公开(公告)号：US20090077796A1

公开(公告)日：2009-03-26

申请号：US12274162

申请日：2008-11-19

Applicant: Hajime Sakamoto ,  Dongdong Wang

Inventor： Hajime Sakamoto ,  Dongdong Wang

IPC: H05K3/30

CPC classification number: H01L23/49838 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49866 ,  H01L23/49894 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/24 ,  H01L24/27 ,  H01L24/97 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/1147 ,  H01L2224/12105 ,  H01L2224/20 ,  H01L2224/24137 ,  H01L2224/24227 ,  H01L2224/274 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/30107 ,  H01L2924/3511 ,  H05K1/185 ,  H05K3/4602 ,  H05K2201/09036 ,  H05K2201/09563 ,  H05K2201/096 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/49139 ,  Y10T29/49144 ,  Y10T29/49146 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2224/82 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/03

Abstract: A method of manufacturing a core substrate having an electronic component, including providing a core substrate having a first surface and a second surface on an opposite side of the first surface, forming a through hole extending from the first surface to the second surface in the core substrate, attaching an adhesive tape to the second surface of the core substrate such that the through hole formed in the core substrate is closed on the second surface, attaching an electronic component to the adhesive tape inside the through hole, filling the through hole with a filler, and removing the adhesive tape from the second surface of the core substrate.

Abstract translation: 一种制造具有电子部件的芯基板的方法，包括提供具有在所述第一表面的相对侧上的第一表面和第二表面的芯基板，形成从所述芯的所述第一表面延伸到所述第二表面的通孔 基板，将粘合带粘贴到芯基板的第二表面，使得形成在芯基板中的通孔在第二表面上闭合，将电子部件附接到通孔内的粘合带上，用通孔填充通孔 填充物，并且从芯基板的第二表面去除粘合带。

公开(公告)号：US20080148563A1

公开(公告)日：2008-06-26

申请号：US12034037

申请日：2008-02-20

Applicant: Hajime SAKAMOTO ,  Dongdong Wang

Inventor： Hajime SAKAMOTO ,  Dongdong Wang

IPC: H05K3/32 ,  H05K3/36

CPC classification number: H01L23/49838 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49866 ,  H01L23/49894 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/24 ,  H01L24/27 ,  H01L24/97 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/1147 ,  H01L2224/12105 ,  H01L2224/20 ,  H01L2224/24137 ,  H01L2224/24227 ,  H01L2224/274 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/30107 ,  H01L2924/3511 ,  H05K1/185 ,  H05K3/4602 ,  H05K2201/09036 ,  H05K2201/09563 ,  H05K2201/096 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/49139 ,  Y10T29/49144 ,  Y10T29/49146 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2224/82 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/03

Abstract: An intermediate layer 38 is provided on a die pad 22 of an IC chip 20 and integrated into a multilayer printed circuit board 10. Due to this, it is possible to electrically connect the IC chip 20 to the multilayer printed circuit board 10 without using lead members and a sealing resin. Also, by providing the intermediate layer 38 made of copper on an aluminum pad 24, it is possible to prevent a resin residue on the pad 24 and to improve connection characteristics between the die pad 24 and a via hole 60 and reliability.

公开(公告)号：US20050157478A1

公开(公告)日：2005-07-21

申请号：US11062672

申请日：2005-02-23

Applicant: Yasushi Inagaki ,  Motoo Asai ,  Dongdong Wang ,  Hideo Yabashi ,  Seiji Shirai

Inventor： Yasushi Inagaki ,  Motoo Asai ,  Dongdong Wang ,  Hideo Yabashi ,  Seiji Shirai

IPC: H01L21/48 ,  H01L23/498 ,  H01L23/50 ,  H01L23/64 ,  H01L25/16 ,  H05K1/02 ,  H05K1/18 ,  H05K3/46 ,  H01L23/52

CPC classification number: H05K1/115 ,  H01G2/06 ,  H01G4/12 ,  H01G4/224 ,  H01G4/228 ,  H01G4/248 ,  H01G4/40 ,  H01L21/4857 ,  H01L23/498 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/50 ,  H01L23/642 ,  H01L23/645 ,  H01L25/16 ,  H01L25/162 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05024 ,  H01L2224/05027 ,  H01L2224/05568 ,  H01L2224/05572 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16237 ,  H01L2924/01002 ,  H01L2924/01005 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01046 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/19106 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3511 ,  H05K1/0231 ,  H05K1/112 ,  H05K1/181 ,  H05K1/183 ,  H05K1/185 ,  H05K1/186 ,  H05K3/4602 ,  H05K2201/09509 ,  H05K2201/09545 ,  H05K2201/096 ,  H05K2201/10015 ,  H05K2201/10636 ,  H05K2201/10674 ,  Y02P70/611

Abstract: Chip capacitors 20 are provided in a printed circuit board 10. In this manner, the distance between an IC chip 90 and each chip capacitor 20 is shortened, and the loop inductance is reduced. In addition, the chip capacitors 20 are accommodated in a core substrate 30 having a large thickness. Therefore, the thickness of the printed circuit board does not become large.

