公开(公告)号：US20140186622A1

公开(公告)日：2014-07-03

申请号：US14126513

申请日：2013-04-09

Applicant: Kyowa Chemical Industry Co., Ltd.

Inventor： Daisuke Kudo ,  Kohei Oohori ,  Hitoshi Manabe ,  Shigeo Miyata

IPC: C08K3/22 ,  H01B7/295 ,  C09K21/02

CPC classification number: C08K3/22 ,  C01F5/14 ,  C01P2004/03 ,  C01P2004/24 ,  C01P2004/53 ,  C01P2004/54 ,  C01P2004/61 ,  C01P2004/62 ,  C01P2006/12 ,  C08K2003/2224 ,  C08K2201/003 ,  C08K2201/011 ,  C08K2201/014 ,  C08K2201/016 ,  C09K21/02 ,  H01B3/006 ,  H01B3/441 ,  H01B7/295 ,  Y10T428/2927 ,  Y10T428/2982

Abstract: A composite flame retardant which exhibits excellent flame retardancy and high dispersibility in a resin and rarely experiences the deterioration of mechanical strength, and a resin composition comprising the composite flame retardant.The composite flame retardant contains (i) 100 parts by weight of magnesium hydroxide particles (A) having an average thickness of 10 to 100 nm, an average width of 2.4 μm or more and an average aspect ratio of 20 to 120 and (ii) 100 to 900 parts by weight of magnesium hydroxide particles (B) having an average width of 1 μm or less and an average aspect ratio of less than 20.

Abstract translation: 在树脂中显示出优异的阻燃性和高分散性的复合阻燃剂，并且很少遭受机械强度的劣化，以及包含复合阻燃剂的树脂组合物。 复合阻燃剂含有（i）100重量份的平均厚度为10〜100nm，平均宽度为2.4μm以上，平均纵横比为20〜120的氢氧化镁粒子（A），（ii） 100〜900重量份的平均宽度为1μm以下且平均长径比小于20的氢氧化镁粒子（B）。

公开(公告)号：US20130316159A1

公开(公告)日：2013-11-28

申请号：US13982084

申请日：2012-08-30

Applicant: Kensuke Tsumura ,  Kazuhiro Sawa ,  Katsunori Takahashi ,  Yoshihiro Inui ,  Nobuhiko Inui ,  Koji Taniguchi

Inventor： Kensuke Tsumura ,  Kazuhiro Sawa ,  Katsunori Takahashi ,  Yoshihiro Inui ,  Nobuhiko Inui ,  Koji Taniguchi

IPC: B32B3/10 ,  B32B27/08 ,  B32B37/02 ,  B32B7/02

CPC classification number: B32B3/10 ,  B29C48/255 ,  B29C48/30 ,  B29C48/304 ,  B29C48/70 ,  B29C48/71 ,  B32B5/12 ,  B32B7/02 ,  B32B7/03 ,  B32B27/08 ,  B32B27/20 ,  B32B27/302 ,  B32B27/308 ,  B32B27/32 ,  B32B27/34 ,  B32B2250/42 ,  B32B2262/106 ,  B32B2264/108 ,  B32B2305/30 ,  B32B2307/50 ,  B32B2307/558 ,  C08K3/04 ,  C08K7/06 ,  C08K7/24 ,  C08K2201/011 ,  C08K2201/016 ,  Y10T428/2495 ,  Y10T428/24975 ,  Y10T428/25

Abstract: There are provided a multilayered resin molded body having high filler orientability and high mechanical strength, and a method for manufacturing the same. A multilayered resin molded body (1) comprising a plurality of laminated resin composition layers (11) comprising a thermoplastic resin (11a) and a filler (15) comprising a carbon material having a graphene structure, the filler (15) being dispersed in the thermoplastic resin (11a), wherein an angle formed by a longitudinal direction of each filler (15) and a direction that is an average of longitudinal directions of all fillers (15) is ±6° or less, and a method for manufacturing the multilayered resin molded body (1).

