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    METHOD FOR PRODUCING SMALL-SIZED REACTOR AND SMALL-SIZED REACTOR
    51.
    发明申请
    METHOD FOR PRODUCING SMALL-SIZED REACTOR AND SMALL-SIZED REACTOR 审中-公开
    生产小尺寸反应器和小尺寸反应器的方法

    公开(公告)号：US20120224999A1

    公开(公告)日：2012-09-06

    申请号：US13378582

    申请日：2010-06-17

    Applicant: Yuji Kaneko ,  Jumi Kaneko ,  Katsunobu Endo ,  Shigeshi Sakakibara ,  Kazuhiro Shinoda

    Inventor： Yuji Kaneko ,  Jumi Kaneko ,  Katsunobu Endo ,  Shigeshi Sakakibara ,  Kazuhiro Shinoda

    IPC: B32B38/10 ,  B01L3/00

    CPC classification number: B81C3/001 ,  B01J19/0093 ,  B01J2219/00783 ,  B01J2219/00831 ,  B81B2201/051 ,  B81C2201/019 ,  B81C2203/036 ,  C03C19/00 ,  C03C23/0085 ,  C03C27/06 ,  C03C2204/08

    Abstract: A small-sized reactor having practical utility in light of a bonding force, ease in observation, exemption from impurities and high resistance against pressure, is provided. In bonding a plural number of inorganic transparent substrates (11) to (13) to form a small-sized reactor, surfaces for bonding (16) to (19) of the inorganic transparent substrates (11) to (13), bonded on contact to one another, are initially polished and planarized. A part of the surface of each of the surfaces for bonding is then machined. The surfaces for bonding (16) to (19) are then hydrophilicity enhanced and washed with pure water. A film of pure water is swung off and removed by a centrifugal force. The resultant product is then heated with the surfaces for bonding in contact with one another. The surfaces for bonding, in contact with one another, may be bonded together by chemical bonding via oxygen to form small-sized reactors (1), (2) in which the inorganic transparent substrates (11) to (13) are bonded together strongly. The reactor is transparent and hence an inner reaction may be observed. Moreover, the reactor is rigid and hence is high in resistance against pressure. Since no adhesive is used, there is no fear of dissolution of impurities.

    Abstract translation: 提供了一种具有粘合力，易于观察，免除杂质和高耐压性的实用性的小型反应器。 在将多个无机透明基板（11）〜（13）接合以形成小型反应器时，在无机透明基板（11）〜（13）的接合（16）〜（19）的接触面 最初抛光和平坦化。 然后对每个用于粘合的表面的一部分表面进行加工。 接合（16）至（19）的表面然后增强亲水性，并用纯水洗涤。 通过离心力将纯净的水膜摆脱并除去。 然后将所得产物与表面加热以进行粘合以彼此接触。 用于接合的表面可以通过氧气的化学键合而结合在一起，以形成小型反应器（1），（2）其中无机透明基板（11）至（13）牢固地结合在一起 。 反应器是透明的，因此可以观察到内部反应。 此外，反应器是刚性的，因此耐压性高。 由于不使用粘合剂，所以不用担心杂质溶解。

    Manufacturing method for a micromechanical component, corresponding composite component, and corresponding micromechanical component
    53.
    发明授权
    Manufacturing method for a micromechanical component, corresponding composite component, and corresponding micromechanical component 有权
    微机械部件的制造方法，相应的复合部件和相应的微机械部件

    公开(公告)号：US08232126B2

    公开(公告)日：2012-07-31

    申请号：US12737036

    申请日：2009-04-21

    Applicant: Hubert Benzel ,  Frank Henning ,  Armin Scharping ,  Christoph Schelling

    Inventor： Hubert Benzel ,  Frank Henning ,  Armin Scharping ,  Christoph Schelling

    IPC: H01L21/00

    CPC classification number: B81C3/001 ,  B81B2201/0264 ,  B81C2201/019 ,  G01L9/0055

    Abstract: A manufacturing method for a micromechanical component, a corresponding composite component, and a corresponding micromechanical component are described. The method has the following steps: providing a first composite of a plurality of semiconductor chips, the first composite having first front and back surfaces; providing a second composite of a corresponding plurality of carrier substrates, the second composite having second front and back surfaces; imprinting a structured adhesion promoter layer on the first front and/or second front surfaces, the layer having degassing channels; aligning the first front and second front surfaces corresponding to a plurality of micromechanical components, each having a semiconductor chip and a corresponding carrier substrate; connecting the first front and second front surfaces via the structured adhesion promoter layer by applying pressure so that a gas from the ambient atmosphere is able to escape to the outside through the degassing channels; and separating the micromechanical components.

