公开(公告)号：US4637135A

公开(公告)日：1987-01-20

申请号：US718769

申请日：1985-04-01

Applicant: Dimitry G. Grabbe

Inventor： Dimitry G. Grabbe

IPC: H05K3/30

CPC classification number: H05K3/303 ,  H05K2201/10189 ,  H05K2201/10568 ,  H05K2201/10598 ,  Y02P70/613 ,  Y10T29/4913

Abstract: A manner of precisely mounting a surface mounting connector to a substrate is taught. Briefly stated, after soldering of the contacts of a connector to the substrate, a radially wound steel roll pin is positioned in the mounting holes of the connector housing and is then urged downwards so as to cut through the substrate. The radial forces of the roll pin are used to retain the roll pin in position in the connector housing and in the substrate, thereby rigidly holding the connector housing to the substrate upon which it is mounted.

Abstract translation: 教导了将表面安装连接器精确地安装到基板的方式。 简要地说，在将连接器的触点焊接到基板之后，将径向卷绕的钢辊销定位在连接器壳体的安装孔中，然后被向下推动以穿过基板。 辊销的径向力用于将辊销保持在连接器壳体和基板中的适当位置，从而将连接器壳体刚性地保持在其所安装的基板上。

公开(公告)号：US4606594A

公开(公告)日：1986-08-19

申请号：US725695

申请日：1985-04-22

Applicant: Dimitry G. Grabbe ,  Iosif Korsunsky

Inventor： Dimitry G. Grabbe ,  Iosif Korsunsky

IPC: H01R12/88 ,  H01R9/09

CPC classification number: H01R12/88

Abstract: A LIF or ZIF connector having improved contact wiping is disclosed herein. Briefly stated, a connector having contacts therein is provided with the contacts moving into or out of engagement with traces disposed on a daughter board. At the time of, or immediately after engagement of the contacts of the connector with the traces on the daughter board, a wiping cam causes the daughter board to be moved with respect to the contacts thereby causing a wiping action between the traces and the contacts.

Abstract translation: 本文公开了具有改进的接触擦拭的LIF或ZIF连接器。 简而言之，其中具有触点的连接器设置有触点移动进入或脱离与设置在子板上的迹线的接合。 在连接器的触点与子板上的迹线接合之后或之后，擦拭凸轮使得子板相对于触点移动，从而导致迹线和触点之间的擦拭动作。

公开(公告)号：US4497196A

公开(公告)日：1985-02-05

申请号：US464439

申请日：1983-02-07

Applicant: Johannes C. W. Bakermans ,  Dimitry G. Grabbe

Inventor： Johannes C. W. Bakermans ,  Dimitry G. Grabbe

IPC: B21D43/04 ,  B21D28/00 ,  B21D43/06 ,  B30B13/00 ,  B21J9/18

CPC classification number: B21D28/002 ,  Y10T74/18288 ,  Y10T83/8805 ,  Y10T83/8843

Abstract: Machine for performing operations on strip material comprises a plurality of modules on a supporting bed. Each module has a strip feeder, a tooling assembly, and an actuating assembly. Strip is fed through the modules by the feeder and in each module the tooling assembly performs an operation such as stamping, forming, marking, etc. The modules feed the strip in a vertical plane and the modules are symmetrical with respect to the vertical plane of the strip. Preferably the actuating assembly and the tooling assembly is dynamically balanced. Advantages achieved include high speeds, reduced power requirements, reduced noise, and reduced tooling cost.

Abstract translation: 用于对带材进行操作的机器包括在支撑床上的多个模块。 每个模块都有一个送纸器，一个工具组件和一个致动组件。 通过进料器将条带送入模块，并且在每个模块中，模具组件执行诸如冲压，成型，标记等操作。模块将条带在垂直平面中进给，并且模块相对于垂直平面对称 带子。 优选地，致动组件和工具组件被动态平衡。 实现的优点包括高速度，降低功率需求，降低噪音和降低工具成本。

公开(公告)号：US4445271A

公开(公告)日：1984-05-01

申请号：US293023

申请日：1981-08-14

Applicant: Dimitry G. Grabbe

Inventor： Dimitry G. Grabbe

IPC: H01L23/495 ,  H01L23/498 ,  H01L23/50 ,  H01L23/48 ,  H05K5/02

CPC classification number: H01L23/49503 ,  H01L23/49811 ,  H01L23/49861 ,  H01L2924/0002 ,  Y10T29/49121

