公开(公告)号：US20020042994A1

公开(公告)日：2002-04-18

申请号：US09977956

申请日：2001-10-17

Applicant: Brother Kogyo Kabushiki Kaisha

Inventor： Atsushi Ito ,  Masaaki Deguchi ,  Hisaki Sakurai

IPC: H05K003/36 ,  B23Q003/00

CPC classification number: B41J2/1632 ,  B41J2/1609 ,  B41J2/1623 ,  B41J2/1626 ,  B41J2002/14217 ,  B41J2002/14225 ,  B41J2002/14362 ,  H05K3/4638 ,  H05K2201/091 ,  H05K2203/167 ,  Y10T29/49121 ,  Y10T29/49126 ,  Y10T29/49401 ,  Y10T29/49895 ,  Y10T156/1026 ,  Y10T156/1056 ,  Y10T156/1064 ,  Y10T156/108 ,  Y10T156/1304

Abstract: Plates having a predetermined pattern are provided in each frame, side by side, at certain intervals along the longitudinal direction of the frame. A plurality of positioning holes, into which pins are inserted, are formed in each frame. A retainer portion is provided so as to extend from the inner periphery of each positioning hole and is plastically deformed when a pin is inserted thereinto. By inserting a pin into each positioning hole while a plurality of frames are stacked, the outer periphery of the pin contacts the retainer portion of each positioning hole. The retainer portion is deformed to correct misalignment among a plurality of plates.

Abstract translation: 沿着框架的纵向以一定间隔并排设置在每个框架中，具有预定图案的板。 在每个框架中形成有多个插入销的定位孔。 保持部设置成从每个定位孔的内周延伸，并且当销插入其中时塑性变形。 通过在堆叠多个框架的同时将销插入每个定位孔中，销的外周与每个定位孔的保持器部分相接触。 保持器部分变形以校正多个板之间的未对准。

公开(公告)号：US20010012736A1

公开(公告)日：2001-08-09

申请号：US09818521

申请日：2001-03-28

Applicant: THE FURUKAWA ELECTRIC CO., LTD.,

Inventor： Kazuo Miyajima ,  Shin Hasegawa ,  Yoshiaki Sawaki

IPC: H05K001/00 ,  H01R012/00 ,  H01R009/22

CPC classification number: H02G3/16 ,  H02G3/081 ,  H02G5/005 ,  H05K3/202 ,  H05K3/326 ,  H05K2201/091 ,  H05K2201/10946 ,  H05K2201/2072 ,  Y10S439/949 ,  Y10T29/49117 ,  Y10T29/49121 ,  Y10T29/49128 ,  Y10T29/49151 ,  Y10T29/49153 ,  Y10T29/49833 ,  Y10T29/49845 ,  Y10T29/49908

Abstract: A bus-bar wiring board of the present invention comprises a bus-bar pattern for electric wiring formed to a predetermined shape and a bus-bar piece formed as a separate piece from the bus-bar pattern and electrically connected and secured to the bus-bar pattern. Further, a method of producing a bus-bar wiring board of the present invention comprises a bus-bar pattern punching step for punching out a bus-bar pattern for electric wiring laid out to a predetermined shape from a conductive metal sheet, a bus-bar piece punching step for punching out a bus-bar piece laid out to a predetermined shape at the remaining space of the conductive metal sheet, and a connecting step for electrically connecting and securing the bus-bar pattern punched out in the bus-bar pattern punching step and the bus-bar piece punched out in the bus-bar piece punching step. Due to this, it is possible to reduce scrap of a conductive metal sheet from which the bus-bar pattern is punched and reduce the production cost or product cost.

