公开(公告)号：US08901739B2

公开(公告)日：2014-12-02

申请号：US13705367

申请日：2012-12-05

Applicant: Infineon Technologies AG

Inventor： Edward Fuergut ,  Horst Theuss ,  Walter Diez

IPC: H01L23/488 ,  H01L29/84 ,  H01L21/56 ,  H01L21/67 ,  H01L23/48

CPC classification number: H01L23/488 ,  H01L21/56 ,  H01L21/561 ,  H01L21/568 ,  H01L21/67242 ,  H01L23/48 ,  H01L24/19 ,  H01L24/96 ,  H01L24/97 ,  H01L29/84 ,  H01L2224/12105 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2224/97 ,  H01L2224/83 ,  H01L2224/82

Abstract: An embedded chip package is provided. The embedded chip package includes a plurality of chips; encapsulation material embedding the plurality of chips; at least one electrical redistribution layer electrically connected to the plurality of chips; and a common terminal connected to the at least one electrical redistribution layer, wherein the common terminal provides an interface to at least one of transmit and receive a common electrical signal between the plurality of chips and the common terminal.

Abstract translation: 提供嵌入式芯片封装。 嵌入式芯片封装包括多个芯片; 封装材料嵌入多个芯片; 电连接到所述多个芯片的至少一个电再分配层; 以及连接到所述至少一个电再分配层的公共终端，其中所述公共终端为所述多个芯片和所述公共终端之间的公共电信号的发射和接收中的至少一个提供接口。

公开(公告)号：US20140231971A1

公开(公告)日：2014-08-21

申请号：US13771222

申请日：2013-02-20

Applicant: INFINEON TECHNOLOGIES AG

Inventor： Horst Theuss ,  Beng Keh See

IPC: H01L23/552 ,  H01L21/56

CPC classification number: H01L23/552 ,  H01L21/56 ,  H01L21/561 ,  H01L21/568 ,  H01L24/97 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2224/97 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L24/85 ,  H01L2924/00 ,  H01L2224/85 ,  H01L2924/00012

Abstract: In various embodiments, a chip arrangement may be provided. The chip arrangement may include a metallic carrier. The chip arrangement may also include at least one chip arranged on the metallic carrier, wherein the at least one chip includes a chip contact, wherein the chip contact is electrically coupled to the metallic carrier. The chip arrangement may also include encapsulation material at least partially encapsulating the at least one chip. The chip arrangement may also include an electrically conductive shielding structure formed over at least a portion of the encapsulation material to electrically contact the metallic carrier.

Abstract translation: 在各种实施例中，可以提供芯片布置。 芯片布置可以包括金属载体。 芯片布置还可以包括布置在金属载体上的至少一个芯片，其中至少一个芯片包括芯片触点，其中芯片触点电耦合到金属载体。 芯片布置还可以包括至少部分地封装至少一个芯片的封装材料。 芯片布置还可以包括形成在封装材料的至少一部分上以与金属载体电接触的导电屏蔽结构。

公开(公告)号：US08809973B2

公开(公告)日：2014-08-19

申请号：US13747499

申请日：2013-01-23

Applicant: Infineon Technologies AG

Inventor： Horst Theuss

IPC: H01L29/84

CPC classification number: B81C1/00333 ,  B81B3/0018 ,  B81B3/0021 ,  B81B2201/0257 ,  B81B2207/012 ,  B81B2207/09 ,  B81C1/0023 ,  B81C1/00261 ,  B81C2203/0109 ,  B81C2203/0154 ,  H01L29/84 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2924/1461 ,  H01L2924/1815 ,  H04R1/08 ,  H01L2924/00014

Abstract: In various embodiments, a method for manufacturing a chip package is provided. The method includes arranging a chip over a substrate, the chip including a microphone structure and an opening to the microphone structure; and encapsulating the chip with encapsulation material such that the opening is kept at least partially free from the encapsulation material.

