公开(公告)号：US20130322812A1

公开(公告)日：2013-12-05

申请号：US13653612

申请日：2012-10-17

Applicant: BING-HENG LEE

Inventor： BING-HENG LEE

IPC: G02B6/12 ,  B32B38/04 ,  B32B38/10

CPC classification number: G02B6/122 ,  G02B6/3608 ,  H05K1/0274 ,  H05K1/116 ,  H05K3/427 ,  H05K2201/0108 ,  H05K2201/0145 ,  H05K2201/09063 ,  H05K2201/09545

Abstract: An optical printed circuit board includes a flexible substrate and a flexible optical wave guide. The flexible substrate includes a flexible sheet and a copper layer set on the flexible sheet. A part of the copper layer is removed for receiving the flexible optical wave guide. The flexible optical wave guide sets on the flexible sheet at the position where the part of the copper layer is removed.

Abstract translation: 光学印刷电路板包括柔性基板和柔性光波导。 柔性基板包括柔性片和设置在柔性片上的铜层。 去除铜层的一部分以接收柔性光波导。 柔性光波导在铜层的一部分被去除的位置处设置在柔性片上。

公开(公告)号：US20130071676A1

公开(公告)日：2013-03-21

申请号：US13579073

申请日：2011-06-16

Applicant: Kazuki Kammuri

Inventor： Kazuki Kammuri

IPC: B32B15/08

CPC classification number: H05K3/022 ,  B32B15/08 ,  B32B15/085 ,  B32B15/09 ,  B32B15/20 ,  B32B2457/08 ,  H05K1/0393 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2201/0358 ,  Y10T428/31678

Abstract: A copper foil composite comprising a copper foil and a resin layer laminated thereon, wherein equation 1:(f3×t3)/(f2×t2)≧1 is satisfied when t2 (mm) is a thickness of the copper foil, f2 (MPa) is a stress of the copper foil under tensile strain of 4%, t3 (mm) is a thickness of the resin layer, f3 (MPa) is a stress of the resin layer under tensile strain of 4%, and equation 2:1≦33f1/(F×T) is satisfied when f1 (N/mm) is 180° peeling strength between the copper foil and the resin layer, F(MPa) is strength of the copper foil composite under tensile strain of 30%, and T (mm) is a thickness of the copper foil composite.

Abstract translation: 包含铜箔和层叠在其上的树脂层的铜箔复合体，当t2（mm）为铜箔的厚度时，满足式（f3×t3）/（f2×t2）≥1），f2（MPa ）是拉伸应变为4％时的铜箔的应力，t3（mm）是树脂层的厚度，f3（MPa）是树脂层在拉伸应变下的应力为4％，式2：1＆nlE ;当f 1（N / mm）是铜箔和树脂层之间的180°剥离强度时，满足33f1 /（F×T），F（MPa）是拉伸应变下的铜箔复合材料的强度为30％， T（mm）是铜箔复合体的厚度。

公开(公告)号：US20110305883A1

公开(公告)日：2011-12-15

申请号：US13203216

申请日：2010-01-18

Applicant: Shingo Kaimori ,  Jun Sugawara ,  Akira Mizoguchi ,  Syougo Asai ,  Takuma Yoshisaka ,  Naota Uenishi

Inventor： Shingo Kaimori ,  Jun Sugawara ,  Akira Mizoguchi ,  Syougo Asai ,  Takuma Yoshisaka ,  Naota Uenishi

IPC: B32B3/10 ,  C09J7/02 ,  C09J167/02 ,  C09J163/04 ,  C09J171/10 ,  C09J163/02 ,  C09J177/00 ,  B32B7/12 ,  C09J161/14

CPC classification number: C09J167/00 ,  C08G59/304 ,  C08G59/3272 ,  C08G2650/56 ,  C08K5/3437 ,  C08L67/00 ,  C08L77/00 ,  C08L79/04 ,  C08L2666/14 ,  C09J7/22 ,  C09J7/35 ,  C09J163/00 ,  C09J171/00 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2461/00 ,  C09J2463/00 ,  C09J2467/00 ,  C09J2477/00 ,  H01L2924/00013 ,  H05K1/0393 ,  H05K3/386 ,  H05K2201/012 ,  H05K2201/0145 ,  Y10T428/24802 ,  Y10T428/287 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599

Abstract: Provided are an adhesive resin composition that is halogen-free, has good adhesiveness, solder heat resistance, and flame retardancy, and has good flow characteristics, and a laminate and a flexible printed wiring board using the same. The adhesive resin composition contains a phosphorus-containing epoxy resin and/or a phosphorus-containing phenoxy resin, a phosphorus-containing polyester resin having a weight-average molecular weight of more than 20,000 and 150,000 or less, another thermoplastic resin, and a curing agent. The adhesive resin composition preferably further contains a benzoxazine compound. Preferably, substantially no inorganic filler is mixed in the adhesive resin composition.