Abstract translation: 提供了具有高填料取向性和高机械强度的多层树脂成型体及其制造方法。 一种多层树脂成型体（1），其包含多个由热塑性树脂（11a）构成的层叠树脂组合物层（11）和具有石墨烯结构的碳材料的填料（15），所述填料（15）分散在 热塑性树脂（11a），其中由每个填料（15）的纵向形成的角度和所有填料（15）的纵向平均值的方向为±6°以下，以及制造多层 树脂成型体（1）。

公开(公告)号：US08575295B2

公开(公告)日：2013-11-05

申请号：US13328446

申请日：2011-12-16

Applicant: Michael Roth ,  Klaus Uske

Inventor： Michael Roth ,  Klaus Uske

IPC: C08G65/08 ,  C08G65/14

CPC classification number: C08K5/34928 ,  C08K5/34922 ,  C08K5/34924 ,  C08K5/5313 ,  C08K7/02 ,  C08K7/06 ,  C08K7/14 ,  C08K2201/004 ,  C08K2201/016 ,  C08L77/00 ,  C08L77/06 ,  C08L77/02

Abstract: Thermoplastic molding compositions comprising A) from 29 to 97.5% by weight of a thermoplastic polyamide, B) from 1 to 20% by weight of melamine cyanurate, C) from 0.5 to 10% by weight of an organic phosphorus compound based on 9,10-dihydro-9-oxa-10-phosphaphenanthrene oxide (DOPO) as parent structure, D) from 1 to 50% by weight of a fibrous filler, the aspect ratio (L/D) of which is from 4 to 25, and the arithmetic average fiber length of which is from 40 to 250 μm, and E) from 0 to 50% by weight of further additives, where the total of the percentages by weight of components A) to E) is 100%.

Abstract translation: 热塑性成型组合物，其包含A）29-97.5重量％的热塑性聚酰胺，B）1至20重量％的三聚氰胺氰尿酸酯，C）0.5至10重量％的基于9,10的有机磷化合物 - 二氢-9-氧杂-10-磷杂菲氧化物（DOPO）作为母体结构，D）1〜50重量％的纤维填料，纵横比（L / D）为4〜25， 其算术平均纤维长度为40至250μm，以及E）0至50重量％的其它添加剂，其中组分A）至E）的重量百分比的总和为100％。

公开(公告)号：US20130281598A1

公开(公告)日：2013-10-24

申请号：US13449399

申请日：2012-04-18

Applicant: KOSTANTINOS KOURTAKIS

Inventor： KOSTANTINOS KOURTAKIS

IPC: C08K3/34 ,  B82Y30/00

CPC classification number: C08K3/34 ,  C08K5/14 ,  C08K5/34924 ,  C08K2201/016 ,  C08L27/18 ,  C08L27/12

Abstract: Cured fluoroelastomer compositions containing a phyllosilicate of the formula Mgx Si7-x O(28-2x)/2-(y/2) (OH)y, wherein x=1 to 5 and y=0 to (28-2x), said phyllosilicate having an average length of at least 50 nm in at least one dimension and an aspect ratio >3:1 are disclosed.

Abstract translation: 含有式Mg x Si 7-x O（28-2x）/ 2-（y / 2）（OH）y的页硅酸盐的固化含氟弹性体组合物，其中x = 1至5，y = 0至（28-2x），所述 公开了在至少一个维度和纵横比> 3:1的平均长度至少为50nm的页硅酸盐。

公开(公告)号：US08324307B2

公开(公告)日：2012-12-04

申请号：US12198002

申请日：2008-08-25

Applicant: Philipp Harder ,  Thomas Jeltsch ,  Nikolai Lamberts

Inventor： Philipp Harder ,  Thomas Jeltsch ,  Nikolai Lamberts

IPC: C08K3/40 ,  C08K3/00 ,  C08G18/34 ,  C08L77/02 ,  C08L77/04

CPC classification number: C08G69/26 ,  C08G69/265 ,  C08G69/36 ,  C08K7/14 ,  C08K2201/016 ,  C08L77/06 ,  C08L2205/16

Abstract: The present invention relates to reinforced polyamide molding compounds containing high-melting partially aromatic polyamides and flat glass fibers, in particular with a rectangular cross section, i.e., glass fibers with a noncircular cross-sectional area and a dimension ratio of the main cross-sectional axis to the secondary cross-sectional axis of 2 to 6, in particular 3 to 6, most especially preferably from 3.5 to 5.0. The present invention also relates to a method for manufacturing polyamide molding compounds and molded articles manufactured therefrom, i.e., in particular injection-molded parts. The inventive molded parts have a high transverse stiffness and transverse strength.

