公开(公告)号：US20150200150A1

公开(公告)日：2015-07-16

申请号：US14507794

申请日：2014-10-06

Applicant: Gerald Ho Kim

Inventor： Gerald Ho Kim

IPC: H01L23/427 ,  H01L23/373

CPC classification number: H01L23/3738 ,  H01L23/4275 ,  H01L24/29 ,  H01L24/32 ,  H01L2224/291 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/1432 ,  H01L2924/1434 ,  H01L2924/014 ,  H01L2924/00

Abstract: Embodiments of an electronic apparatus with a thermal management technique utilizing a silicon heat sink and/or a phase-change material, as well as an assembling method thereof, are described. In one aspect, the electronic apparatus comprises a main unit, a phase-change material and an enclosure enclosing the main unit and the phase-change material. The main unit comprises a substrate and at least one integrated-circuit (IC) chip disposed on the substrate. The phase-change material is in direct contact with each IC chip of the at least one IC chip to absorb and dissipate heat generated by the at least one IC chip.

Abstract translation: 描述了利用硅散热器和/或相变材料的热管理技术的电子设备的实施例及其组装方法。 一方面，电子设备包括主单元，相变材料和封闭主单元和相变材料的外壳。 主单元包括基板和设置在基板上的至少一个集成电路（IC）芯片。 相变材料与至少一个IC芯片的每个IC芯片直接接触，以吸收和散发由至少一个IC芯片产生的热量。

公开(公告)号：US09042424B2

公开(公告)日：2015-05-26

申请号：US13844003

申请日：2013-03-15

Applicant: Gerald Ho Kim ,  Jay Eunjae Kim

Inventor： Gerald Ho Kim ,  Jay Eunjae Kim

IPC: H01S3/08 ,  F28F3/02 ,  H01S5/022 ,  H01S5/40 ,  H01S5/024

CPC classification number: F28F3/02 ,  H01S5/02236 ,  H01S5/02252 ,  H01S5/02288 ,  H01S5/02469 ,  H01S5/4031

Abstract: A silicon-based thermal energy transfer apparatus that aids dissipation of thermal energy from a heat-generating device, such as an edge-emitting laser diode, is provided. In one aspect, the apparatus comprises a silicon-based base portion having a first primary surface and a silicon-based support structure. The silicon-based support structure includes a mounting end and a distal end opposite the mounting end with the mounting end received by the base portion such that the support structure extends from the first primary surface of the base portion. The support structure includes a recess defined therein to receive the edge-emitting laser diode. The support structure further includes a slit connecting the distal end and the recess to expose at least a portion of a light-emitting edge of the edge-emitting laser diode when the edge-emitting laser diode is received in the support structure.

Abstract translation: 提供了一种有助于散发来自诸如边缘发射激光二极管等发热装置的热能的硅基热能转移装置。 在一个方面，该装置包括具有第一主表面和硅基支撑结构的硅基基部。 硅基支撑结构包括安装端和与安装端相对的远端，其中安装端由基部部分容纳，使得支撑结构从基部的第一主表面延伸。 支撑结构包括限定在其中的凹部以接收边缘发射激光二极管。 所述支撑结构还包括连接所述远端和所述凹部的狭缝，以在所述边缘发射激光二极管被接收在所述支撑结构中时露出所述边缘发射激光二极管的发光边缘的至少一部分。

公开(公告)号：US20140290926A1

公开(公告)日：2014-10-02

申请号：US14242879

申请日：2014-04-02

Applicant: Gerald Ho Kim ,  Jay Eunjae Kim

Inventor： Gerald Ho Kim ,  Jay Eunjae Kim

IPC: F28F3/02

CPC classification number: H01L23/3738 ,  F28F3/048 ,  H01L23/367 ,  H01L23/3672 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Embodiments of a silicon-based heat-dissipation device and an apparatus including a silicon-based heat-dissipation device are described. In one aspect, an apparatus includes a silicon-based heat-dissipation device which includes a base portion and a protrusion portion. The base portion has a first primary side and a second primary side opposite the first primary side. The protrusion portion is on the first primary side of the base portion and protruding therefrom. The protrusion portion includes multiple fins. Each of at least two immediately adjacent fins of the fins of the protrusion portion has a tapered profile in a cross-sectional view with a first width near a distal end of the respective fin being less than a second width at a base of the respective fin near the base portion of the heat-dissipation device.