Abstract translation: 本发明提供无卤素，粘合性，焊料耐热性，阻燃性，流动特性良好的粘合性树脂组合物，以及使用该树脂组合物的层叠体和柔性印刷线路板。 粘合剂树脂组合物含有含磷环氧树脂和/或含磷苯氧树脂，重均分子量大于20,000和150,000以下的含磷聚酯树脂，另一种热塑性树脂和固化 代理商 粘合性树脂组合物优选还含有苯并恶嗪化合物。 优选地，在粘合剂树脂组合物中基本上不混合无机填料。

公开(公告)号：US20110229629A1

公开(公告)日：2011-09-22

申请号：US13049045

申请日：2011-03-16

Applicant: Toyonari ITO ,  Shohei AZAMI

Inventor： Toyonari ITO ,  Shohei AZAMI

IPC: B05D5/12 ,  B29C70/36

CPC classification number: C08J5/046 ,  C08J2367/03 ,  C09K19/3809 ,  H01B3/485 ,  H05K1/0326 ,  H05K1/0366 ,  H05K2201/0141 ,  H05K2201/0145 ,  H05K2201/0278 ,  H05K2201/029

Abstract: A method for producing a liquid crystalline polyester impregnated fiber sheet, comprising a step of impregnating a fiber sheet composed of an aramid fiber or a polybenzazole fiber with a liquid composition containing a liquid crystalline polyester and an aprotic solvent free of a halogen atom and a step of removing the solvent from the fiber sheet impregnated with the liquid composition. As the above mentioned solvent, N,N-dimethylformamide, N,N-dimethylacetamide and N-methylpyrrolidone are preferably used. As the above mentioned sheet, textiles are preferably used.

Abstract translation: 一种液晶聚酯浸渍纤维片的制造方法，其特征在于，包括使用含有液晶聚酯和不含卤素原子的非质子溶剂的液体组合物浸渍由芳族聚酰胺纤维或聚吲哚纤维构成的纤维片的工序， 从浸渍有液体组合物的纤维片中除去溶剂。 作为上述溶剂，优选使用N，N-二甲基甲酰胺，N，N-二甲基乙酰胺和N-甲基吡咯烷酮。 作为上述片材，优选使用纺织品。

公开(公告)号：US20110228492A1

公开(公告)日：2011-09-22

申请号：US13118225

申请日：2011-05-27

Applicant: Jesmin Haq ,  Scott Ageno ,  Douglas E. Loy ,  Shawn O'Rourke ,  Robert Naujokaitis

Inventor： Jesmin Haq ,  Scott Ageno ,  Douglas E. Loy ,  Shawn O'Rourke ,  Robert Naujokaitis

IPC: H05K1/00 ,  H05K1/18 ,  H05K3/00 ,  B32B37/02 ,  B32B37/06 ,  B32B37/12 ,  B32B37/14 ,  B32B38/10 ,  B32B38/00

CPC classification number: H05K1/0271 ,  H05K1/0277 ,  H05K1/0393 ,  H05K1/181 ,  H05K3/00 ,  H05K3/007 ,  H05K3/281 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2201/068 ,  H05K2203/0152 ,  H05K2203/016 ,  H05K2203/0191 ,  H05K2203/1383 ,  Y10T156/10 ,  Y10T428/14 ,  Y10T428/1476 ,  Y10T428/23914 ,  Y10T428/24355 ,  Y10T428/24942 ,  Y10T428/26 ,  Y10T428/2848 ,  Y10T428/31515

Abstract: Some embodiments teach a method of preparing a flexible substrate assembly. The method can include: (a) providing a carrier substrate; (b) providing a cross-linking adhesive; (c) providing a plastic substrate; and (d) coupling the carrier substrate to the plastic substrate using the cross-linking adhesive. Other embodiments are disclosed in this application.

Abstract translation: 一些实施例教导了制备柔性基底组件的方法。 该方法可以包括：（a）提供载体衬底; （b）提供交联粘合剂; （c）提供塑料基材; 和（d）使用交联粘合剂将载体衬底连接到塑料衬底上。 在本申请中公开了其它实施例。

公开(公告)号：US20110226519A1

公开(公告)日：2011-09-22

申请号：US12726345

申请日：2010-03-18

Applicant: Wei-Chun Yang ,  Pi Hsi Cheng ,  Chun Yang Li

Inventor： Wei-Chun Yang ,  Pi Hsi Cheng ,  Chun Yang Li

IPC: H05K1/11 ,  H05K3/00

CPC classification number: H05K3/34 ,  H05K2201/0145 ,  H05K2201/10287 ,  H05K2201/10356 ,  H05K2201/2072 ,  Y10T29/49149

Abstract: An electric connection structure and a method for fabricating the same are provided. The present invention provides a fixing thread fixed to a substrate and disposed on an upper surface of the substrate. The fixing thread is fixed to the substrate by shuttling between, binding, or penetrating through the upper surface and the bottom surface of the substrate. And then, a bare end of a signal line is fixed to the upper surface of the substrate by welding a solder thereby. When the solder is cooled down to solidify, the fixing thread generates a pull force applied on the solder pulling the solder toward the upper surface of the substrate.

