公开(公告)号：US20110045304A1

公开(公告)日：2011-02-24

申请号：US12694948

申请日：2010-01-27

Applicant: MIN SHE SU

Inventor： MIN SHE SU

IPC: B32B27/18 ,  C09J5/02 ,  B32B17/10

CPC classification number: C08J5/24 ,  C08F212/08 ,  C08F212/14 ,  C08F212/34 ,  C08J2309/00 ,  C08J2309/06 ,  C08J2325/18 ,  C08J2353/02 ,  C08K3/013 ,  C08K3/40 ,  C08K5/0066 ,  C08K5/14 ,  C08K7/14 ,  C08L9/06 ,  C08L25/18 ,  H05K1/032 ,  H05K1/0366 ,  H05K1/0373 ,  H05K2201/012 ,  H05K2201/0158 ,  H05K2201/0209 ,  Y10T428/31533 ,  Y10T428/31544 ,  Y10T428/31547 ,  Y10T428/31645 ,  Y10T442/2992 ,  C08L2666/06 ,  C08L2666/04

Abstract: The present invention relates to a composite material, a high-frequency circuit substrate made therefrom and making method thereof. The composite material comprises 20-70 parts by weight of thermosetting mixture, a fiberglass cloth, a powder filler, a flame retardant, and a cure initiator. The thermosetting mixture includes a resin containing vinyl in the amount of more than 60% composed of carbon and hydrogen with its molecular weight being less than 11000, and a solid styryl resin of middle or low molecular weight with unsaturated double bonds. The made high-frequency circuit substrate comprises a plurality of prepregs mutually overlapped, and copper foils respectively covered on both sides of overlapped prepregs. Each prepreg is made from the composite material. The composite material of the present invention enable to readily make prepregs. The high-frequency circuit substrate made from the composite material has low dielectric constant, low dielectric loss tangent, and good heat resistance, and is convenient for process operation. Therefore, the composite material of the present invention is suitable for making circuit substrates of high-frequency electronic equipments.

Abstract translation: 复合材料及其制造方法技术领域本发明涉及复合材料，由其制成的高频电路基板及其制造方法。 复合材料包含20-70重量份的热固性混合物，玻璃纤维布，粉末填料，阻燃剂和固化引发剂。 热固性混合物包括含有分子量小于11000的由碳和氢组成的含量超过60％的乙烯基树脂和具有不饱和双键的中等或低分子量的固体苯乙烯基树脂。 制成的高频电路基板包括相互重叠的多个预浸料，分别覆盖在重叠的预浸料的两侧的铜箔。 每个预浸料由复合材料制成。 本发明的复合材料能够容易地制备预浸料。 由复合材料制成的高频电路基板具有低介电常数，低介电损耗角正切和良好的耐热性，方便操作。 因此，本发明的复合材料适用于制造高频电子设备的电路基板。

公开(公告)号：US20100108364A1

公开(公告)日：2010-05-06

申请号：US12610004

申请日：2009-10-30

Applicant: Guoren He ,  William D Varnell ,  Thomas J Williams

Inventor： Guoren He ,  William D Varnell ,  Thomas J Williams

IPC: H05K1/03 ,  B32B27/42 ,  B29C65/00 ,  C08K5/1515

CPC classification number: C08G59/621 ,  C08K5/0066 ,  C08K5/1515 ,  C08K5/521 ,  C08L63/00 ,  C08L71/12 ,  H05K1/0373 ,  H05K2201/012 ,  H05K2203/122 ,  C08L2666/22

Abstract: Flame retardant compositions that are halogen-free or substantially halogen-free are disclosed. In certain examples, the compositions comprise a polyphenylene ether, a halogen-free or substantially halogen-free polyepoxide, and one or more phosphorated compounds. Prepregs, laminates, molded articles and printed circuit boards using the compositions are also disclosed.