Abstract translation: 描述了硅基散热装置和包括硅基散热装置的装置的实施例。 一方面，一种装置包括硅基散热装置，其包括基部和突出部。 基部具有与第一初级侧相对的第一初级侧和第二初级侧。 突出部分在基部的第一初级侧上并从其突出。 突出部分包括多个翅片。 突出部分的翅片的至少两个紧邻的翅片中的每一个在截面图中具有锥形轮廓，其中在相应翅片的远端附近的第一宽度在相应翅片的基部处小于第二宽度 靠近散热装置的基部。

公开(公告)号：US20140160685A1

公开(公告)日：2014-06-12

申请号：US14097154

申请日：2013-12-04

Applicant: Gerald Ho Kim ,  Jay Eunjae Kim

Inventor： Gerald Ho Kim ,  Jay Eunjae Kim

IPC: H05K7/20

CPC classification number: H05K1/0203 ,  H05K1/0204 ,  H05K1/0306 ,  H05K1/185 ,  H05K3/0061 ,  H05K7/2039

Abstract: In one aspect, an apparatus comprises a substrate, a first electrically-driven device disposed on the substrate, a second electrically-driven device disposed on the substrate, and a composite heat sink device. The composite heat sink device comprises a first thermal conduction member, a second thermal conduction member, and a thermal insulation member. The first thermal conduction member is disposed on the first electrically-driven device such that at least a portion of the heat generated by the first electrically-driven device is transferred to the first thermal conduction member by conduction. The second thermal conduction member is disposed on the second electrically-driven device such that at least a portion of the heat generated by the second electrically-driven device is transferred to the second thermal conduction member by conduction. The thermal insulation member is disposed between and thermally decouples the first thermal conduction member and the second thermal conduction member from one another.

Abstract translation: 一方面，一种装置包括基板，设置在基板上的第一电驱动装置，设置在基板上的第二电驱动装置和复合散热装置。 复合散热装置包括第一导热构件，第二导热构件和绝热构件。 第一导热构件设置在第一电驱动装置上，使得由第一电驱动装置产生的热量的至少一部分通过传导传递到第一导热构件。 第二导热构件设置在第二电驱动装置上，使得由第二电驱动装置产生的热量的至少一部分通过传导传递到第二导热构件。 绝热构件设置在第一导热构件和第二导热构件之间，并使第一导热构件和第二导热构件彼此热分离。

公开(公告)号：US20140030575A1

公开(公告)日：2014-01-30

申请号：US13951388

申请日：2013-07-25

Applicant: Gerald Ho Kim ,  Jay Eunjae Kim

Inventor： Gerald Ho Kim ,  Jay Eunjae Kim

IPC: H05K7/20

CPC classification number: H05K7/20436 ,  H01L23/373 ,  H01L23/3737 ,  H01L23/427 ,  H01L2924/0002 ,  H05K7/20309 ,  H01L2924/00

Abstract: An apparatus using a phase-change material for thermal management in portable applications is described. In one aspect, the apparatus includes a phase-change material, a thermal reservoir, and a heat transport element. The thermal reservoir has a cavity therein to contain the phase-change material in the cavity. The heat transport element is made of a thermally conductive material. A first portion of the heat transport element traverses through the thermal reservoir and in contact with the phase-change material. A second portion of the heat transport element extends outside the thermal reservoir. Accordingly, at least part of the thermal energy from an object in contact with the heat transport element can be transported to the phase-change material via the heat transport element and be absorbed by the phase-change material as latent heat. The phase-change material may release at least part of the absorbed thermal energy at a later time.

Abstract translation: 描述了在便携式应用中使用用于热管理的相变材料的装置。 一方面，该装置包括相变材料，热储存器和热传输元件。 热容器在其中具有空腔以容纳空腔中的相变材料。 传热元件由导热材料制成。 传热元件的第一部分穿过热容器并与相变材料接触。 热传输元件的第二部分延伸到热储存器的外部。 因此，来自与传热元件接触的物体的热能的至少一部分能够经由传热元件输送到相变材料，并被相变材料作为潜热吸收。 相变材料可以在稍后的时间释放吸收的热能的至少一部分。

公开(公告)号：US20130258597A1

公开(公告)日：2013-10-03

申请号：US13835105

申请日：2013-03-15

Applicant: Gerald Ho Kim ,  Jay Eunjae Kim

Inventor： Gerald Ho Kim ,  Jay Eunjae Kim

IPC: H05K7/20 ,  F28F21/06

CPC classification number: H05K7/2039 ,  F28F21/065 ,  H01L23/367 ,  H01L23/3675 ,  H01L23/3738 ,  H01L25/167 ,  H01L31/024 ,  H01L2924/0002 ,  H01S5/02248 ,  H01S5/02469 ,  H01S5/183 ,  H01L2924/00

Abstract: Various embodiments of an apparatus that simultaneously cools and thermally decouples adjacent electrically-driven devices in close proximity are provided. In one aspect, an apparatus comprises a first non-silicon heat sink and a first silicon-based heat sink disposed on the first non-silicon heat sink. The first silicon-based heat sink is configured to receive a first electrically-driven device on a first portion of the first silicon-based heat sink and to receive a second electrically-driven device on a second portion of the first silicon-based heat sink. The first silicon-based heat sink includes a first groove or a first opening between the first portion and the second portion such that a heat conduction path between the first electrically-driven device and the first non-silicon heat sink through the first silicon-based heat sink is shorter than a heat conduction path between the first electrically-driven device and the second electrically-driven device through the first silicon-based heat sink.