Abstract: A ceramic chip carrier having a lead frame thereon with a removable lead frame support which does not bond to the ceramic during the bonding procedure and is later removed. A perforated ground pad is bonded to the substrate simultaneously with the leads of the lead frame and is attached to the lead frame support. The support area is of reduced thickness relative to the rest of the lead frame so that it does not come in contact with the ceramic substrate during the bonding procedure. After firing and bonding of the lead frame to the substrate, the unbonded support rim is removed by pinch cutting, etching or the like.

Abstract translation: 一种陶瓷芯片载体，其上具有引线框架，其上具有可移除的引线框架支撑件，其在接合过程期间不与陶瓷结合并且稍后被去除。 穿孔接地垫与引线框架的引线同时结合到基板，并且附接到引线框架支撑件。 支撑区域相对于引线框架的其余部分具有减小的厚度，使得其在接合过程中不与陶瓷基板接触。 在将引线框架烧结并结合到基板之后，通过夹紧切割，蚀刻等除去未结合的支撑边缘。

公开(公告)号：US4417266A

公开(公告)日：1983-11-22

申请号：US293052

申请日：1981-08-14

Applicant: Dimitry G. Grabbe

Inventor： Dimitry G. Grabbe

IPC: H01L23/12 ,  H01L21/60 ,  H01L23/64 ,  H01L25/00 ,  H01L39/02 ,  H01L23/48 ,  H01L29/44

CPC classification number: H01L23/647 ,  H01L24/49 ,  H01L2224/48 ,  H01L2224/49 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/15173 ,  H01L2924/15747 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/19043 ,  Y10T428/12528

Abstract: A chip carrier having a plurality of leads thereon for external interconnection with preferably only one of the leads utilized to provide a source of power to the chip and preferably a single lead utilized as a ground connection. The power and ground leads are connected in a bus structure around the chip at the center of the chip carrier with the chip being secured to the chip carrier with the bus structure over a thermal pad formed within the bus structure. A decoupling capacitor is located in close proximity to the chip on the substrate to assure low reaction due to switching.

Abstract translation: 一种芯片载体，其上具有多个引线用于外部互连，优选地仅一个引线用于向芯片提供功率源，并且优选地用作用作接地连接的单个引线。 电源和接地引线在芯片载体周围的芯片周围的总线结构中连接，芯片通过总线结构固定在芯片载体上，形成在总线结构内的散热焊盘上。 去耦电容器位于靠近衬底上的芯片以确保由于切换而导致的低反应。

公开(公告)号：US4362902A

公开(公告)日：1982-12-07

申请号：US248604

申请日：1981-03-27

Applicant: Dimitry G. Grabbe

Inventor： Dimitry G. Grabbe

IPC: H01L23/50 ,  H01L21/60 ,  H01L23/495 ,  H01L23/498 ,  H01L23/48 ,  H05K5/02

CPC classification number: H01L23/49503 ,  H01L23/49811 ,  H01L2924/0002 ,  Y10T29/49121

Abstract: A semiconductor chip carrier having a lead frame wherein the ends of each of the inner lead portions, which are closely adjacent to the semiconductor device to which the leads are to be bonded, are manufactured with the inner leads temporarily connected to a common supporting rim which must be removed after the attachment of the lead frame to the ceramic substrate is completed. This provides accurate and constant spacing between the leads of the lead frame during the bonding of the lead frame to the ceramic substrate. The rim is removed from the lead frame after bonding of the lead frame to the ceramic substrate. This is accomplished by reducing the thickness of the rim and a portion of the leads of the lead frame contacting and closely adjacent to the rim. This provides a space between the rim and the substrate during the bonding of the lead frame to the substrate. In this way, the rim and a small portion of the leads do not bond to the substrate, thereby allowing the rim to be later removed quite easily.

