公开(公告)号：US20230043084A1

公开(公告)日：2023-02-09

申请号：US17784987

申请日：2020-12-09

Applicant: NAMICS CORPORATION

Inventor： Masayoshi OTOMO

IPC: C08F22/10 ,  C08K3/08

Abstract: A resin composition suppresses unintended curing of a 2-methylene-1,3-dicarbonyl compound in the presence of conductive particles to facilitate the production of a paste including the 2-methylene-1,3-dicarbonyl compound for electronic components. The resin composition includes (a) at least one 2-methylene-1,3-dicarbonyl compound, (b) at least one type of conductive particles and (c) at least one monocarboxylic acid with a number of carbon atoms of 3 or more.

公开(公告)号：US11542417B2

公开(公告)日：2023-01-03

申请号：US17287833

申请日：2019-10-28

Applicant: NAMICS CORPORATION

Inventor： Irma Yolanda Kapoglis ,  Masayoshi Otomo

IPC: C09J9/02 ,  C09J11/04 ,  C09J175/14 ,  H01L23/00 ,  C08K3/08

Abstract: A low temperature rapid curing type low elastic conductive adhesive is provided which is useful as a conductive adhesive for component mounting in a field of FHE. The conductive resin composition contains (A) at least two types of urethane acrylate oligomers, (B) a radical polymerizable monomer, (C) a free radical generation curing agent, and (D) conductive particle. In the conductive resin composition, the component (A) preferably contains a high molecular weight urethane acrylate oligomer having a weight average molecular weight of 10,000 or more (A1), and a low molecular weight urethane acrylate oligomer having a weight average molecular weight of 9,999 or less (A2).

公开(公告)号：US11472957B2

公开(公告)日：2022-10-18

申请号：US16338727

申请日：2017-10-23

Applicant: NAMICS CORPORATION

Inventor： Kazuki Iwaya ,  Fuminori Arai

IPC: B32B27/38 ,  B32B27/26 ,  C08G59/68 ,  C08G59/66 ,  C08G59/24 ,  C09J163/02 ,  C08L63/02 ,  H01L23/29 ,  C08L63/00 ,  C08K5/00 ,  C08K5/3445 ,  C08K5/5419 ,  C09J163/00

Abstract: Provided is a resin composition, which is fast curable at low temperature, has high adhesive strength (especially, high peel strength) after curing, and can suppress a decrease in adhesive strength (especially, in peel strength) after a moisture resistance test of the resin composition after curing, and further has excellent pot life. Provided is the resin composition including: (A) an epoxy resin; (B) a thiol compound represented by C(CH2OR1)(CH2OR2)(CH2OR3)(CH2OR4) (wherein R1, R2, R3 and R4 are each independently hydrogen or CnH2nSH (wherein n is 2 to 6), at least one of R1, R2, R3 and R4 is CnH2nSH (wherein n is 2 to 6)); (b) a polyfunctional thiol compound other than the (B); and (C) a latent curing accelerator.

公开(公告)号：US20220177639A1

公开(公告)日：2022-06-09

申请号：US17609365

申请日：2020-04-24

Applicant: NAMICS CORPORATION

Inventor： Osamu SHIMOMURA ,  Kazuki IWAYA

IPC: C08G59/68 ,  B01J27/18 ,  B01J35/02 ,  C08G59/40

Abstract: A latent curing catalyst includes zirconium phosphate fine particles containing a curing accelerator. The zirconium phosphate fine particles containing the curing accelerator do not have a sharp crystalline peak at a diffraction angle (2θ) in a range of 10° to 40° in powder X-ray diffraction and have a broad halo pattern.

公开(公告)号：US20220144993A1

公开(公告)日：2022-05-12

申请号：US17429988

申请日：2020-01-22

Applicant: NAMICS CORPORATION

Inventor： Pawel CZUBAROW ,  Toshiyuki SATO ,  Masayoshi OTOMO

IPC: C08F290/06

Abstract: A photocurable resin composition includes a specific modified polyphenylene ether resin, a specific bifunctional acrylic resin, a photopolymerization initiator and a coupling agent in a specific ratio. Curing of the photocurable resin composition can be achieved satisfactorily by irradiation with a common active energy ray (for example, an ultraviolet ray) without requiring high-temperature treatment.