Abstract translation: 公开了无卤素或基本上不含卤素的阻燃组合物。 在某些实施例中，组合物包含聚苯醚，不含卤素或基本上不含卤素的聚环氧化物，以及一种或多种磷酸化化合物。 还公开了使用该组合物的预浸料，层压板，模制品和印刷电路板。

公开(公告)号：US07678852B2

公开(公告)日：2010-03-16

申请号：US12157706

申请日：2008-06-12

Applicant: Nikolas Kaprinidis

Inventor： Nikolas Kaprinidis

IPC: C08K5/3492

CPC classification number: H05K1/0373 ,  C08K5/34928 ,  C08K5/5317 ,  H05K2201/012 ,  H05K2203/122

Abstract: Polymer compositions are afforded flame retardancy with the incorporation of a combination of melamine polyphosphate and poly(m-phenylene methylphosphonate). The polymer compositions are for instance epoxy resins for prepegs, laminates and printed circuit boards. The epoxy resins are for example for coating electronic parts. The polymer compositions are also thermoplastics such as polyolefins or polystyrenics, useful as fibers, films or molded parts. The melamine polyphosphate may be of a fine particle size.

Abstract translation: 聚合物组合物具有阻燃性，并结合三聚氰胺多磷酸盐和聚（间亚苯基甲基膦酸盐）。 聚合物组合物例如是用于预制物，层压板和印刷电路板的环氧树脂。 环氧树脂例如用于涂覆电子部件。 聚合物组合物也是热塑性塑料如聚烯烃或聚苯乙烯，可用作纤维，薄膜或模制件。 三聚氰胺多磷酸盐可以是细颗粒尺寸。

公开(公告)号：US07638564B2

公开(公告)日：2009-12-29

申请号：US11529661

申请日：2006-09-29

Applicant: Satoru Amou ,  Haruo Akahoshi ,  Yoshihiro Nakamura ,  Nobuyuki Minami ,  Yasuhiro Murai

Inventor： Satoru Amou ,  Haruo Akahoshi ,  Yoshihiro Nakamura ,  Nobuyuki Minami ,  Yasuhiro Murai

IPC: C08K5/3447 ,  C08K5/03 ,  C08K3/34

CPC classification number: B32B5/26 ,  B32B5/022 ,  B32B15/14 ,  B32B15/20 ,  B32B2255/02 ,  B32B2262/02 ,  B32B2262/10 ,  B32B2307/3065 ,  C08J5/24 ,  C08J2371/12 ,  C08K3/36 ,  C08K5/0066 ,  H05K1/0373 ,  H05K3/4626 ,  H05K2201/012 ,  H05K2201/0133 ,  H05K2201/0209 ,  Y10T428/25 ,  Y10T428/259

Abstract: There is provided a varnish of a low dielectric loss tangent resin composition which is low in viscosity and excellent in storage stability. The varnish of a low dielectric loss tangent resin composition contains a thermosetting monomer (A) having a weight average molecular weight of not more than 1,000, a high polymer (B) having a weight average molecular weight of not less than 5,000, a halogen flame-retardant agent (C), a silicon dioxide filler (D), and an organic solvent (E). The average particle diameter of each the components (C) and (D) is in the range of 0.2 to 3 μm.

Abstract translation: 提供了一种低介电损耗角正切树脂组合物的清漆，其粘度低，储存稳定性优异。 低介电损耗角正切树脂组合物的清漆含有重均分子量不大于1000的热固性单体（A），重均分子量不小于5,000的高聚物（B），卤素火焰 缓冲剂（C），二氧化硅填料（D）和有机溶剂（E）。 各成分（C）和（D）的平均粒径为0.2〜3μm的范围。

公开(公告)号：US20090247032A1

公开(公告)日：2009-10-01

申请号：US12385194

申请日：2009-04-01

Applicant: Kenichi Mori ,  Ito Syouichi

Inventor： Kenichi Mori ,  Ito Syouichi

IPC: B32B27/00 ,  C09K21/14 ,  D03D15/00

CPC classification number: H05K1/0373 ,  C08G65/485 ,  C08K3/36 ,  C08K7/20 ,  C08L63/00 ,  C08L65/00 ,  C08L67/00 ,  C08L69/00 ,  C08L71/126 ,  H05K2201/012 ,  H05K2201/0209 ,  Y10T428/31678 ,  Y10T442/30 ,  C08L2666/14

Abstract: A vinyl-compound-based resin composition containing a terminal vinyl compound (a) of a bifunctional phenylene ether oligomer having a polyphenylene ether structure, a naphthol aralkyl type cyanate ester resin (b), a bisphenol A cyanate ester resin (c), a brominated flame retardant (d) and an inorganic filler (e), which resin composition is for use in a printed wiring board for high multilayer and high frequency and is improved in moldability and copper foil peel strength, which are conventional problems, without any decrease in electric characteristics and heat resistance after moisture absorption while keeping flame retardancy, a prepreg comprising the above resin composition and a glass woven fabric, a metal-foil-clad laminate obtained by disposing a metal foil on one side or both sides of a stack of at least one prepreg and laminate-molding the resultant set, and a resin sheet obtained by applying a solution of the above resin composition to a surface of a metal foil or a film.