Abstract translation: 提供电连接结构及其制造方法。 本发明提供一种固定在基板上并设置在基板的上表面上的固定线。 固定线通过穿过基板的上表面和底表面之间的穿梭，粘合或穿透而固定到基板上。 然后，通过焊接焊料将信号线的裸露端固定到基板的上表面。 当焊料冷却下来固化时，固定线产生施加在焊料上的拉动力，将焊料拉向衬底的上表面。

公开(公告)号：US20100167205A1

公开(公告)日：2010-07-01

申请号：US12437217

申请日：2009-05-07

Applicant: Jhy-Long JENG ,  Jeng-Yu TSAI ,  Shur-Fen LIU ,  Jinn-Shing KING

Inventor： Jhy-Long JENG ,  Jeng-Yu TSAI ,  Shur-Fen LIU ,  Jinn-Shing KING

IPC: G03F7/004

CPC classification number: H05K3/285 ,  C08G59/066 ,  H05K1/0393 ,  H05K2201/0145

Abstract: A thermally curable solder resist composition for a flexible printed circuit board is provided. The solder resist composition includes (a) 50-100 parts by weight of an epoxy resin, wherein the epoxy resin includes at least an aliphatic polyester modified epoxy resin having formula (I) or (II), in which, each of R1 and R2, independently, is a C6-38 saturated or an unsaturated carbon chain, R3 is ether, phenyl, a C6-38 heterocyclic or C6-38 saturated carbon chain, n is an integer of 1-10 and the aliphatic polyester modified epoxy resin had a molecular weight of 1000-5000; (b) 1-10 parts by weight of a curing agent; and (c) 1-10 parts by weight of a catalyst.

Abstract translation: 提供了一种用于柔性印刷电路板的热固化阻焊组合物。 阻焊剂组合物包含（a）50-100重量份的环氧树脂，其中环氧树脂至少包含具有式（I）或（II）的脂族聚酯改性环氧树脂，其中R1和R2各自 独立地是C6-38饱和或不饱和碳链，R3是醚，苯基，C6-38杂环或C6-38饱和碳链，n是1-10的整数，脂肪族聚酯改性环氧树脂具有 分子量1000-5000; （b）1-10重量份的固化剂; 和（c）1-10重量份的催化剂。

公开(公告)号：US20100120967A1

公开(公告)日：2010-05-13

申请号：US12524214

申请日：2008-01-18

Applicant: Eiji Kinoshita ,  Tomoyuki Kishino ,  Kazuteru Kohno ,  Tatsuya Ogawa

Inventor： Eiji Kinoshita ,  Tomoyuki Kishino ,  Kazuteru Kohno ,  Tatsuya Ogawa

IPC: C08K3/36 ,  C08L67/02 ,  C08L25/06 ,  C08L83/00 ,  C08G63/181

CPC classification number: G11B5/73 ,  C08G63/187 ,  C08G63/672 ,  C08J5/18 ,  C08J2367/02 ,  C08L25/06 ,  C08L67/02 ,  C08L83/04 ,  H05K1/0373 ,  H05K1/0393 ,  H05K2201/0145 ,  H05K2201/0209 ,  Y10T428/31504 ,  Y10T428/31507 ,  C08L2666/02

Abstract: An object of the present invention is to provide a polyester film having excellent dimensional stability to temperature and humidity.The present invention is a polyester containing a dicarboxylic acid component and a diol component, wherein (i) the dicarboxylic acid component contains not less than 5 mol % and less than 50 mol % of a recurring unit represented by the following formula (A) and more than 50 mol % and not more than 95 mol of a recurring unit represented by the following formula (B): wherein RA is an alkylene group having 2 to 10 carbon atoms, wherein RB is a phenylene group or naphthalenediyl group; and (ii) the diol component contains 90 to 100 mol % of a recurring unit represented by the following formula (C): —O—RC—O—  (C) wherein RC is an alkylene group having 2 to 10 carbon atoms, and a film comprising the same.