Abstract translation: 本发明涉及含有高熔点部分芳族聚酰胺和扁平玻璃纤维的增强聚酰胺模塑料，特别是具有矩形横截面，即具有非圆形横截面积的玻璃纤维和主横截面的尺寸比 轴的次级横截面轴为2至6，特别是3至6，最特别优选为3.5至5.0。 本发明还涉及一种用于制造由其制造的聚酰胺模塑料及其模塑制品的方法，特别是注模部件。 本发明的模制件具有高横向刚度和横向强度。

公开(公告)号：US20120289662A1

公开(公告)日：2012-11-15

申请号：US13450696

申请日：2012-04-19

Applicant: Raffaele Martinoni

Inventor： Raffaele Martinoni

IPC: B29C35/08 ,  C08G63/183 ,  C08L67/02

CPC classification number: B29C67/0077 ,  B29C64/153 ,  B29C2035/0838 ,  B29K2067/00 ,  B29K2105/251 ,  B33Y10/00 ,  B33Y70/00 ,  C08K3/013 ,  C08K3/08 ,  C08K3/34 ,  C08K3/36 ,  C08K9/06 ,  C08K2003/0812 ,  C08K2201/016 ,  C08L67/02 ,  C08L2205/025 ,  C08L2666/18

Abstract: Powder compositions and articles and methods of forming articles from powder compositions are provided. In one embodiment the powder compositions include at least one polyester polymer powder and an amount of reinforcing particles having an aspect ratio of preferably at least about 5:1. In another embodiment the powder compositions include at least one medium-high melting temperature, aromatic and crystalline polyester polymer powder. In a preferred embodiment, the powder composition is capable of being formed, via a laser sintering process, into a three-dimensional article that exhibits one or more desirable mechanical properties in an elevated temperature environment.

Abstract translation: 提供了粉末组合物和由粉末组合物制备制品的制品和方法。 在一个实施方案中，粉末组合物包括至少一种聚酯聚合物粉末和一定量的纵横比优选至少约5:1的增强颗粒。 在另一个实施方案中，粉末组合物包括至少一种中高熔点温度，芳族和结晶聚酯聚合物粉末。 在优选的实施方案中，粉末组合物能够通过激光烧结方法形成三维制品，其在高温环境中表现出一种或多种所需的机械性能。

公开(公告)号：US20120286220A1

公开(公告)日：2012-11-15

申请号：US13529587

申请日：2012-06-21

Applicant: Mayuko TAKASU ,  Takeshi Otsu ,  Kenichi Takizawa ,  Yutaka Mori

Inventor： Mayuko TAKASU ,  Takeshi Otsu ,  Kenichi Takizawa ,  Yutaka Mori

IPC: G02B5/26

CPC classification number: H01L33/56 ,  C08G77/12 ,  C08G77/20 ,  C08K3/36 ,  C08K5/56 ,  C08K2003/2227 ,  C08K2201/016 ,  C08L83/04 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49107 ,  H01L2933/0091 ,  C08L83/00 ,  H01L2924/00014

Abstract: The present invention provides a material for a molded resin as a material for a semiconductor light-emitting device that can yield a highly durable (light resistance and heat resistance) molded resin and can also improve the LED output through an excellent reflectivity. The present invention also provides an easily moldable material for a molded resin for a semiconductor light-emitting device. The material for a molded resin for a semiconductor light-emitting device is a resin composition comprising (A) a polyorganosiloxane, (B) a white pigment, and (C) a curing catalyst, wherein the white pigment (B) has the following characteristics (a) and (b); (a) an aspect ratio 1.2 or more and 4.0 or less, and (b) a primary particle diameter 0.1 μm or more and 2.0 μm or less.

