Abstract:
A printed circuit board includes; a thermoplastic reinforcement material having fibers secured by a thermoplastic polymer binder and having pores formed therein; a thermoplastic resin layer having the thermoplastic reinforcement material impregnated with a thermoplastic resin; and a circuit pattern formed over the thermoplastic resin layer, wherein the thermoplastic reinforcement material and the thermoplastic resin layer have a thickness ratio (thickness of the thermoplastic reinforcement material÷thickness of the thermoplastic resin layer) of 0.9 or higher.
Abstract:
A heat-conductive dielectric polymer material includes a thermosetting epoxy resin, a nonwoven fiber component, a curing agent and a heat-conductive filler. The thermosetting epoxy resin is selected from the group consisting of end-epoxy-function group epoxy resin, side chain epoxy function group epoxy resin, multi-functional epoxy resin or the mixture thereof. The thermosetting epoxy resin comprises 4%-60% by volume of the heat-conductive dielectric polymer material. The curing agent is configured to cure the thermosetting epoxy resin at a curing temperature. The heat-conductive filler comprises 40%-70% by volume of the heat-conductive dielectric polymer material. The nonwoven fiber component comprises 1%-35% by volume of the heat-conductive dielectric polymer material. The heat-conductive dielectric polymer material has a thermal conductivity greater than 0.5 W/mK.
Abstract:
A method of manufacturing a printed wiring board includes forming a first hole penetrating a base having conductivity, closing an opening of the first hole with a film, filling an insulating material into the first hole after closing the opening, removing the film after filling the insulating material, forming a plurality of second holes penetrating the insulating material, and forming a film having conductivity on an inner surface of each of the second holes to form a plurality of wirings penetrating the insulating material.
Abstract:
The invention relates to a specific printed circuit (7) comprising independent etched blocks (4) or segments in series of four such that, on a series circuit comprising five LEDs, the four blocks serve as the positioning and connection points for the welding of the pins of the LEDs, said pins being welded in an anode-to-cathode series, or the reverse depending on the direction of the current, i.e. eight electrodes in isolated blocks, such as to ensure that the connection is powered and the LEDs are fixed correctly in series of five. According to the invention, the square or rectangular blocks have a large surface (2) such that the successive holes do not tear the film of epoxy copper. In addition, said blocks are disposed along a path and a successive diagram (21) defines the symbol or pattern to be represented by the LEDs (12) which are disposed and aligned on the other decorated face of the epoxy. The incoming or outgoing bases, which supply the positive (20) or negative (3) power, or the opposite depending on the direction of the LEDs, can comprise the outgoing or incoming base that is common to other series, by means of suitable etching. The negative is always at the center of the pattern. The circuit is divided into three connection zones, A, B, C, and is powered by external contact springs. The invention is intended for the series powering of a longilineal distribution of five LEDs in series, or a multiple thereof.
Abstract:
A printed circuit board includes; a thermoplastic reinforcement material having fibers secured by a thermoplastic polymer binder and having pores formed therein; a thermoplastic resin layer having the thermoplastic reinforcement material impregnated with a thermoplastic resin; and a circuit pattern formed over the thermoplastic resin layer, wherein the thermoplastic reinforcement material and the thermoplastic resin layer have a thickness ratio (thickness of the thermoplastic reinforcement material÷thickness of the thermoplastic resin layer) of 0.9 or higher.
Abstract:
A method for electrically connecting conductive thread (40) at any number of termination locations of a textile material (5) with an termination element preferably formed in a circuit board with the following steps being provided: placing the circuit board in a respectively formed recess of a support plate of a tool with the termination locations (122) of the circuit board (12) facing upwardly; arranging the material (5) on the circuit board (12) such that in the area of the termination locations of the circuit board (12) a termination location of the material (5) which is to be connected is being placed. Fixedly mounting, preferably by clamping the material adjacent to and on a side of the termination locations of the circuit board, preferably stretching the material (5) in longitudinal direction wherein the direction of the extension of the conductive threads. Fixedly clamping the material in an area opposite to the first clamping area and adjacent to the desired termination location. Soldering the blank conductive threads (40) to the termination locations of the circuit board (12).
Abstract:
The invention relates to a specific printed circuit (7) comprising independent etched blocks (4) or segments in series of four such that, on a series circuit comprising five LEDs, the four blocks serve as the positioning and connection points for the welding of the pins of the LEDs, said pins being welded in an anode-to-cathode series, or the reverse depending on the direction of the current, i.e. eight electrodes in isolated blocks, such as to ensure that the connection is powered and the LEDs are fixed correctly in series of five. According to the invention, the square or rectangular blocks have a large surface (2) such that the successive holes do not tear the film of epoxy copper. In addition, said blocks are disposed along a path and a successive diagram (21) defines the symbol or pattern to be represented by the LEDs (12) which are disposed and aligned on the other decorated face of the epoxy. The incoming or outgoing bases, which supply the positive (20) or negative (3) power, or the opposite depending on the direction of the LEDs, can comprise the outgoing or incoming base that is common to other series, by means of suitable etching. The negative is always at the centre of the pattern. The circuit is divided into three connection zones, A, B, C, and is powered by external contact springs. The invention is intended for the series powering of a longilineal distribution of five LEDs in series, or a multiple thereof.
Abstract:
The present invention provides a wet-spun non-woven fabric composed of inorganic fibers containing bundled inorganic fibers and a binder component for binding the fibers, wherein the average number of the fibers in each bundle is 1.5 to 20 and the average Z/X value represented by the following formula in the cross section of the non-woven fabric is 0.9 or below: (number of adjacent fibers in the thickness direction in each bundle)/(number of adjacent fibers in the plane direction in each bundle)=Z/X, and a method for producing a wet-spun non-woven fabric, which comprises the steps of dispersing inorganic fibers in an aqueous medium in the presence of an anionic dispersion stabilizer, adding a cationic compound to the obtained fiber dispersion to bundle the fibers and thereby preparing a fiber dispersion containing the resultant fiber bundles, making a sheet from the obtained fiber dispersion containing the fiber bundles by wet method and applying a binder to the obtained sheet. The non-woven fabric is a non-woven inorganic fiber fabric having a high density.
Abstract:
A heat-resistant fiber paper-like sheet comprises 40 to 97% by mass of heat-resistant organic synthetic polymers staple fibers, 3 to 60% by mass of heat resistant organic synthetic polymer fibrid and or an organic resin binder, in a portion of the staple fibers, each staple fiber having two flat end faces having an inclining angle of 10 degrees or more from a plane crossing the fiber axis at a right angles, and is useful as a base material for laminate materials for electrical circuit boards.
Abstract:
A sheet comprising thermoplastic polymer (TP) and short high tensile modulus fibers, in which the concentration of TP in the middle of the sheet is higher than at the surface of the sheet, useful for making prepregs with a thermoset resin.