公开(公告)号：US08490678B2

公开(公告)日：2013-07-23

申请号：US12476246

申请日：2009-06-01

Applicant: Gerald Ho Kim

Inventor： Gerald Ho Kim

IPC: F28F7/00 ,  F28F3/14 ,  H05K7/20

CPC classification number: F28F3/12 ,  F28F3/00 ,  F28F3/048 ,  F28F2255/00 ,  H05K7/20481

Abstract: A thermal energy transfer device attached to an object to dissipate thermal energy from the object is provided. The thermal energy transfer device includes a non-metal base plate and a first non-metal fin structure. The base plate has a first primary surface and a second primary surface opposite the first primary surface, and includes at least one groove on the first primary surface. The fin structure has a first primary surface, a second primary surface opposite the first primary surface, and a plurality of edges that are between the first and the second primary surfaces including a first edge. The first fin structure is attached to the base plate with the first edge received in a first groove of the at least one groove of the base plate.

Abstract translation: 提供了附接到物体以从物体散发热能的热能传递装置。 热能传递装置包括非金属底板和第一非金属翅片结构。 基板具有与第一主表面相对的第一主表面和第二主表面，并且在第一主表面上包括至少一个凹槽。 翅片结构具有第一主表面，与第一主表面相对的第二主表面，以及包括第一边缘在第一和第二主表面之间的多个边缘。 第一翅片结构附接到基板，其中第一边缘容纳在基板的至少一个凹槽的第一凹槽中。

公开(公告)号：US20240154077A1

公开(公告)日：2024-05-09

申请号：US18387876

申请日：2023-11-08

Applicant: Gerald Ho Kim

Inventor： Gerald Ho Kim

IPC: H01L33/60 ,  H01L25/075 ,  H01L33/62

CPC classification number: H01L33/60 ,  H01L25/0753 ,  H01L33/62

Abstract: A flip-chip package includes a light source, a silicon base plate, a silicon reflector, and a cover. The light source includes a piece of Light-Emitting Diode (LED) in flip-chip configuration. The silicon base plate includes a piece of silicon with electrical pads to bond the light source, two etched, square, via-holes to provide electrical connection to the bottom of the silicon base plate, and filling port for liquid epoxy. The silicon reflector includes a chemically etched silicon piece to form an angled reflector where the light radiation from the light source reflects on the surface of the angled reflector and a recess forms on the top surface of the silicon reflector. The cover includes a piece of window material that transmits the light radiation of the light source.

公开(公告)号：US11742255B2

公开(公告)日：2023-08-29

申请号：US17128748

申请日：2020-12-21

Applicant: Gerald Ho Kim

Inventor： Gerald Ho Kim

IPC: H01L23/367 ,  H01L31/0203 ,  H01L31/024 ,  H01L23/051 ,  H01L23/043 ,  H01L31/0232 ,  H01L21/48 ,  H01L23/373 ,  H01S5/024 ,  H05K1/02 ,  H05K1/03 ,  H05K1/14 ,  H01L33/48 ,  H01L33/58 ,  H01L33/64

CPC classification number: H01L23/3672 ,  H01L21/4803 ,  H01L21/4882 ,  H01L23/043 ,  H01L23/051 ,  H01L23/3675 ,  H01L23/3738 ,  H01L31/0203 ,  H01L31/02325 ,  H01S5/02469 ,  H01L31/024 ,  H01L31/02327 ,  H01L33/483 ,  H01L33/58 ,  H01L33/641 ,  H01L33/642 ,  H01L2924/0002 ,  H01L2933/0075 ,  H05K1/0203 ,  H05K1/0274 ,  H05K1/0306 ,  H05K1/144 ,  H05K2201/041 ,  H05K2201/049 ,  H05K2201/09036 ,  H05K2201/09063 ,  H05K2201/09827 ,  H05K2201/10098 ,  H05K2201/10106 ,  H05K2201/10151 ,  H05K2201/10174 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Embodiments of a silicon heat-dissipation package for compact electronic devices are described. In one aspect, a device includes first and second silicon cover plates. The first silicon cover plate has a first primary side and a second primary side opposite the first primary side thereof. The second silicon cover plate has a first primary side and a second primary side opposite the first primary side thereof. The first primary side of the second silicon cover plate includes an indentation configured to accommodate an electronic device therein. The first primary side of the second silicon cover plate is configured to mate with the second primary side of the first silicon cover plate when the first silicon cover plate and the second silicon cover plate are joined together with the electronic device sandwiched therebetween.

公开(公告)号：US11425840B2

公开(公告)日：2022-08-23

申请号：US17092301

申请日：2020-11-08

Applicant: Gerald Ho Kim

Inventor： Gerald Ho Kim

IPC: H05K7/20 ,  H05K1/02 ,  H01L23/367 ,  H01L23/427 ,  H01L23/467 ,  H05K5/03 ,  H05K5/04 ,  H01L23/13 ,  H01L29/06 ,  F28F3/04

Abstract: A thermal management unit includes a heat sink, which includes a base portion having a first side and a second side opposite the first side. The heat sink also includes a first protrusion structure and a second protrusion structure. The first protrusion structure protrudes from the first side of the base portion, and the first protrusion structure includes a plurality of fins. The second protrusion structure protrudes from the second side of the base portion, and the second protrusion structure includes a plurality of ribs.