Abstract translation: 一种具有引线框架的半导体芯片载体，其中每个内引线部分的端部与引线将被接合的半导体器件紧密相邻的内部引线被制造，该内引线临时连接到共同的支撑边缘上， 在将引线框架安装到陶瓷基板上之后必须将其去除。 这在引线框架与陶瓷衬底的接合期间在引线框架的引线之间提供了精确和恒定的间隔。 在将引线框架结合到陶瓷基板上之后，将边缘从引线框架移除。 这是通过减小边缘的厚度和引线框架的引线的一部分接触并紧密地与边缘相邻来实现的。 这在引线框架与基板的接合期间在边缘和基板之间提供了一个空间。 以这种方式，边缘和引线的一小部分不粘合到基底上，从而可以很容易地去除边缘。

公开(公告)号：US4354729A

公开(公告)日：1982-10-19

申请号：US219085

申请日：1980-12-22

Applicant: Dimitry G. Grabbe ,  Iosif Korsunsky

Inventor： Dimitry G. Grabbe ,  Iosif Korsunsky

IPC: H01R12/50 ,  H01R12/57 ,  H01R12/85 ,  H01R13/11 ,  H01R33/76 ,  H01R43/16 ,  H05K7/10 ,  H01R13/12

CPC classification number: H01R13/2442 ,  H01R12/57 ,  H05K7/1069 ,  H01R12/85 ,  Y10T29/49204

Abstract: Electrical contact terminal of the flat coplanar type which is manufactured by stamping sheet metal, has a yoke portion having a latch arm and a spring arm extending therefrom. The latch arm is relatively short while the spring arm is of sufficient length to permit deflection thereof when the terminal is placed in service. The two arms have free ends which are adjacent to and resiliently biased against each other. The free ends are latched to each other by latching means which permits movement of the free end of the spring arm along a side edge of the latch arm. An edge portion of the spring arm serves as a contact portion and current flows from this contact portion to the end of the spring arm then to the latch arm and to the yoke portion of the terminal to provide a short low inductance current path for the current. The spring arm is in a preloaded and flexed condition so that an elevated contact pressure is achieved.

Abstract translation: 由冲压金属板制造的平面共面型电接触端子具有一个具有一个锁臂和一个从其延伸的弹簧臂的轭部。 锁臂相对较短，而弹簧臂具有足够的长度以允许在终端被使用时使其偏转。 两个臂具有与彼此相邻且弹性偏压的自由端。 自由端通过锁定装置相互锁定，这允许弹簧臂的自由端沿着闩锁臂的侧边缘移动。 弹簧臂的边缘部分用作接触部分，电流从该接触部分流到弹簧臂的端部，然后流到锁定臂和端子的轭部，为电流提供短的低电感电流通路 。 弹簧臂处于预加载和弯曲的状态，从而达到提高的接触压力。

公开(公告)号：US4142287A

公开(公告)日：1979-03-06

申请号：US754817

申请日：1976-12-27

Applicant: Dimitry G. Grabbe

Inventor： Dimitry G. Grabbe

IPC: G04G99/00 ,  G04G17/02 ,  G04G17/06 ,  H05K1/18 ,  H05K3/20 ,  H05K3/30 ,  H05K3/32 ,  H05K3/40 ,  H05K7/02 ,  H05K7/14

CPC classification number: H05K3/326 ,  G04G17/02 ,  G04G17/06 ,  H01L2924/0002 ,  H05K1/182 ,  H05K2201/0397 ,  H05K2201/09118 ,  H05K2201/10037 ,  H05K2201/10136 ,  H05K2201/1059 ,  H05K2201/10636 ,  H05K2201/10651 ,  H05K2201/10689 ,  H05K3/202 ,  H05K3/306 ,  H05K3/4092 ,  Y02P70/611 ,  Y10T29/49121 ,  Y10T29/49579

Abstract: A method of making electrical devices, and the electrical devices made thereby, comprising the steps of: stamping from a sheet of metal a pattern of conductors configured to connect circuit components together in a relationship which forms a useful product, such as a watch, with the terminals of each of said circuit components being adjacent and connectable to appropriate terminating means formed in said pattern of conductors when said circuit components have predetermined positions adjacent said pattern of conductors; encapsulating said pattern of conductors with plastic having cavities and apertures formed therein, the cavities each having a configuration and a location to receive one of said circuit components therein in said predetermined positions and with said terminating means extending into said cavities to terminate the terminals of said circuit components; forming at least some of said component terminals on the surface of said components in positions to bend over the terminating means when the component is inserted in a cavity to thereby make an electrical connection between the component terminals and the terminating means, and to provide a retaining housing for the components in said cavity. In some instances, the component terminals are wire-like in shape and require the forming of the terminating means in a configuration which can be crimped therearound or, alternatively, require the forming of the terminating means into a plate with a slot therein and into which slot the wire-like terminal can be inserted. Some of the apertures in the plastic encapsulation are positioned to enable the severing of portions of the lead frame conductors which support the lead frame until it is encapsulated and others of the apertures are positioned to enable the severing of various combinations of selected conductors to produce different patterns of interconnections between the circuit components and thereby to produce various electrical devices each capable of performing different functions.