Abstract translation: 本发明的汇流条配线基板包括形成为预定形状的电线的汇流条图案和形成为与汇流条图案分开的部件的母线条，并且电连接并固定到总线 - 酒吧模式 此外，本发明的汇流条配线基板的制造方法具有：汇流条图形冲孔工序，从导电性金属板上冲出布置成规定形状的电线的母线图案， 在导电性金属板的剩余空间处冲压布置成规定形状的汇流条件的条形件冲压步骤，以及用于电连接和固定在母线图案中冲压的母线图案的连接步骤 冲压步骤和母线冲压在母线冲压步骤中。 由此，可以减少冲压母线图形的导电金属板的废料，降低生产成本或产品成本。

公开(公告)号：US20010002163A1

公开(公告)日：2001-05-31

申请号：US09769341

申请日：2001-01-26

Applicant: Hitachi, Ltd.

Inventor： Satoshi Imasu ,  Ikuo Yoshida ,  Tetsuya Hayashida ,  Akira Yamagiwa ,  Shinobu Takeura

IPC: H05K007/06

CPC classification number: H05K1/111 ,  H01L21/563 ,  H01L23/13 ,  H01L23/24 ,  H01L23/49811 ,  H01L23/5383 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L25/105 ,  H01L2224/05567 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/1134 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/49109 ,  H01L2224/73103 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/81191 ,  H01L2224/83101 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2225/1023 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/1579 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/351 ,  H05K1/0271 ,  H05K1/114 ,  H05K3/3436 ,  H05K3/4007 ,  H05K3/4602 ,  H05K2201/0133 ,  H05K2201/091 ,  H05K2201/09472 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/10674 ,  H05K2203/1581 ,  Y02P70/611 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/00012 ,  H01L2924/01082 ,  H01L2924/00

Abstract: An electronic device comprising a semiconductor chip which is fixed to the mounting face of a wiring board through an adhesive and in which external terminals are electrically connected with electrode pads of the wiring board through bump electrodes. Recesses are formed in the electrode pads, and in the recesses the electrode pads and the bump electrodes are connected. The electrode pads are formed over the surface of a soft layer, and the recesses are formed by elastic deformation of the electrode pads and the soft layer.

公开(公告)号：US06169328A

公开(公告)日：2001-01-02

申请号：US09246056

申请日：1999-02-08

Applicant: Craig Mitchell ,  Mike Warner ,  Jim Behlen

Inventor： Craig Mitchell ,  Mike Warner ,  Jim Behlen

IPC: H01L2348

CPC classification number: H01L21/56 ,  H01L21/563 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/4985 ,  H01L24/72 ,  H01L24/75 ,  H01L24/81 ,  H01L2224/16 ,  H01L2224/73203 ,  H01L2224/75 ,  H01L2224/81801 ,  H01L2224/83136 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/16152 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K1/118 ,  H05K3/361 ,  H05K3/4084 ,  H05K2201/0133 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2201/09081 ,  H05K2201/091 ,  H05K2203/063 ,  H01L2924/00

Abstract: A semiconductor chip package structure for providing a reliable interface between a semiconductor chip and a PWB to accommodate for the thermal coefficient of expansion mismatch therebetween. The interface between a chip and a PWB is comprised of a package substrate having a plurality of compliant pads defining channels therebetween. The package substrate is typically comprised of a flexible dielectric sheet that has leads and terminals on at least one surface thereof. The pads have a first coefficient of thermal expansion (“CTE”) and are comprised of a material having a fairly low modulus of elasticity. An encapsulant having a second CTE lower than the CTE of the compliant pads is disposed within the channels to form a uniform encapsulation layer. The pads are in rough alignment with the conductive terminals on the package substrate thereby allowing independent movement of the terminals during thermal cycling of the chip. The encapsulant encases the conductive leads electrically connecting the terminals to chip contacts on a face surface of the chip. The lower CTE of the encapsulant controls the flexing of the conductive leads so that the leads do not prematurely fatigue and become unreliable while the lower modulus compliant pads relieve the stress on the solder balls induced by the CTE mismatch of the chip and the PWB.