Abstract translation: 含有具有聚苯醚结构的双官能亚苯基醚低聚物的末端乙烯基化合物（a），萘酚芳烷基型氰酸酯树脂（b），双酚A氰酸酯树脂（c），乙烯基化合物系树脂 溴化阻燃剂（d）和无机填料（e），该树脂组合物用于高多层和高频率的印刷线路板，并且提高成型性和铜箔剥离强度，这是常规问题，没有任何降低 在保持阻燃性的同时具有吸湿性的电特性和耐热性，包含上述树脂组合物的预浸料和玻璃织物，通过在一堆的一侧或两侧设置金属箔而获得的金属箔覆层叠层 至少一个预浸料坯和层压成型所得的组合物，以及通过将上述树脂组合物的溶液施加到金属箔或膜的表面而获得的树脂片材。

公开(公告)号：US07524394B2

公开(公告)日：2009-04-28

申请号：US11401854

申请日：2006-04-12

Applicant: Toru Nakanishi ,  Kazunori Kondo ,  Shigehiro Hoshida ,  Tadashi Amano

Inventor： Toru Nakanishi ,  Kazunori Kondo ,  Shigehiro Hoshida ,  Tadashi Amano

IPC: B32B37/12 ,  B32B27/38 ,  C08L63/00 ,  C09J163/00

CPC classification number: H05K3/386 ,  B32B7/12 ,  B32B15/06 ,  B32B15/092 ,  B32B15/16 ,  B32B15/20 ,  B32B25/08 ,  B32B25/16 ,  B32B27/08 ,  B32B27/18 ,  B32B27/26 ,  B32B27/38 ,  B32B2264/104 ,  B32B2274/00 ,  B32B2307/202 ,  B32B2307/306 ,  B32B2307/3065 ,  B32B2307/5825 ,  B32B2405/00 ,  B32B2457/00 ,  C08J5/125 ,  C08K5/3462 ,  C08K5/34922 ,  C08K5/5205 ,  C08L33/08 ,  C08L33/20 ,  C08L55/02 ,  C08L63/00 ,  C08L2666/02 ,  C08L2666/14 ,  C09J7/10 ,  C09J11/06 ,  C09J113/00 ,  C09J133/08 ,  C09J133/20 ,  C09J155/02 ,  C09J163/00 ,  C09J2205/102 ,  C09J2433/00 ,  C09J2455/00 ,  C09J2461/00 ,  C09J2463/00 ,  C09J2467/00 ,  C09K21/12 ,  H05K1/0346 ,  H05K1/0393 ,  H05K2201/012 ,  H05K2201/0133 ,  H05K2203/122 ,  Y10T428/24917 ,  Y10T428/2804 ,  Y10T428/31511 ,  Y10T428/31515 ,  Y10T428/31522 ,  Y10T428/31529 ,  Y10T428/31721

Abstract: Provided is a flame retardant adhesive composition including (A) a halogen-free epoxy resin, (B) a thermoplastic resin and/or a synthetic rubber, (C) a curing agent, (D) a nitrogen-containing polyphosphate compound, and (E) a curing accelerator. Also provided are an adhesive sheet having a layer including the above composition, and a protective layer for covering the layer including the composition; a coverlay film having an electrically insulating film, and a layer including the above composition provided on top of the film; a flexible copper-clad laminate having an electrically insulating film, a layer including the above composition provided on top of the film, and copper foil; and a method of bonding two substrates, including the steps of sandwiching the above adhesive sheet between two substrates, and curing the adhesive sheet. Further provided are a process for producing the adhesive sheet, a process for producing the coverlay film, and a process for producing the flexible copper-clad laminate. The halogen-free adhesive composition yields a cured product, on curing, that exhibits excellent flame retardancy and anti-migration properties. The composition can be used for producing an adhesive sheet, a coverlay film, and a flexible copper-clad laminate. The adhesive sheet can be used for a method of bonding two substrates.