Abstract translation: 本发明提供了一种用于模制树脂作为半导体发光器件的材料的材料，其可以产生高耐用（耐光和耐热）模制树脂，并且还可以通过优异的反射率改善LED的输出。 本发明还提供了一种用于半导体发光器件的模制树脂的易模制材料。 用于半导体发光装置的模制树脂的材料是包含（A）聚有机硅氧烷，（B）白色颜料和（C）固化催化剂的树脂组合物，其中白色颜料（B）具有以下特征 （a）和（b）; （a）长宽比为1.2以上且4.0以​​下，（b）初级粒径为0.1μm以上且2.0μm以下。

公开(公告)号：US20120231257A1

公开(公告)日：2012-09-13

申请号：US13510626

申请日：2010-11-19

Applicant: Meredith L. Dunbar ,  Brian C. Auman ,  Tao He ,  Kostantinos Kourtakis

Inventor： Meredith L. Dunbar ,  Brian C. Auman ,  Tao He ,  Kostantinos Kourtakis

IPC: C08G73/10 ,  B32B27/20

CPC classification number: H01L23/482 ,  C08G73/1042 ,  C08G73/1046 ,  C08G73/105 ,  C08G73/1067 ,  C08G73/1071 ,  C08J5/18 ,  C08J2379/08 ,  C08K7/00 ,  C08K7/02 ,  C08K7/04 ,  C08K7/08 ,  C08K2201/016 ,  C08L79/08 ,  H01L23/293 ,  H01L23/295 ,  H01L24/12 ,  H01L2224/0231 ,  H01L2224/02319 ,  H01L2224/0233 ,  H01L2224/02335 ,  H01L2224/0236 ,  H01L2224/024 ,  H01L2224/0401 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01021 ,  H01L2924/01057 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/09701 ,  H01L2924/12032 ,  H01L2924/14 ,  H05K1/0346 ,  H05K1/0373 ,  H05K2201/0154 ,  H05K2201/0209 ,  Y10T428/25 ,  Y10T428/256 ,  Y10T428/257 ,  Y10T428/259 ,  H01L2924/00

Abstract: The present disclosure is directed to a polyimide film. The film is composed of a polyimide and a sub-micron filler. The polyimide is derived from at least one aromatic dianhydride component selected from rigid rod dianhydride, non-rigid rod dianhydride and combinations thereof, and at least one aromatic diamine component selected from rigid rod diamine, non-rigid rod diamine and combinations thereof. The mole ratio of dianhydride to diamine is 48-52:52-48 and the ratio of X:Y is 20-80:80-20 where X is the mole percent of rigid rod dianhydride and rigid rod diamine, and Y is the mole percent of non-rigid rod dianhydride and non-rigid rod diamine. The sub-micron filler is less than 550 nanometers in at least one dimension; has an aspect ratio greater than 3:1; is less than the thickness of the film in all dimensions.

Abstract translation: 本公开涉及聚酰亚胺膜。 该膜由聚酰亚胺和亚微米填料组成。 聚酰亚胺衍生自至少一种芳族二酸酐组分，其选自刚性链二酸酐，非刚性二醇二酸酐及其组合，以及至少一种芳族二胺组分，其选自刚性链二胺，非刚性棒二胺及其组合。 二酐与二胺的摩尔比为48-52：52-48，X：Y的比例为20-80：80-20，其中X为刚性链二酸酐和刚性二胺的摩尔百分数，Y为摩尔比 百分比的非刚性棒二酸酐和非刚性棒二胺。 亚微米填料在至少一个维度上小于550纳米; 长宽比大于3：1; 小于所有尺寸的薄膜的厚度。

公开(公告)号：US20120227790A1

公开(公告)日：2012-09-13

申请号：US13510627

申请日：2010-11-19

Applicant: Brian C. Auman ,  Meredith L. Dunbar ,  Tao He ,  Kostantinos Kourtakis

Inventor： Brian C. Auman ,  Meredith L. Dunbar ,  Tao He ,  Kostantinos Kourtakis