    Abstract translation: 对微机械部件的制造方法，对应的复合部件以及相应的微机械部件进行说明。 该方法具有以下步骤：提供多个半导体芯片的第一复合材料，所述第一复合材料具有第一前表面和后表面; 提供相应的多个载体基板的第二复合材料，所述第二复合材料具有第二前表面和后表面; 在第一前表面和/或第二前表面上印刷结构化粘合促进剂层，该层具有脱气通道; 对准与多个微机械部件相对应的第一前和第二前表面，每个具有半导体芯片和相应的载体基板; 通过施加压力，通过结构化粘合促进剂层连接第一前表面和第二前表面，使得来自环境大气的气体能够通过脱气通道逸出到外部; 并分离微机械部件。

    MICROSTRUCTURE, MICROMACHINE, AND MANUFACTURING METHOD OF MICROSTRUCTURE AND MICROMACHINE
    54.
    发明申请
    MICROSTRUCTURE, MICROMACHINE, AND MANUFACTURING METHOD OF MICROSTRUCTURE AND MICROMACHINE 有权
    微结构和微生物的微结构，微生物学和制造方法

    公开(公告)号：US20120171843A1

    公开(公告)日：2012-07-05

    申请号：US13414758

    申请日：2012-03-08

    Applicant: Mayumi Yamaguchi ,  Konami Izumi

    Inventor： Mayumi Yamaguchi ,  Konami Izumi

    IPC: H01L21/762 ,  B32B38/10

    CPC classification number: H01L21/762 ,  B32B38/10 ,  B81C3/008 ,  B81C2201/019 ,  Y10T428/24802

    Abstract: Without sacrificial layer etching, a microstructure and a micromachine are manufactured. A separation layer 102 is formed over a substrate 101, and a layer 103 to be a movable electrode is formed over the separation layer 102. At an interface of the separation layer 102, the layer 103 to be a movable electrode is separated from the substrate. A layer 106 to be a fixed electrode is formed over another substrate 105. The layer 103 to be a movable electrode is fixed to the substrate 105 with the spacer layer 103 which is partially provided interposed therebetween, so that the layer 103 to be a movable electrode and a layer 106 to be a fixed electrode face each other.

    Abstract translation: 没有牺牲层蚀刻，制造微结构和微机械。 在基板101上形成分离层102，在分离层102的上方形成作为可动电极的层103.在分离层102的界面处，作为可动电极的层103与基板分离 。 作为固定电极的层106形成在另一基板105上。作为可动电极的层103被固定到基板105，间隔层103被部分地设置在其间，使得层103成为可移动的 电极和作为固定电极的层106彼此面对。

    SYSTEMS AND METHODS FOR A THREE-LAYER CHIP-SCALE MEMS DEVICE
    55.
    发明申请
    SYSTEMS AND METHODS FOR A THREE-LAYER CHIP-SCALE MEMS DEVICE 有权
    用于三层芯片尺寸MEMS器件的系统和方法

    公开(公告)号：US20120126349A1

    公开(公告)日：2012-05-24

    申请号：US13296642

    申请日：2011-11-15

    Applicant: Robert D. Horning ,  Ryan Supino

    Inventor： Robert D. Horning ,  Ryan Supino

    IPC: H01L29/84 ,  H01L21/78

    CPC classification number: H01L29/84 ,  B81B7/0032 ,  B81B7/0038 ,  B81B7/0074 ,  B81B7/0077 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2201/025 ,  B81C2201/019 ,  H01L2224/48091 ,  H01L2924/00014

    Abstract: Systems and methods for a micro-electromechanical system (MEMS) device are provided. In one embodiment, a system comprises a first outer layer and a first device layer comprising a first set of MEMS devices, wherein the first device layer is bonded to the first outer layer. The system also comprises a second outer layer and a second device layer comprising a second set of MEMS devices, wherein the second device layer is bonded to the second outer layer. Further, the system comprises a central layer having a first side and a second side opposite that of the first side, wherein the first side is bonded to the first device layer and the second side is bonded to the second device layer.