Abstract translation: 本发明提供阻燃性粘合剂组合物，其包含（A）无卤环氧树脂，（B）热塑性树脂和/或合成橡胶，（C）固化剂，（D）含氮多磷酸盐化合物和（ E）固化促进剂。 还提供了具有包含上述组合物的层的粘合片和用于覆盖包含该组合物的层的保护层; 具有电绝缘膜的覆盖层膜和设置在膜顶部的包含上述组合物的层; 具有电绝缘膜的柔性覆铜层压板，设置在膜顶部的上述组成的层和铜箔; 以及将两个基板接合的方法，包括将上述粘合片夹在两个基板之间并固化粘合片的步骤。 还提供了粘合片的制造方法，覆盖膜的制造方法以及制造柔性覆铜层压体的方法。 无卤粘合剂组合物在固化时产生固化产物，其显示出优异的阻燃性和抗迁移性能。 该组合物可用于生产粘合片，覆盖膜和柔性覆铜层压板。 粘合片可以用于粘合两个基底的方法。

公开(公告)号：US07518065B2

公开(公告)日：2009-04-14

申请号：US11267792

申请日：2005-11-03

Applicant: Nobuaki Fujii

Inventor： Nobuaki Fujii

IPC: H05K1/00 ,  H05K3/02

CPC classification number: H05K1/028 ,  H05K3/28 ,  H05K3/285 ,  H05K2201/012 ,  H05K2201/0394 ,  H05K2201/09063 ,  H05K2203/1178 ,  H05K2203/1545 ,  Y10T29/49156

Abstract: A printed wiring board for a plasma display, comprising: an insulating film having a folding slit(s) provided at its folding position; a wiring pattern provided on at least one surface of the insulating film; and a flame retardant solder resist layer provided so as for a terminal part to be exposed on the surface of the wiring pattern, the folding slit being provided in a divided form in the longitudinal direction of the slit, a flame retardant solder resist layer being provided on the backside of the folding slit, foams or pinholes in the backside flame retardant solder resist layer formed in the divided slit region having been expelled. Even in a printed wiring board to which high voltage is applied, the separation of the flame retardant solder resist layer can be prevented, and, at the same time, the occurrence of pinholes can be reduced.

Abstract translation: 一种用于等离子体显示器的印刷线路板，包括：绝缘膜，其具有设置在其折叠位置处的折叠狭缝; 设置在所述绝缘膜的至少一个表面上的布线图案; 以及阻燃性阻焊层，其设置为使端子部分露出在布线图案的表面上，折缝在狭缝的长度方向上以分割形式设置，提供阻燃阻焊层 在折叠狭缝的背面，形成在已经排出的分割狭缝区域中的背面阻燃阻燃剂层中的泡沫或针孔。 即使在施加高电压的印刷电路板中，也可以防止阻燃阻燃剂层的分离，同时可以减少针孔的发生。

公开(公告)号：US20080200617A1

公开(公告)日：2008-08-21

申请号：US11916435

申请日：2006-12-12

Applicant: Berthold Just ,  Holger Keller ,  Manfred Doering ,  Uwe Storzer ,  Sebastian Seibold

Inventor： Berthold Just ,  Holger Keller ,  Manfred Doering ,  Uwe Storzer ,  Sebastian Seibold

IPC: C08G59/40 ,  C08G2/00 ,  C08G79/04

CPC classification number: C08G59/4007 ,  C08G59/3254 ,  H05K1/0326 ,  H05K2201/012

Abstract: The invention relates to a method for preparing halogen-free flameproof epoxy resins, in which a halogen-free epoxy resin is reacted with a polyfunctional aldehyde or ketone and a phosphinic acid derivative, wherein the phosphinic acid derivative contains at least one P—H-active structural unit of the formula ═PH(O) and is used in an amount equivalent to the polyfunctionality of the aldehyde or ketone, to a halogen-free flameproof epoxy resin obtainable by this method, to the use of the epoxy resin as a base material for the manufacture of printed circuit boards and printed circuits and to intermediates used to prepare the epoxy resins.