公开(公告)号：US5383095A

公开(公告)日：1995-01-17

申请号：US145017

申请日：1993-10-29

Applicant: Iosif Korsunsky ,  Dimitry G. Grabbe ,  Robert C. Klotz

Inventor： Iosif Korsunsky ,  Dimitry G. Grabbe ,  Robert C. Klotz

IPC: H01R12/50 ,  H01R12/72 ,  H01R31/06 ,  H05K1/11 ,  H05K3/34 ,  H05K3/40 ,  H01R23/68 ,  H01R29/00 ,  H05K3/30

CPC classification number: H01R12/721 ,  H01R23/6873 ,  H05K3/3405 ,  H05K2201/09181 ,  H05K2201/10189 ,  H05K3/403 ,  Y10T29/49135 ,  Y10T29/49139 ,  Y10T29/49153

Abstract: A circuit board (12) and electrical connector (10) mounted to an edge (18) thereof is disclosed. The circuit board (12) includes an edge (18) and two major surfaces (14, 16) extending therefrom having circuitry (20). Plated through holes (24) are arranged adjacent the edge and are interconnected to circuitry on the circuit board. Each plated through hole (24) is associated with an opening such as a slot (26) or partial slot (27) that is formed in the edge (18) of the board so that it intersects the hole. The posts (32) of the connector (10) extend into the openings (26, 27) preferably in interference fit therewith whereafter soldering completes the electrical connections of the posts to the through holes.

Abstract translation: 公开了安装到其边缘（18）的电路板（12）和电连接器（10）。 电路板（12）包括边缘（18）和从其延伸的两个主表面（14,16），具有电路（20）。 电镀通孔（24）布置成与边缘相邻并且与电路板上的电路互连。 每个电镀通孔（24）与诸如形成在板的边缘（18）中的槽（26）或部分槽（27）的开口相关联，使得其与孔相交。 连接器（10）的柱（32）延伸到开口（26,27）中，优选地与其过度配合，然后焊接完成柱与通孔的电连接。

公开(公告)号：US5252079A

公开(公告)日：1993-10-12

申请号：US833284

申请日：1992-02-10

Applicant: Dimitry G. Grabbe

Inventor： Dimitry G. Grabbe

IPC: B23P19/00 ,  H01R12/00 ,  H01R12/55 ,  H01R43/20 ,  H01R9/09

CPC classification number: H01R12/62 ,  Y10S439/936 ,  Y10T29/49139 ,  Y10T29/49208 ,  Y10T29/49222 ,  Y10T29/49798 ,  Y10T29/53183 ,  Y10T83/0326

Abstract: A method of manufacturing a guide plate for use in a chip carrier socket or other electrical connector provides the precision required for close-center line spacing while minimizing the cost associated with production. A block of ceramic or the like is ground to the precise outside dimensions required. Grooves are then cut in the block of ceramic, and the ceramic is then sliced into respective guide plates. The guide plates are inserted into openings provided in the electrical connector an retained therein. The grooves are dimensioned to cooperate with contact pins of the electrical connector to precisely maintain the pins in position, whereby when a chip is positioned in the electrical connector, the pins will be in position to make an electrical connection with the pads of the chip.

Abstract translation: 制造用于芯片载体插座或其他电连接器的引导板的方法提供了近中心线间距所需的精度，同时最小化与生产相关的成本。 陶瓷块等被研磨成所需的精确外部尺寸。 然后在陶瓷块中切割凹槽，然后将陶瓷切成相应的导向板。 引导板插入设置在保持在其中的电连接器中的开口中。 凹槽的尺寸被设计成与电连接器的接触销配合以精确地将销保持在适当的位置，由此当芯片位于电连接器中时，销将处于与芯片的焊盘进行电连接的位置。