    Abstract translation: 提供了一种用于微机电系统（MEMS）装置的系统和方法。 在一个实施例中，系统包括第一外层和包括第一组MEMS器件的第一器件层，其中第一器件层接合到第一外层。 该系统还包括第二外层和包括第二组MEMS器件的第二器件层，其中第二器件层结合到第二外层。 此外，该系统包括具有第一侧和与第一侧相反的第二侧的中心层，其中第一侧接合到第一器件层，第二侧接合到第二器件层。

    Protection of cavities opening onto a face of a microstructured element
    56.
    发明授权
    Protection of cavities opening onto a face of a microstructured element 失效
    保护打开到微结构元件的表面上的空腔

    公开(公告)号：US08153503B2

    公开(公告)日：2012-04-10

    申请号：US12295997

    申请日：2007-04-03

    Applicant: Barbara Charlet ,  Hélène Le Poche ,  Yveline Gobil

    Inventor： Barbara Charlet ,  Hélène Le Poche ,  Yveline Gobil

    IPC: H01L21/322

    CPC classification number: B81C1/00833 ,  B81B2203/0315 ,  B81C2201/019 ,  B81C2201/053 ,  H01J9/025

    Abstract: The invention relates to a method for protecting the interior of at least one cavity (4) having a portion of interest (5) and opening onto a face of a microstructured element (1), consisting of depositing, on said face, a nonconformal layer (6) of a protective material, in which said nonconformal layer closes off the cavity without covering the portion of interest.The invention also relates to a method for producing a device comprising such a microstructured element.

    Abstract translation: 本发明涉及一种用于保护具有感兴趣部分（5）的至少一个空腔（4）的内部的方法，并且在微结构化元件（1）的表面上开口，该方法包括在所述面上沉积非共形层 （6），其中所述非共形层在不覆盖感兴趣部分的情况下封闭空腔。 本发明还涉及一种用于制造包括这种微结构元件的器件的方法。

    Pre-released structure device
    57.
    发明授权
    Pre-released structure device 有权
    预发布结构设备

    公开(公告)号：US08138556B2

    公开(公告)日：2012-03-20

    申请号：US12338174

    申请日：2008-12-18

    Applicant: Stéphane Caplet

    Inventor： Stéphane Caplet

    IPC: H01L29/72

    CPC classification number: B81C1/00944 ,  B81C2201/019

    Abstract: A pre-released structure device comprising: at least one first stacking, comprising at least one first layer based on at least one first material, arranged against a second stacking comprising at least one second layer based on at least one second material, at least one closed cavity, formed in the first and/or the second stacking, and arranged between a portion of the first stacking forming the pre-released structure and the second stacking, at least one spacer arranged in the cavity and linking the portion of the first stacking to the second stacking.

    Abstract translation: 一种预释放的结构装置，包括：至少一个第一堆叠，包括至少一个基于至少一个第一材料的第一层，该第一层被布置成抵抗第二堆叠，所述第二堆叠包括至少一个基于至少一个第二材料的第二层， 闭合腔，形成在第一和/或第二堆叠中，并且布置在形成预释放结构的第一堆叠的一部分和第二堆叠之间，布置在空腔中的至少一个间隔件，并且将第一堆叠部分 到第二堆叠。

    MICROFLUIDIC DEVICES
    58.
    发明申请
    MICROFLUIDIC DEVICES 审中-公开
    微流体装置

    公开(公告)号：US20120009099A1

    公开(公告)日：2012-01-12

    申请号：US12830578

    申请日：2010-07-06

    Applicant: Pinyen LIN

    Inventor： Pinyen LIN

    IPC: B01L99/00

    CPC classification number: B01L3/502707 ,  B81B2201/058 ,  B81C1/00119 ,  B81C2201/0184 ,  B81C2201/019

    Abstract: Microfluidic devices are prepared by providing a substrate material having a solid adhesive thin sheet, printing solid ink on the substrate using a conventional printer, selectively etching the substrate using a wax masking layer to obtain a desired pattern, removing the masking layer from the substrate, aligning and bonding together the pattern of the substrate to a pattern of a second substrate to form a layer of substrates, and curing the layer of substrates to result in a three-dimensional microfluidic device.

    Abstract translation: 微流体装置通过提供具有固体粘合薄片的基底材料，使用常规打印机在基底上印刷固体油墨，使用蜡掩模层选择性地蚀刻基底以获得所需图案，从基底去除掩模层， 将衬底的图案对准和结合到第二衬底的图案以形成衬底层，并固化衬底层以产生三维微流体器件。

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