Abstract translation: 本发明涉及一种制备无卤素防火环氧树脂的方法，其中无卤环氧树脂与多官能醛或酮和次膦酸衍生物反应，其中次膦酸衍生物含有至少一个PH-活性结构 通式为-PH（O）的单元，以与醛或酮的多官能度相同的量使用通过该方法得到的无卤阻燃型环氧树脂，以环氧树脂为基料的用途 印刷电路板和印刷电路的制造以及用于制备环氧树脂的中间体。

公开(公告)号：US20080171800A1

公开(公告)日：2008-07-17

申请号：US12008602

申请日：2008-01-11

Applicant: Mathias Dietz ,  Harald Bauer ,  Werner Krause

Inventor： Mathias Dietz ,  Harald Bauer ,  Werner Krause

IPC: C08F2/46 ,  C08J3/28 ,  C08F2/50

CPC classification number: H05K3/287 ,  C08K5/5313 ,  H05K2201/012 ,  C08L63/10

Abstract: The invention relates to a flame-retardant resin formulation comprising respectively at least one flame-retardant component, one alkali-soluble component, one polymerizable monomer, one photoinitiator, and one epoxy component, which comprises, as flame-retardant component, a phosphinic salt of the formula (I), in which R1 and R2 are identical or different and, independently of one another, are C1-C6-alkyl, linear or branched, and/or aryl; M is Mg, Ca, Al, Sb, Sn, Ge, Ti, Zn, Fe, Zr, Ce, Bi, Sr, Mn, Li, Na, K, and/or a protonated nitrogen base, and m is from 1 to 4. This novel flame-retardant resin formulation is preferably used as solder resist.

Abstract translation: 本发明涉及一种阻燃树脂配方，其包含至少一种阻燃组分，一种碱溶性组分，一种可聚合单体，一种光引发剂和一种环氧组分，其包含作为阻燃组分的次膦酸盐 其中R 1和R 2各自相同或不同，并且彼此独立地为C 1〜 C 6 -C 6烷基，直链或支链和/或芳基; M是Mg，Ca，Al，Sb，Sn，Ge，Ti，Zn，Fe，Zr，Ce，Bi，Sr，Mn，Li，Na，K和/或质子化的氮碱，m是1〜 该新型阻燃树脂配方优选用作阻焊剂。

公开(公告)号：US20080097014A1

公开(公告)日：2008-04-24

申请号：US11886126

申请日：2006-03-10

Applicant: Chong-Soo Park ,  Choong-Ryul Lim ,  Jae-Ho Choi ,  Bong-Goo Choi ,  Tae-Kyoo Shin ,  Eun-Yong Lee

Inventor： Chong-Soo Park ,  Choong-Ryul Lim ,  Jae-Ho Choi ,  Bong-Goo Choi ,  Tae-Kyoo Shin ,  Eun-Yong Lee

IPC: C09K21/12 ,  C08K3/40 ,  C08K5/1545 ,  C08L71/02

CPC classification number: H05K1/0326 ,  C08G59/3254 ,  C08L63/04 ,  C08L85/02 ,  H05K2201/012 ,  C08L2666/22

Abstract: Disclosed is a non-halogen type highly heat resistant flame retardant epoxy resin composition that is made by compounding a phosphorous-modified epoxy resin with a phosphazene compound as a flame retardant additive, wherein the phosphorous-modified epoxy resin is obtained by reacting a phosphorous-containing compound with an epoxy resin. The non-halogen flame retardant and highly heat resistant phosphorous-modified epoxy resins according to the present invention have the excellent flame retardancy property and the good thermal property without halogen and thus can be advantageously utilized in manufacturing a printed circuit board (PCB) and for complex materials.

Abstract translation: 公开了通过将磷改性环氧树脂与磷腈化合物配合作为阻燃添加剂制成的非卤素型高耐热性阻燃环氧树脂组合物，其中所述磷改性环氧树脂通过使磷 - 含有环氧树脂的化合物。 根据本发明的非卤素阻燃剂和高耐热磷改性环氧树脂具有优异的阻燃性能和良好的不含卤素的热性能，因此可有利地用于制造印刷电路板（PCB）和用于 复杂的材料。