IPC: H01L31/042 ,  H01L31/0264

CPC classification number: H01L23/482 ,  C08G73/1042 ,  C08G73/1046 ,  C08G73/105 ,  C08G73/1067 ,  C08G73/1071 ,  C08J5/18 ,  C08J2379/08 ,  C08K7/00 ,  C08K7/02 ,  C08K7/04 ,  C08K7/08 ,  C08K2201/016 ,  C08L79/08 ,  H01L23/293 ,  H01L23/295 ,  H01L24/12 ,  H01L2224/0231 ,  H01L2224/02319 ,  H01L2224/0233 ,  H01L2224/02335 ,  H01L2224/0236 ,  H01L2224/024 ,  H01L2224/0401 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01021 ,  H01L2924/01057 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/09701 ,  H01L2924/12032 ,  H01L2924/14 ,  H05K1/0346 ,  H05K1/0373 ,  H05K2201/0154 ,  H05K2201/0209 ,  Y10T428/25 ,  Y10T428/256 ,  Y10T428/257 ,  Y10T428/259 ,  H01L2924/00

Abstract: The assemblies of the present disclosure comprise an electrode, and a polyimide film. The polyimide film comprises a sub-micron filler and a polyimide. The polyimide is derived from at least one aromatic dianhydride component selected from rigid rod dianhydride, non-rigid rod dianhydride and combinations thereof, and at least one aromatic diamine component selected from rigid rod diamine, non-rigid rod diamine and combinations thereof. The mole ratio of dianhydride to diamine is 48-52:52-48 and the ratio of X:Y is 20-80:80-20 where X is the mole percent of rigid rod dianhydride and rigid rod diamine, and Y is the mole percent of non-rigid rod dianhydride and non-rigid rod diamine. The sub-micron filler is less than 550 nanometers in at least one dimension; has an aspect ratio greater than 3:1; is less than the thickness of the film in all dimensions.

Abstract translation: 本公开的组件包括电极和聚酰亚胺膜。 聚酰亚胺膜包括亚微米填料和聚酰亚胺。 聚酰亚胺衍生自至少一种芳族二酸酐组分，其选自刚性链二酸酐，非刚性二醇二酸酐及其组合，以及至少一种芳族二胺组分，其选自刚性链二胺，非刚性棒二胺及其组合。 二酐与二胺的摩尔比为48-52：52-48，X：Y的比例为20-80：80-20，其中X为刚性链二酸酐和刚性二胺的摩尔百分数，Y为摩尔比 百分比的非刚性棒二酸酐和非刚性棒二胺。 亚微米填料在至少一个维度上小于550纳米; 长宽比大于3：1; 小于所有尺寸的薄膜的厚度。

公开(公告)号：US08216672B2

公开(公告)日：2012-07-10

申请号：US11152984

申请日：2005-06-14

Applicant: James David Blackhall Smith ,  Gary Stevens ,  John William Wood

Inventor： James David Blackhall Smith ,  Gary Stevens ,  John William Wood

IPC: B32B7/12 ,  H01L23/24

CPC classification number: C08K3/22 ,  C08K3/14 ,  C08K3/28 ,  C08K2201/016 ,  H05K1/0373 ,  H05K2201/0248 ,  Y10T428/24994 ,  Y10T428/249986 ,  Y10T428/28 ,  Y10T442/2418 ,  Y10T442/2992 ,  Y10T442/50

Abstract: In one embodiment the present invention provides for a high thermal conductivity highly structured resin that comprises a host highly structured resin matrix, and a high thermal conductivity filler 30. The high thermal conductivity fillers are from 1-1000 nm in length, and high thermal conductivity fillers have an aspect ratio of between 3-100. Particular highly structured highly structured resins include at least one of liquid crystal 40 polymers, interpenetrating networks, dendrimer type matrices, expanding polymers, ladder polymers, star polymers and structured organic-inorganic hybrids 60.

Abstract translation: 在一个实施方案中，本发明提供了包含主体高度结构化树脂基质和高导热性填料30的高导热性高结构化树脂。高热导率填料的长度为1-1000nm，高导热性 填料的纵横比在3-100之间。 特别高度结构化的高度结构化树脂包括液晶40聚合物，互穿网络，树枝状聚合物基质，膨胀聚合物，梯形聚合物，星形聚合物和结构化有机 - 无机杂化物60中的至少一种。