Abstract translation: 一种用于在半导体芯片和PWB之间提供可靠接口的半导体芯片封装结构，以适应其间的热膨胀系数不匹配。 芯片和PWB之间的接口包括具有多个在其间形成通道的柔性衬垫的封装衬底。 封装基板通常由在其至少一个表面上具有引线和端子的柔性电介质片构成。 垫具有第一热膨胀系数（“CTE”），并且由具有相当低的弹性模量的材料组成。 具有比柔性焊盘的CTE低的第二CTE的密封剂设置在通道内以形成均匀的封装层。 焊盘与封装衬底上的导电端子粗略对准，从而允许在芯片的热循环期间端子的独立移动。 密封剂封装导电引线，将引线电连接到芯片的表面上的芯片触点。 密封剂的较低CTE控制导电引线的弯曲，使得引线不会过早地疲劳并变得不可靠，而较低模量的柔性焊盘缓解由芯片和PWB的CTE不匹配引起的焊球上的应力。

公开(公告)号：US6104087A

公开(公告)日：2000-08-15

申请号：US138858

申请日：1998-08-24

Applicant: Thomas H. DiStefano ,  John W. Smith

Inventor： Thomas H. DiStefano ,  John W. Smith

IPC: H01L21/60 ,  H01L21/30 ,  H01L21/48 ,  H01L21/603 ,  H01L23/12 ,  H01L23/22 ,  H01L23/48 ,  H01L23/498 ,  H01L23/50 ,  H01L23/64 ,  H01R12/71 ,  H05K1/11 ,  H05K3/36 ,  H05K3/40 ,  H01L23/52

CPC classification number: H01L23/4985 ,  H01L21/4839 ,  H01L23/22 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/642 ,  H01L24/72 ,  H05K3/4084 ,  H01L2224/16 ,  H01L2224/45124 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01066 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/3025 ,  H01L2924/351 ,  H05K1/118 ,  H05K2201/0133 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2201/09081 ,  H05K2201/091 ,  H05K2203/063 ,  H05K3/361 ,  Y10T29/49126 ,  Y10T29/49144 ,  Y10T29/49158

Abstract: A microelectronic connection component includes a dielectric sheet having an area array of elongated, strip-like leads. Each lead has a terminal end fastened to the sheet and a tip end detachable from the sheet. Each lead extends horizontally parallel to the sheet, from its terminal end to its tip end. The tip ends are attached to a second element, such as another dielectric sheet or a semiconductor wafer. The first and second elements are then moved relative to one another to advance the tip end of each lead vertically away from the dielectric sheet and deform the leads into a bent, vertically extensive configuration. The preferred structures provide semiconductor chip assemblies with a planar area array of contacts on the chip, an array of terminals on the sheet positioned so that each terminal is substantially over the corresponding contact, and an array of metal S-shaped ribbons connected between the terminals and contacts. A compliant dielectric material may be provided between the sheet and chip, substantially surrounding the S-shaped ribbons.

Abstract translation: 微电子连接部件包括具有细长带状引线的区域阵列的电介质片。 每个引线具有紧固到片材的终端和从片材可拆卸的尖端。 每个引线从其终端到其尖端水平平行地延伸。 尖端附接到第二元件，例如另一个电介质片或半导体晶片。 然后，第一和第二元件相对于彼此移动，以使每个引线的尖端垂直远离电介质片，并将引线变形成弯曲的垂直广泛配置。 优选的结构提供半导体芯片组件，其具有在芯片上的平面区域阵列的触点，片材上的端子阵列被定位成使得每个端子基本上在相应的触点上方，以及连接在端子之间的金属S形带阵列 和联系人。 柔性电介质材料可以设置在片和芯片之间，基本上围绕S形带。

公开(公告)号：US6049043A

公开(公告)日：2000-04-11

申请号：US31027

申请日：1998-02-26

Applicant: Vinko Tonejc

Inventor： Vinko Tonejc

IPC: H05K1/02 ,  H01H50/02 ,  H01H50/04 ,  H05K3/00 ,  H05K3/20 ,  H05K3/32 ,  H05K3/40 ,  H05K1/00

CPC classification number: H05K3/202 ,  H01H50/047 ,  H05K3/328 ,  H01H2050/049 ,  H01H50/021 ,  H05K2201/091 ,  H05K2201/10651 ,  H05K2201/2072 ,  H05K3/4092