Abstract translation: 片状电容器20设置在印刷电路板10中。以这种方式，IC芯片90和每个片状电容器20之间的距离缩短，并且环路电感减小。 此外，芯片电容器20被容纳在具有大厚​​度的芯基板30中。 因此，印刷电路板的厚度不会变大。

公开(公告)号：US20050039948A1

公开(公告)日：2005-02-24

申请号：US10921525

申请日：2004-08-19

Applicant: Motoo Asai ,  Dongdong Wang ,  Takahiro Mori

Inventor： Motoo Asai ,  Dongdong Wang ,  Takahiro Mori

IPC: H01L21/48 ,  H01L23/498 ,  H05K1/03 ,  H05K3/00 ,  H05K3/10 ,  H05K3/18 ,  H05K3/38 ,  H05K3/42 ,  H05K3/46 ,  H05K1/11

CPC classification number: H05K3/423 ,  H01L21/486 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/15312 ,  H05K1/036 ,  H05K3/0032 ,  H05K3/0035 ,  H05K3/0038 ,  H05K3/108 ,  H05K3/181 ,  H05K3/381 ,  H05K3/385 ,  H05K3/387 ,  H05K3/388 ,  H05K3/426 ,  H05K3/427 ,  H05K3/4602 ,  H05K2201/0195 ,  H05K2201/0352 ,  H05K2201/0355 ,  H05K2201/0394 ,  H05K2201/09536 ,  H05K2201/09563 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2201/09736 ,  H05K2201/09881 ,  H05K2203/0315 ,  H05K2203/0733 ,  H05K2203/0773 ,  H05K2203/1476 ,  Y10T29/49126 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2224/05599

Abstract: A metal layer 18 is sandwiched between insulating layers 14 and 20 so that required strength is maintained. Hence it follows that the thickness of a core substrate 30 can be reduced and, therefore, the thickness of a multi-layer printed circuit board can be reduced. Formation of non-penetrating openings 22 which reach the metal layer 18 in the insulating layers 14 and 20 is simply required. Therefore, small non-penetrating openings 22 can easily be formed by applying laser beams. Thus, through holes 36 each having a small diameter can be formed.

Abstract translation: 金属层18夹在绝缘层14和20之间，从而保持所需的强度。 因此，可以减小芯基板30的厚度，因此可以减小多层印刷电路板的厚度。 仅仅需要在绝缘层14和20中到达金属层18的非穿透开口22的形成。 因此，通过施加激光束可以容易地形成小的非穿透开口22。 因此，可以形成各自具有小直径的通孔36。

公开(公告)号：US06586276B2

公开(公告)日：2003-07-01

申请号：US09903025

申请日：2001-07-11

Applicant: Steven Towle ,  Hajime Sakamoto ,  Dongdong Wang

Inventor： Steven Towle ,  Hajime Sakamoto ,  Dongdong Wang

IPC: H01L2144

CPC classification number: H01L24/19 ,  H01L23/5389 ,  H01L24/96 ,  H01L24/97 ,  H01L2224/04105 ,  H01L2224/20 ,  H01L2224/24137 ,  H01L2224/92 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01041 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/18162 ,  H01L2224/96 ,  H01L2224/82 ,  H01L2924/00

Abstract: A passivation layer is formed over a semiconductor wafer carrying a plurality of independent circuits. The passivation layer includes openings to expose bond pads on the wafer. A conductive adhesion material is then deposited over the wafer and an optional protection layer is deposited over the conductive adhesion material. The wafer is then cut up into individual microelectronic dice. During a subsequent packaging process, one or more microelectronic dice are fixed within a package core to form a die/core assembly. Expanded bond pads are then formed over the die/core assembly. The adhesion material on each die enhances the adhesion between the expanded bond pads and the passivation material on the die. One or more metal layers are then built up over the die/core assembly to provide, for example, conductive communication between the terminals of the die and the external contacts/leads of the package.