Abstract translation: 在各种实施例中，提供了一种用于制造芯片封装的方法。 该方法包括在衬底上布置芯片，芯片包括麦克风结构和麦克风结构的开口; 并且用封装材料封装芯片，使得开口保持至少部分地不包封封装材料。

公开(公告)号：US20140197503A1

公开(公告)日：2014-07-17

申请号：US14218048

申请日：2014-03-18

Applicant: Infineon Technologies AG

Inventor： Ralf Wombacher ,  Horst Theuss

IPC: H01L23/29

CPC classification number: H01L23/291 ,  B81B7/0025 ,  H01L23/055 ,  H01L23/298 ,  H01L23/564 ,  H01L24/34 ,  H01L24/45 ,  H01L24/48 ,  H01L24/83 ,  H01L24/85 ,  H01L24/97 ,  H01L2224/0401 ,  H01L2224/05624 ,  H01L2224/05669 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45014 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/484 ,  H01L2224/48624 ,  H01L2224/48669 ,  H01L2224/48724 ,  H01L2224/48769 ,  H01L2224/48824 ,  H01L2224/48869 ,  H01L2224/73265 ,  H01L2224/8192 ,  H01L2224/81951 ,  H01L2224/83 ,  H01L2224/83801 ,  H01L2224/8385 ,  H01L2224/8592 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01007 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/1461 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19043 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2224/37099

Abstract: A sensor package is disclosed. One embodiment provides a sensor device having a carrier, a semiconductor sensor mounted on the carrier and an active surface. Contact elements are electrically connecting the carrier with the semiconductor sensor. A protective layer made of an inorganic material covers at least the active surface and the contact elements.

Abstract translation: 公开了一种传感器封装。 一个实施例提供了一种具有载体，安装在载体上的半导体传感器和有源表面的传感器装置。 接触元件将载体与半导体传感器电连接。 由无机材料制成的保护层至少覆盖活性表面和接触元件。

公开(公告)号：US08669143B2

公开(公告)日：2014-03-11

申请号：US13708885

申请日：2012-12-07

Applicant: Infineon Technologies AG

Inventor： Horst Theuss

IPC: H01L21/00

CPC classification number: H01L21/565 ,  B81C1/0023 ,  B81C1/00238 ,  G01P1/023 ,  H01L21/568 ,  H01L23/3121 ,  H01L24/96 ,  H01L24/97 ,  H01L2224/04105 ,  H01L2224/48227 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13062 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3025 ,  H01L2924/00

Abstract: Methods for manufacturing packaged devices are disclosed. In one embodiment a method includes encapsulating a first semiconductor chip with a first encapsulant, wherein the first encapsulant includes a cavity on a first main surface, mounting an electrical component on a carrier, the electrical component being a MEMS device, and placing the carrier on the first main surface of the first encapsulant such that the electrical component is enclosed by the cavity.

Abstract translation: 公开了制造封装器件的方法。 在一个实施例中，一种方法包括用第一密封剂封装第一半导体芯片，其中第一密封剂包括在第一主表面上的空腔，将电气部件安装在载体上，电气部件是MEMS装置，并将载体放置在 第一密封剂的第一主表面，使得电气部件被空腔包围。

公开(公告)号：US20130122660A1

公开(公告)日：2013-05-16

申请号：US13733375

申请日：2013-01-03

Applicant: Infineon Technologies AG

Inventor： Klaus Elian ,  Georg Meyer-Berg ,  Horst Theuss

IPC: H01L21/56

CPC classification number: H01L21/563 ,  G01L9/0054 ,  G01L19/0627 ,  G01L19/141 ,  G01L19/147 ,  G01L19/148 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2924/1461 ,  H01L2924/16151 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A sensor device and method. One embodiment provides a first semiconductor chip having a sensing region. A porous structure element is attached to the first semiconductor chip. A first region of the porous structure element faces the sensing region of the first semiconductor chip. An encapsulation material partially encapsulates the first semiconductor chip and the porous structure element.