Abstract translation: 本发明的目的是提供一种对温度和湿度具有优异的尺寸稳定性的聚酯薄膜。 本发明是含有二羧酸成分和二醇成分的聚酯，其中（i）二羧酸成分含有下述通式（A）表示的重复单元的5摩尔％以上且50摩尔％以下，和 由下式（B）表示的重复单元大于50摩尔％且不大于95摩尔：其中RA为碳原子数2〜10的亚烷基，其中，RB为亚苯基或萘二甲基; 和（ii）二醇组分含有90至100摩尔％的由下式（C）表示的重复单元：-O-RC-O-（C）其中RC是具​​有2至10个碳原子的亚烷基，和 包含该膜的膜。

公开(公告)号：US07629056B2

公开(公告)日：2009-12-08

申请号：US10860578

申请日：2004-06-04

Applicant: Itsuo Watanabe ,  Tohru Fujinawa ,  Motohiro Arifuku ,  Houko Kanazawa ,  Atsushi Kuwano

Inventor： Itsuo Watanabe ,  Tohru Fujinawa ,  Motohiro Arifuku ,  Houko Kanazawa ,  Atsushi Kuwano

IPC: B32B27/30 ,  B32B27/28 ,  B32B27/34 ,  B32B27/36 ,  B32B27/38 ,  B32B27/42 ,  C09J5/06

CPC classification number: H01L24/83 ,  C08G18/0823 ,  C08G18/2865 ,  C08G18/3206 ,  C08G18/3821 ,  C08G18/672 ,  C08K5/14 ,  C08K5/1515 ,  C08K5/521 ,  C08L9/02 ,  C08L13/00 ,  C08L21/00 ,  C09D5/24 ,  C09D175/16 ,  C09J201/06 ,  H01B1/20 ,  H01B1/22 ,  H01L23/293 ,  H01L24/29 ,  H01L24/81 ,  H01L2224/04026 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/73204 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01052 ,  H01L2924/01067 ,  H01L2924/01073 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/04953 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/0133 ,  H05K2201/0145 ,  Y10T428/31511 ,  Y10T428/31515 ,  Y10T428/31725 ,  Y10T428/31786 ,  Y10T428/31855 ,  Y10T428/31935 ,  C08G18/8016 ,  C08L2666/16 ,  H01L2924/00

Abstract: A circuit terminal connected structure and a circuit terminal connecting method are provided. Both the structure and the method feature a circuit connecting material formulated with the following components: a curing agent capable of generating free radicals upon heating; an acrylate or methacrylate radical polymerizable substance; and either an acrylic rubber or a maleimide radical polymerizable substance having at least two maleimide groups per molecule. In some embodiments, the curing agent features a 10-hour half life temperature of 40° C. or above and a 1-minute half-life temperature of 180° C. or below. In other embodiments, the circuit connecting material includes conductive particles. In additional embodiments, the circuit connecting material includes a hydroxyl-group-containing resin having a weight average molecular weight of 10,000 or more.

Abstract translation: 提供电路端子连接结构和电路端子连接方法。 结构和方法都具有由以下组分配制的电路连接材料：加热时能够产生自由基的固化剂; 丙烯酸酯或甲基丙烯酸酯可自由基聚合物质; 以及每分子具有至少两个马来酰亚胺基团的丙烯酸橡胶或马来酰亚胺可自由基聚合物质。 在一些实施方案中，固化剂具有40℃或更高的10小时半衰期和180℃或更低的1分钟半衰期温度。 在其他实施例中，电路连接材料包括导电颗粒。 在另外的实施方案中，电路连接材料包括重均分子量为10,000以上的含羟基的树脂。

公开(公告)号：US20090176080A1

公开(公告)日：2009-07-09

申请号：US12140480

申请日：2008-06-17

Applicant: Yung-Wei Lai ,  Cheng-Wei Kuo ,  Shing-Tza Liou

Inventor： Yung-Wei Lai ,  Cheng-Wei Kuo ,  Shing-Tza Liou

IPC: B32B33/00 ,  B32B5/00 ,  C08G16/00 ,  H05K1/00

CPC classification number: H05K3/0064 ,  B32B7/12 ,  B32B27/08 ,  B32B27/36 ,  B32B37/12 ,  B32B2250/42 ,  B32B2255/10 ,  B32B2255/26 ,  B32B2307/308 ,  B32B2307/50 ,  B32B2367/00 ,  B32B2457/08 ,  C08G63/189 ,  H05K1/0393 ,  H05K2201/0145 ,  H05K2201/0195 ,  Y10T428/264 ,  Y10T428/28 ,  Y10T428/2848

Abstract: An exemplary stiffener includes at least one polyethylene naphthalate layer. The at least one polyethylene naphthalate layer is represented by the following formula:

Abstract translation: 示例性的加强件包括至少一种聚萘二甲酸乙二醇酯层。 所述至少一种聚萘二甲酸乙二醇酯层由下式表示：