Abstract translation: 在承载多个独立电路的半导体晶片上形成钝化层。 钝化层包括露出晶片上的接合焊盘的开口。 然后将导电粘合材料沉积在晶片上，并且可选的保护层沉积在导电粘合材料上。 然后将晶片切割成单独的微电子骰子。 在随后的包装过程中，一个或多个微电子管芯固定在封装芯内以形成管芯/芯组件。 然后在模具/芯组件上形成膨胀的接合垫。 每个模具上的粘合材料增强了扩展的接合焊盘和模具上的钝化材料之间的粘附。 然后将一个或多个金属层在模具/芯组件上构建，以提供例如管芯的端子与封装的外部触点/引线之间的导电连通。

公开(公告)号：US08822828B2

公开(公告)日：2014-09-02

申请号：US13089378

申请日：2011-04-19

Applicant: Motoo Asai ,  Dongdong Wang ,  Takahiro Mori

Inventor： Motoo Asai ,  Dongdong Wang ,  Takahiro Mori

IPC: H05K1/03

CPC classification number: H05K3/423 ,  H01L21/486 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/15312 ,  H05K1/036 ,  H05K3/0032 ,  H05K3/0035 ,  H05K3/0038 ,  H05K3/108 ,  H05K3/181 ,  H05K3/381 ,  H05K3/385 ,  H05K3/387 ,  H05K3/388 ,  H05K3/426 ,  H05K3/427 ,  H05K3/4602 ,  H05K2201/0195 ,  H05K2201/0352 ,  H05K2201/0355 ,  H05K2201/0394 ,  H05K2201/09536 ,  H05K2201/09563 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2201/09736 ,  H05K2201/09881 ,  H05K2203/0315 ,  H05K2203/0733 ,  H05K2203/0773 ,  H05K2203/1476 ,  Y10T29/49126 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2224/05599

Abstract: A multi-layer printed circuit board includes a core structure including resin layers and conductor circuits sandwiched by the resin layers, the core structure having first and second surfaces, a first conductor layer including conductor circuits on the first surface of the core structure, and a second conductor layer including conductor circuits on the second surface of the core structure. The core structure includes first and via holes, and the first and second via holes include a metal filling up to the respective top of openings in the resin layers, respectively, sandwich one or more conductor circuits in the core structure and are positioned vertically to form a through hole electrically connecting respective ones of the conductor circuits of the first and second conductor layers, and the first and second via holes are deviated from each other in a vertical direction.

Abstract translation: 多层印刷电路板包括：包括树脂层的芯结构和被树脂层夹持的导体电路，所述芯结构具有第一和第二表面，在芯结构的第一表面上包括导体电路的第一导体层，以及 第二导体层，包括在芯结构的第二表面上的导体电路。 芯结构包括第一和通孔，并且第一和第二通孔分别包括在树脂层中分别填充到各个开口顶部的金属，将一个或多个导体电路夹在芯结构中并垂直定位以形成 电连接第一和第二导体层的各个导体电路的通孔以及第一和第二通孔在垂直方向上彼此偏离。

公开(公告)号：US08810475B2

公开(公告)日：2014-08-19

申请号：US13407070

申请日：2012-02-28

Applicant: Tadahiko Maeda ,  Masataka Ito ,  Dongdong Wang ,  Yoshitsugu Wakazono ,  Yasuhiko Mano

Inventor： Tadahiko Maeda ,  Masataka Ito ,  Dongdong Wang ,  Yoshitsugu Wakazono ,  Yasuhiko Mano

IPC: H01Q1/36 ,  H01Q1/38

CPC classification number: H01Q1/36 ,  H01Q1/38 ,  H01Q9/28 ,  H01Q9/38 ,  H01Q11/08

Abstract: An antenna device has a substrate having a first surface and a second surface on the opposite side of the first surface, a first-surface-side conductive layer formed on the first surface of the substrate, a second-surface-side conductive layer formed on the second surface of the substrate, and through hole conductors connecting the first-surface-side conductive layer and the second-surface-side conductive layer. The first-surface-side conductive layer and the second-surface-side conductive layer are formed such that the first-surface-side conductive layer and the second-surface-side conductive layer are connected via the through hole conductors in a crank form from the first surface to second surface of the substrate.

Abstract translation: 天线装置具有基板，其具有在第一面的相反侧的第一表面和第二表面，形成在基板的第一表面上的第一表面侧导电层，形成在基板的第一表面上的第二表面侧导电层 基板的第二表面和连接第一表面侧导电层和第二表面侧导电层的通孔导体。 第一表面侧导电层和第二表面侧导电层形成为使得第一表面侧导电层和第二表面侧导电层经由通孔导体以曲柄形式从 衬底的第一表面到第二表面。

公开(公告)号：US08705909B2

公开(公告)日：2014-04-22

申请号：US13183633

申请日：2011-07-15

Applicant: Masataka Ito ,  Dongdong Wang ,  Christopher Lee Keller ,  Yoshitsugu Wakazono

Inventor： Masataka Ito ,  Dongdong Wang ,  Christopher Lee Keller ,  Yoshitsugu Wakazono

IPC: G02B6/12 ,  G02B6/43

CPC classification number: G02B6/43 ,  G02B6/4246

Abstract: An optical interconnect device including a first printed wiring board, a second printed wiring board facing the first printed wiring board, a light-emitting device positioned on the first printed wiring board and electrically connected to the first printed wiring board, a light-receiving device positioned on the second printed wiring board and electrically connected to the second printed wiring board such that the light-receiving device faces the light-emitting device and receives an optical signal transmitted in a direct line from the light-emitting device, and an electrical-connection device mounted on the first printed wiring board and the second printed wiring board such that the first printed wiring board is electrically connected to the second printed wiring board.