公开(公告)号：US11316203B2

公开(公告)日：2022-04-26

申请号：US16614809

申请日：2018-05-22

Applicant: NAMICS CORPORATION

Inventor： Takayuki Fujita

IPC: H01M10/0569 ,  H01M4/38 ,  H01M4/42 ,  H01M4/505 ,  H01M10/0567 ,  H01M10/42

Abstract: A secondary battery having high electromotive force and including less lead or being free of lead is provided. The secondary battery includes a positive electrode including a positive electrode active material containing manganese oxide, a negative electrode including a negative electrode active material containing at least one selected from zinc, gallium, and tin, and an electrolytic solution containing at least one selected from phosphoric acid and organic oxoacid and having a pH of less than 7 at 25° C. This secondary battery has an open circuit voltage of more than 1.6 V in a fully charged state.

公开(公告)号：US20210163772A1

公开(公告)日：2021-06-03

申请号：US16768842

申请日：2018-11-07

Applicant: NAMICS CORPORATION

Inventor： Kazuo MURAMATSU ,  Hideo TANABE

IPC: C09D11/52 ,  H01L31/0224 ,  H01B1/22 ,  C09D11/037 ,  C09D11/033 ,  C09D11/102

Abstract: Provided is a thermosetting conductive paste which is able to be processed at low temperature (for example, at 250° C. or less), and which enables the achievement of a conductive film that has low resistivity. The conductive paste which contains (A) a conductive component, (B) a thermosetting resin, (C) a compound having a specific structure, and (D) a solvent.

公开(公告)号：US20210155819A1

公开(公告)日：2021-05-27

申请号：US16768749

申请日：2018-11-07

Applicant: NAMICS CORPORATION

Inventor： Kenji KOBAYASHI ,  Kazuo MURAMATSU ,  Hideo TANABE

IPC: C09D11/52 ,  H01L31/0224 ,  C09D11/037 ,  C09D11/033 ,  C09D11/102

Abstract: A conductive paste, for forming an electrode of a solar cell, includes (A) a conductive component, (B) an epoxy resin, (C) an imidazole and (D) a solvent. An amount of (C) the imidazole in the conductive paste is 0.1 to 1.0% by weight based on 100% by weight of the conductive paste excluding (D) the solvent.

公开(公告)号：US20210155769A1

公开(公告)日：2021-05-27

申请号：US16770699

申请日：2018-12-04

Applicant: NAMICS CORPORATION

Inventor： Yoshitaka KAMATA

IPC: C08K3/04 ,  C08L63/00 ,  C08K5/09 ,  H01C7/10

Abstract: Provided are a resin composition for forming a varistor and a varistor capable of increasing freedom in the design of substrates, ICs, or electronics. The resin composition for forming a varistor includes (A) an epoxy resin, (B) a curing agent, (C) carbon nanotubes, and (D) a dispersant. The (C) carbon nanotubes may be single-walled carbon nanotubes, multi-walled carbon nanotubes, or a combination thereof. The (D) dispersant includes a polyalkyl oxide surfactant. The polyalkyl oxide surfactant has a polyalkyl ether skeleton in the molecule.

公开(公告)号：US20210108025A1

公开(公告)日：2021-04-15

申请号：US16970419

申请日：2019-02-20

Applicant: NAMICS CORPORATION

Inventor： Yohei UESUGI ,  Kazuki IWAYA

IPC: C08G59/68 ,  C09J163/00 ,  C08L63/00 ,  C08G59/66 ,  C08G59/22

Abstract: An epoxy resin composition includes at least one thiol-based curing agent, a main epoxy resin, and a curing catalyst. The at least one thiol-based curing agent includes a non-hydrolyzable polyfunctional thiol compound having at least one hydroxyl group and/or urea bond. The main epoxy resin is at least one main aliphatic polyfunctional epoxy resin selected from a polyethylene glycol diglycidyl ether, a cyclohexane-based diglycidyl ether, and a dicyclopentadiene-based diglycidyl ether. The epoxy resin composition has a viscosity at 25° C. of 0.05 Pa·s or higher and 3 Pa·s or lower