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    HIGH DIELECTRIC POLYMER COMPOSITE
    51.
    发明申请
    HIGH DIELECTRIC POLYMER COMPOSITE 审中-公开
    高介电聚合物复合材料

    公开(公告)号：US20090121195A1

    公开(公告)日：2009-05-14

    申请号：US12130441

    申请日：2008-05-30

    Applicant: Eun Sung Lee ,  Sang Mock Lee ,  Young Hun Byun

    Inventor： Eun Sung Lee ,  Sang Mock Lee ,  Young Hun Byun

    IPC: H01B1/00

    CPC classification number: H01G4/33 ,  B82Y10/00 ,  H01G4/206 ,  H05K1/162 ,  H05K2201/0209 ,  H05K2201/0215 ,  H05K2201/0257 ,  H05K2201/026 ,  H05K2201/0323

    Abstract: A high dielectric polymer composite having a high dielectric constant is disclosed herein. The high dielectric polymer composite includes a conductive material doped with oxidizable metal nanoparticles or metal oxide nanoparticles to decrease dielectric loss, and a surfactant having a head portion containing an acidic functional group to form a passivation layer that surrounds the conductive material, resulting in increased dielectric constant.

    Abstract translation: 本文公开了具有高介电常数的高介电聚合物复合材料。 高介电聚合物复合材料包括掺杂有可氧化金属纳米颗粒或金属氧化物纳米颗粒以降低介电损耗的导电材料，以及具有包含酸性官能团的头部的表面活性剂，以形成围绕导电材料的钝化层，导致增加的电介质 不变。

    CONDUCTIVE CIRCUIT MANUFACTURING METHOD
    52.
    发明申请
    CONDUCTIVE CIRCUIT MANUFACTURING METHOD 审中-公开
    导电电路制造方法

    公开(公告)号：US20090029065A1

    公开(公告)日：2009-01-29

    申请号：US11994199

    申请日：2006-02-08

    Applicant: Nobuto Terada ,  Ritsuko Yoshihara ,  Yorishige Matsuba

    Inventor： Nobuto Terada ,  Ritsuko Yoshihara ,  Yorishige Matsuba

    IPC: B01J19/12 ,  B05D5/12

    CPC classification number: C23C18/1608 ,  C23C18/2006 ,  C23C18/204 ,  C23C18/206 ,  C23C18/2066 ,  C23C18/30 ,  H05K1/0284 ,  H05K3/0014 ,  H05K3/185 ,  H05K3/387 ,  H05K2201/0215 ,  H05K2201/0257 ,  H05K2203/302

    Abstract: The present invention provides a novel approach for selectively forming an electroless plated metal layer which enables selective formation of an electroless plated metal layer in an intended shape of the circuit pattern on a surface of a non-conductive substrate, without using a plating mask layer, in a form that a surface of an adhesive layer and the plated metal layer are in direct contact with each other. In the method, an adhesive layer of a curable binder resin is provided to a surface of a non-conductive substrate on which metal fine particles having an average particle size of 1 to 200 nm are closely exposed at a high area density, and an energy beam is irradiated to a region corresponding to the shape of a circuit pattern, and the non-conductive substrate is subjected to a deforming process and then to electroless plating, so that an electroless plated metal layer is selectively formed only to the energy beam irradiated region which is fixedly attached to the surface of the non-conductive substrate via the adhesive layer with a high adhesion.

    Abstract translation: 本发明提供一种选择性地形成化学镀金属层的新颖方法，其能够在不使用电镀掩模层的情况下，在非导电性基板的表面上选择性地形成电路图案的预期形状的无电镀金属层， 其形式是粘合剂层的表面和电镀金属层彼此直接接触。 在该方法中，在平均粒径为1〜200nm的金属微粒以高面积密度紧密地暴露的非导电性基材的表面上设置可固化粘合剂树脂的粘合剂层， 将光束照射到与电路图案的形状对应的区域，对非导电性基板进行变形处理，然后进行化学镀，使得无电镀金属层仅选择性地形成到能量束照射区域 其通过具有高粘合力的粘合剂层固定地附接到非导电基板的表面。

    Method and apparatus related to nanoparticle systems
    54.
    发明申请
    Method and apparatus related to nanoparticle systems 有权
    与纳米颗粒系统相关的方法和装置

    公开(公告)号：US20090016924A1

    公开(公告)日：2009-01-15

    申请号：US12155674

    申请日：2008-06-06

    Applicant: Mark Allen ,  Tomi Mattila ,  Ari Alastalo ,  Heikki Seppa

    Inventor： Mark Allen ,  Tomi Mattila ,  Ari Alastalo ,  Heikki Seppa

    IPC: B22F7/08 ,  B22F3/105

    CPC classification number: H05K3/02 ,  H05K3/105 ,  H05K3/1266 ,  H05K2201/0224 ,  H05K2201/0257 ,  H05K2203/0117 ,  H05K2203/0121 ,  H05K2203/0143 ,  H05K2203/0517 ,  H05K2203/105 ,  H05K2203/1131 ,  H05K2203/1545

    Abstract: This publication discloses a method and apparatus for functionalizing nanoparticle systems. The method comprises treating a nanoparticle-containing layer so as to produce a pattern of structurally transformed zones, the treatment comprising applying an electric field through the nanoparticle layer. According to the invention an AC-field capacitively coupled to the nanoparticle-containing layer is used as said electric field. The treatment preferably results in at least partly sintered structures, which can be used as conductors, for example. The document discloses several realizations for utilization of the disclosed functionalization in mass-fabrication lines.