Abstract: A printed circuit board has a plastic carrier plate and a one-piece pressed screen forming interconnects of the electrical circuit that are firmly mechanically connected to one another via preferably hot-stamped or ultrasound-deformed plastic webs. The interconnects have connector tabs bent off at a right angle and contact tabs for contacting the plug-in base and the relays to be accepted and also have stamped-out contact profiles for the connection to electrical components. The plugged-on relays and components are preferably connected to the interconnects welding. A two-sided access to parting locations in the pressed screen is made for tools on the basis of recesses in the carrier plate.

Abstract translation: 印刷电路板具有通过优选热冲压或超声变形的塑料网彼此牢固机械地连接的塑料托板和一体式压制筛网形成电路的互连。 互连具有以直角弯曲的连接器接头，并且接触突片用于接触插入式基座和待接受的继电器，并且还具有用于连接到电气部件的冲压接触轮廓。 插入式继电器和部件优选地连接到互连焊接。 基于承载板中的凹槽，对按压屏幕上的分离位置进行双面访问。

公开(公告)号：US6012224A

公开(公告)日：2000-01-11

申请号：US936887

申请日：1997-09-25

Applicant: Thomas H. DiStefano ,  John W. Smith ,  Zlata Kovac ,  Konstantine Karavakis

Inventor： Thomas H. DiStefano ,  John W. Smith ,  Zlata Kovac ,  Konstantine Karavakis

IPC: H01L21/48 ,  H01L21/56 ,  H01L21/60 ,  H01L23/22 ,  H01L23/48 ,  H01L23/498 ,  H01L23/64 ,  H05K1/11 ,  H05K3/36 ,  H05K3/40 ,  H05K3/34

CPC classification number: H01L24/81 ,  H01L21/4839 ,  H01L21/563 ,  H01L23/22 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/4985 ,  H01L23/642 ,  H01L24/72 ,  H05K3/4084 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2224/83136 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/3025 ,  H05K1/118 ,  H05K2201/0133 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2201/09081 ,  H05K2201/091 ,  H05K2203/063 ,  H05K3/361 ,  Y10T29/49124 ,  Y10T29/49144 ,  Y10T29/49149

Abstract: The present invention provides an interconnection scheme having compliant contacts arranged in an array to connect conductive surfaces on a microelectronic device and a supporting substrate, such as a printed circuit board. This invention accommodates for the difference in thermal coefficients of expansion between the device and the supporting substrate. Typically, an area array of conductive contact pads are connected into rows by conductive leads on a flexible, intermediate substrate. Each of the conductive leads bridges a bonding hole in the intermediate substrate which is situated between successive contact pads. Each of the conductive leads further has a frangible portion within or near each bonding hole. A stand-off between the intermediate substrate and the device is create by compliant dielectric pads, typically composed of an elastomer material, positioned under each contact pad. The frangible portions allow the leads to be cleanly broken, bent and secured into electrical contact with mating contact pads on the device. Each of these connections may be supported by a compliant layer, typically an uncured elastomer which fills the area around the dielectric pads and is then cured.

Abstract translation: 本发明提供了一种互连方案，其具有排列成阵列中的柔性触点，以连接微电子器件上的导电表面和诸如印刷电路板的支撑衬底。 本发明适用于器件和支撑衬底之间的热膨胀系数的差异。 通常，导电接触焊盘的区域阵列通过柔性中间衬底上的导电引线连接成行。 每个导电引线桥接位于连续接触焊盘之间的中间衬底中的结合孔。 每个导电引线还在每个结合孔内或附近还具有易碎部分。 中间基板和器件之间的间隔是通过位于每个接触垫下方的通常由弹性体材料组成的柔性介电垫产生的。 易碎部分允许引线被干净地折断，弯曲并固定成与设备上的配合接触垫电接触。 这些连接中的每一个可以由柔性层（通常是填充介电垫周围区域的未固化的弹性体）支撑，然后固化。