Abstract translation: 传感器装置及方法。 一个实施例提供了具有感测区域的第一半导体芯片。 多孔结构元件附接到第一半导体芯片。 多孔结构元件的第一区域面向第一半导体芯片的感测区域。 封装材料部分地封装第一半导体芯片和多孔结构元件。

公开(公告)号：US12086363B2

公开(公告)日：2024-09-10

申请号：US18456754

申请日：2023-08-28

Applicant: Infineon Technologies AG

Inventor： Klaus Elian ,  Christoph Steiner ,  Horst Theuss

IPC: G06F3/043 ,  B06B1/02

CPC classification number: G06F3/0436 ,  B06B1/0292 ,  G06F2203/04103

Abstract: A sensor device contains at least one sensor chip having at least one MEMS structure arranged at a main surface of the at least one sensor chip, wherein the at least one sensor chip is configured to transmit ultrasonic signals and/or to receive ultrasonic signals. The sensor device further contains an acoustic coupling medium arranged selectively on the at least one MEMS structure, wherein the acoustic coupling medium is configured to decouple an ultrasonic signal to be emitted from the at least one MEMS structure and/or to inject a received ultrasonic signal into the at least one MEMS structure. The acoustic coupling medium only partially covers the main surface of the at least one sensor chip.

公开(公告)号：US11899047B1

公开(公告)日：2024-02-13

申请号：US18047479

申请日：2022-10-18

Applicant: Infineon Technologies AG

Inventor： Horst Theuss ,  Rainer Markus Schaller

IPC: G01R15/20 ,  G01R19/10

CPC classification number: G01R15/202 ,  G01R19/10

Abstract: A current sensor system includes a magnetic field sensor including a chip plane, a first set of sensor elements sensitive to a first magnetic field component that is aligned in a first direction that is parallel to the chip plane, and a second set of sensor elements sensitive to a second magnetic field component that is aligned in a second direction that is perpendicular to the chip plane; and three conductor structures arranged in parallel to each other and configured to carry a current parallel or antiparallel to a third direction that is perpendicular to the first direction and to the second direction. The three conductor structures generate three magnetic fields based on the current flowing therethrough, where the three magnetic fields produce a first magnetic field distribution of the first magnetic field component and a second magnetic field distribution of the second magnetic field component.

公开(公告)号：US11795053B2

公开(公告)日：2023-10-24

申请号：US17217488

申请日：2021-03-30

Applicant: Infineon Technologies AG

Inventor： Rainer Markus Schaller ,  Klaus Elian ,  Horst Theuss

IPC: B81B7/00 ,  B81C1/00

CPC classification number: B81B7/0051 ,  B81C1/00325 ,  B81B2203/033 ,  B81B2207/07 ,  B81B2207/096 ,  B81C2203/0118

Abstract: A sensor device includes a sensor chip with a micro-electromechanical systems (MEMS) structure, wherein the MEMS structure is arranged at a main surface of the sensor chip, and a gas-permeable cover arranged over the main surface of the sensor chip, which covers the MEMS structure and forms a cavity above the MEMS structure.

公开(公告)号：US11686667B2

公开(公告)日：2023-06-27

申请号：US17407803

申请日：2021-08-20

Applicant: Infineon Technologies AG

Inventor： Horst Theuss ,  Rainer Markus Schaller

IPC: G01N21/17 ,  G01N29/24 ,  B81B7/02

CPC classification number: G01N21/1702 ,  B81B7/02 ,  G01N29/2425 ,  B81B2201/0264 ,  B81B2201/04 ,  B81B2203/0315 ,  G01N2021/1704

Abstract: A photoacoustic sensor includes a first layer with an optical MEMS emitter; a second layer stacked over the first layer with a MEMS pressure pick-up and an optically transparent window, wherein the MEMS pressure pick-up and the optically transparent window are offset laterally with respect to one another; and a third layer stacked over the second layer with a cavity for a reference gas. The optical MEMS emitter transmits optical radiation along an optical path, wherein the optical path runs through the optically transparent window and the cavity for the reference gas, and wherein the MEMS pressure pick-up is outside the course of the optical path.