    Abstract translation: 该出版物公开了一种功能化纳米粒子体系的方法和装置。 该方法包括处理含纳米颗粒的层以产生结构转化区的图案，该处理包括通过纳米颗粒层施加电场。 根据本发明，使用电容耦合到含纳米粒子层的AC场作为所述电场。 处理优选地导致例如至少部分烧结的结构，其可以用作导体。 该文献公开了在批量生产线中利用所公开的功能化的几种实现。

    Liquid thermosetting ink
    56.
    发明授权
    Liquid thermosetting ink 有权
    液体热固性油墨

    公开(公告)号：US07439285B2

    公开(公告)日：2008-10-21

    申请号：US10762515

    申请日：2004-01-23

    Applicant: Jacob Mozel ,  Izhar Halahmi ,  Ran Vilk

    Inventor： Jacob Mozel ,  Izhar Halahmi ,  Ran Vilk

    IPC: C08L63/00 ,  C09D11/02 ,  C09D11/10

    CPC classification number: C08G59/18 ,  C09D11/101 ,  H05K1/162 ,  H05K3/285 ,  H05K2201/0209 ,  H05K2201/0257 ,  H05K2203/013

    Abstract: Liquid thermosetting ink for ink-jet applications includes at least a resin, at least one solid latent curing agent having a maximal particle size of less than 2 microns and an inert filler having fine particles. The single-pack or two-pack ink has a viscosity lower than 50 Cp at the application temperature, a surface tension lower than 80 dyn/cm at the application temperature, and a glass transition temperature of cured ink of greater than 120° C.

    Abstract translation: 用于喷墨应用的液体热固性油墨包括至少一种树脂，至少一种具有最小粒径小于2微米的固体潜在性固化剂和具有细颗粒的惰性填料。 单组分或双组分油墨在使用温度下的粘度低于50CPc，在使用温度下的表面张力低于80dyn / cm，固化油墨的玻璃化转变温度大于120℃。

    Functional composites, functional inks and applications thereof
    58.
    发明申请
    Functional composites, functional inks and applications thereof 有权
    功能复合材料，功能油墨及其应用

    公开(公告)号：US20080199687A1

    公开(公告)日：2008-08-21

    申请号：US12070063

    申请日：2008-02-14

    Applicant: Shivkumar Chiruvolu ,  Vladimir K. Dioumaev ,  Nobuyuki Kambe ,  Hui Du

    Inventor： Shivkumar Chiruvolu ,  Vladimir K. Dioumaev ,  Nobuyuki Kambe ,  Hui Du

    IPC: B32B5/16 ,  C08K3/02 ,  C08K3/08

    CPC classification number: H05K1/095 ,  C09D11/101 ,  H05K2201/0257 ,  H05K2201/0266 ,  H05K2201/0329 ,  Y10T428/25 ,  Y10T428/259

    Abstract: Functional composite materials comprise elemental inorganic particles within an organic matrix. The elemental inorganic materials generally comprise elemental metal, elemental metalloid, alloys thereof, or mixtures thereof. In alternative or additional embodiments, the inorganic particles can comprise a metal oxide, a metalloid oxide, a combination thereof or a mixture thereof. The inorganic particles can have an average primary particle size of no more than abut 250 nm and a secondary particle size in a dispersion when blended with the organic matrix of no more than about 2 microns. The particles can be substantially unagglomerated within the composite. The organic binder can be a functional polymer such as a semiconducting polymer. The inorganic particles can be surface modified, such as with a moiety having an aromatic functional group for desirable interactions with a semiconducting polymer. Appropriate solution based methods can be used for forming the composite from dispersions of the particles. The composites can be processed into products, such as printed electronics devices.

    Abstract translation: 功能复合材料包括有机基质内的元素无机颗粒。 元素无机材料通常包含元素金属，元素准金属，其合金或其混合物。 在替代或另外的实施方案中，无机颗粒可以包含金属氧化物，类金属氧化物，其组合或其混合物。 当与有机基质共混不超过约2微米时，无机颗粒的平均一次粒径不超过250nm，分散体中的二次粒径。 颗粒可以在复合材料内基本上未聚集。 有机粘合剂可以是功能聚合物，例如半导体聚合物。 无机颗粒可以被表面改性，例如具有芳族官能团的部分用于与半导体聚合物的期望相互作用。 基于溶液的方法可用于从颗粒的分散体形成复合物。 复合材料可以加工成产品，如印刷电子设备。

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