公开(公告)号：US5915170A

公开(公告)日：1999-06-22

申请号：US931680

申请日：1997-09-16

Applicant: Kurt Raab ,  Thomas Pickett ,  Thomas H. Di Stefano

Inventor： Kurt Raab ,  Thomas Pickett ,  Thomas H. Di Stefano

IPC: H01L21/56 ,  H01L21/60 ,  H01L23/48 ,  H01L23/498 ,  H05K1/11 ,  H05K3/36 ,  H05K3/40 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC classification number: H01L24/81 ,  H01L21/56 ,  H01L21/563 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/4985 ,  H01L24/72 ,  H05K3/4084 ,  H01L2224/16 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2224/83136 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01087 ,  H01L2924/014 ,  H05K1/118 ,  H05K2201/0133 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2201/09081 ,  H05K2201/091 ,  H05K2203/063 ,  H05K3/361

Abstract: A method of making a multiple part compliant interface for a microelectronic package including the steps of providing a first microelectronic element having electrically conductive parts, providing an array of curable elastomer support pads in contact with the first microelectronic element, curing the curable elastomer support pads while the support pads remain in contact with the first microelectronic element and providing an array of adhesive pads in contact with the support pads, whereby each adhesive pad is disposed over and in substantial alignment with one of the support pads. A second microelectronic element having electrically conductive parts is then assembled in contact with the array of adhesive pads by abutting the second microelectronic element against the array of adhesive pads and compressing the adhesive pads and support pads between the first and second microelectronic elements. The array of adhesive pads are then cured and the electrically conductive parts of the first and second microelectronic elements are interconnected. The array of support pads define channels running between any two adjacent support pads. A flowable curable elastomer encapsulant may be disposed within the channels after the electrically connecting step. Preferably, the support pads, adhesive pads and the encapsulant comprise substantially similar materials, such as silicone, in order to avoid problems associated with thermal cycling, such as air entrapment and/or voiding.

Abstract translation: 制造用于微电子封装的多部件兼容接口的方法，包括以下步骤：提供具有导电部件的第一微电子元件，提供与第一微电子元件接触的可固化弹性体支撑垫阵列，固化可固化弹性体支撑垫，同时 所述支撑垫保持与所述第一微电子元件接触并提供与所述支撑垫接触的粘合剂垫阵列，由此每个粘合垫设置在所述支撑垫中的一个上并且与所述支撑垫中的一个基本对齐。 具有导电部件的第二微电子元件然后通过将第二微电子元件抵靠粘合剂焊盘阵列并将第一和第二微电子元件之间的粘合剂焊盘和支撑焊盘压紧而组装成与粘合剂焊盘阵列接触。 然后固化粘合垫阵列，并且第一和第二微电子元件的导电部分互连。 支撑垫的阵列限定在任何两个相邻支撑垫之间运行的通道。 在电连接步骤之后，可流动的可固化的弹性体密封剂可以设置在通道内。 优选地，支撑垫，粘合垫和密封剂包括基本相似的材料，例如硅树脂，以避免与热循环相关的问题，例如空气截留和/或排空。

公开(公告)号：US5913109A

公开(公告)日：1999-06-15

申请号：US690532

申请日：1996-07-31

Applicant: Thomas Distefano ,  John W. Smith ,  Anthony B. Faraci

Inventor： Thomas Distefano ,  John W. Smith ,  Anthony B. Faraci

IPC: H01L21/60 ,  H01L21/30 ,  H01L21/48 ,  H01L21/603 ,  H01L23/12 ,  H01L23/22 ,  H01L23/48 ,  H01L23/498 ,  H01L23/50 ,  H01L23/64 ,  H01R12/71 ,  H05K1/11 ,  H05K3/36 ,  H05K3/40 ,  H01L21/44