Abstract translation: 一种光学互连装置，包括第一印刷布线板，面对第一印刷布线板的第二印刷布线板，位于第一印刷布线板上并电连接到第一印刷布线板的发光装置，光接收装置 位于第二印刷线路板上并电连接到第二印刷线路板，使得光接收装置面向发光器件并接收从发光器件直接传输的光信号， 连接装置安装在第一印刷线路板和第二印刷线路板上，使得第一印刷线路板电连接到第二印刷线路板。

公开(公告)号：US08524535B2

公开(公告)日：2013-09-03

申请号：US12107377

申请日：2008-04-22

Applicant: Hajime Sakamoto ,  Dongdong Wang

Inventor： Hajime Sakamoto ,  Dongdong Wang

IPC: H01L21/82

CPC classification number: H01L23/49838 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49866 ,  H01L23/49894 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/24 ,  H01L24/27 ,  H01L24/97 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/1147 ,  H01L2224/12105 ,  H01L2224/20 ,  H01L2224/24137 ,  H01L2224/24227 ,  H01L2224/274 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/30107 ,  H01L2924/3511 ,  H05K1/185 ,  H05K3/4602 ,  H05K2201/09036 ,  H05K2201/09563 ,  H05K2201/096 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/49139 ,  Y10T29/49144 ,  Y10T29/49146 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2224/82 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/03

Abstract: A transition layer 38 is provided on a die pad 22 of an IC chip 20 and integrated into a multilayer printed circuit board 10. Due to this, it is possible to electrically connect the IC chip 20 to the multilayer printed circuit board 10 without using lead members and a sealing resin. Also, by providing the transition layer 38 made of copper on an aluminum pad 24, it is possible to prevent a resin residue on the pad 24 and to improve connection characteristics between the die pad 24 and a via hole 60 and reliability.

Abstract translation: 过渡层38设置在IC芯片20的芯片焊盘22上并集成到多层印刷电路板10中。由此，可以将IC芯片20电连接到多层印刷电路板10而不使用引线 构件和密封树脂。 此外，通过在铝焊盘24上设置由铜制成的过渡层38，可以防止焊盘24上的树脂残留物并改善管芯焊盘24和通孔60之间的连接特性，并且可靠性。

公开(公告)号：US08288664B2

公开(公告)日：2012-10-16

申请号：US12171794

申请日：2008-07-11

Applicant: Motoo Asai ,  Dongdong Wang ,  Takahiro Mori

Inventor： Motoo Asai ,  Dongdong Wang ,  Takahiro Mori

IPC: H05K1/11

CPC classification number: H05K3/423 ,  H01L21/486 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/15312 ,  H05K1/036 ,  H05K3/0032 ,  H05K3/0035 ,  H05K3/0038 ,  H05K3/108 ,  H05K3/181 ,  H05K3/381 ,  H05K3/385 ,  H05K3/387 ,  H05K3/388 ,  H05K3/426 ,  H05K3/427 ,  H05K3/4602 ,  H05K2201/0195 ,  H05K2201/0352 ,  H05K2201/0355 ,  H05K2201/0394 ,  H05K2201/09536 ,  H05K2201/09563 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2201/09736 ,  H05K2201/09881 ,  H05K2203/0315 ,  H05K2203/0733 ,  H05K2203/0773 ,  H05K2203/1476 ,  Y10T29/49126 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2224/05599

Abstract: A metal layer 18 is sandwiched between insulating layers 14 and 20 so that required strength is maintained. Hence it follows that the thickness of a core substrate 30 can be reduced and, therefore, the thickness of a multi-layer printed circuit board can be reduced. Formation of non-penetrating openings 22 which reach the metal layer 18 in the insulating layers 14 and 20 is simply required. Therefore, small non-penetrating openings 22 can easily be formed by applying laser beams. Thus, through holes 36 each having a small diameter can be formed.

Abstract translation: 金属层18夹在绝缘层14和20之间，从而保持所需的强度。 因此，可以减小芯基板30的厚度，因此可以减小多层印刷电路板的厚度。 仅仅需要在绝缘层14和20中到达金属层18的非穿透开口22的形成。 因此，通过施加激光束可以容易地形成小的非穿透开口22。 因此，可以形成各自具有小直径的通孔36。