K2201/10727 ,  H05K2203/0415 ,  H05K2203/049 ,  Y02P70/613 ,  H01L2224/78 ,  H01L2224/45099 ,  H01L2924/00

Abstract: A semiconductor device assembly includes a substrate and a semiconductor die adjacent to a first surface of the substrate. The substrate also includes a second surface opposite from the first surface, an opening extending from the first surface and the second surface, contact pads on the first surface, and substrate pads on the second surface, adjacent to the opening. Bond pads of the semiconductor die are aligned with the opening through the substrate. Intermediate conductive elements, such as bond wires, extend from bond pads of the semiconductor die, through the opening, to substrate pads on the opposite, second surface of the substrate. An encapsulant, which fills the opening and covers the intermediate conductive elements, protrudes beyond a plane in which the second surface of the substrate is located. Another electronic device, such as another semiconductor device package, may communicate electrically with the die of the semiconductor device assembly through the contact pads on the first surface of the substrate. In some embodiments, the other electronic device may be stacked with the semiconductor device assembly.

Abstract translation: 半导体器件组件包括与衬底的第一表面相邻的衬底和半导体管芯。 衬底还包括与第一表面相对的第二表面，从第一表面和第二表面延伸的开口，第一表面上的接触焊盘以及与开口相邻的第二表面上的衬底焊盘。 半导体管芯的焊盘与通过衬底的开口对准。 诸如接合线的中间导电元件从半导体管芯的接合焊盘延伸通过开口，延伸到衬底的相对的第二表面上的衬底焊盘。 填充开口并覆盖中间导电元件的密封剂突出超过衬底的第二表面所在的平面。 诸如另一半导体器件封装的另一电子器件可以通过衬底的第一表面上的接触焊盘与半导体器件组件的管芯电连通。 在一些实施例中，其他电子设备可以与半导体器件组件堆叠。