CPC classification number: H01L23/4985 ,  H01L21/4839 ,  H01L23/22 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/642 ,  H01L24/72 ,  H05K3/4084 ,  H01L2224/16 ,  H01L2224/45124 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01066 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/3025 ,  H01L2924/351 ,  H05K1/118 ,  H05K2201/0133 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2201/09081 ,  H05K2201/091 ,  H05K2203/063 ,  H05K3/361 ,  Y10T29/49126 ,  Y10T29/49144 ,  Y10T29/49158

Abstract: In a method for mounting a sheet-like multi-layer element for producing a microelectronic component, the sheet-like element is first bonded to an expansion ring. The expansion ring is then heated to stretch the sheet-like element. A frame ring, having an external diameter smaller than the internal diameter of the expansion ring, is then bonded to the sheet-like element. The assembly is then cooled, and the expansion ring is cut away. In another embodiment, a method is provided for bonding bond pads on a sheet-like microelectronic element to terminal pads on a microelectronic component. The microelectronic element is first placed on a rigid plate and the sheet-like element, which has been bonded to a frame ring, is placed over the microelectronic component. A disk is then placed on the sheet-like element, and force is applied to the disk, bringing the bond pads on the sheet-like element into contact with the terminal pads on the microelectronic element. Heat is then applied, forming the bonds.

Abstract translation: 在用于安装用于制造微电子部件的片状多层元件的方法中，首先将片状元件接合到膨胀环。 然后将膨胀环加热以拉伸片状元件。 然后将具有小于膨胀环内径的外径的框架环结合到片状元件。 然后将组件冷却，并将膨胀环切掉。 在另一个实施例中，提供了一种用于将片状微电子元件上的接合焊盘接合到微电子部件上的端子焊盘的方法。 首先将微电子元件放置在刚性板上，将已经结合到框架环的片状元件放置在微电子元件上。 然后将盘放置在片状元件上，并且将力施加到盘上，使得片状元件上的接合焊盘与微电子元件上的端子焊盘接触。 然后施加热量，形成粘结。

公开(公告)号：US5902138A

公开(公告)日：1999-05-11

申请号：US599953

申请日：1996-02-14

Applicant: Koji Murakami

Inventor： Koji Murakami

IPC: H01R9/24 ,  H01R31/08 ,  H02G3/16 ,  H05K1/00 ,  H05K1/02 ,  H05K3/00 ,  H05K3/20 ,  H05K3/30 ,  H05K3/40 ,  H01R9/09

CPC classification number: H05K3/306 ,  H01R9/2466 ,  H05K1/0263 ,  H01R12/59 ,  H01R31/08 ,  H05K1/0284 ,  H05K1/0393 ,  H05K2201/0352 ,  H05K2201/09045 ,  H05K2201/091 ,  H05K2201/09118 ,  H05K2201/10272 ,  H05K2201/10583 ,  H05K2201/10651 ,  H05K2203/167 ,  H05K3/0058 ,  H05K3/202 ,  H05K3/4084

Abstract: A branch junction box containing a flexible printed circuit sheet includes circuit terminals and other parts which are easily mounted. A first insulation plate is provided on one of its faces, with a plurality of printed circuit terminals vertically fixed therethrough. On its other face, the first insulation plate carries a flexible printed circuit sheet, the printed circuit of which is electrically connected to the circuit terminals. The surface of the insulating plate facing the circuit terminals may be provided with bus bar wiring patterns and corresponding bus bar terminals. These circuit terminals and bus bar terminals are branch-connected to wiring harnesses in a proper and reliable way through connectors formed in the casing of the box.

Abstract translation: 包含柔性印刷电路板的分支接线盒包括电路端子和容易安装的其它部件。 第一绝缘板设置在其一个面上，多个印刷电路端子垂直固定在其中。 在另一面上，第一绝缘板带有柔性印刷电路板，其印刷电路电连接到电路端子。 面向电路端子的绝缘板的表面可以设置有母线布线图案和相应的母线端子。 这些电路端子和母线端子通过形成在盒的壳体中的连接器以适当且可靠的方式分支连接到线束。