公开(公告)号：US10734351B2

公开(公告)日：2020-08-04

申请号：US16107264

申请日：2018-08-21

Applicant: Infineon Technologies AG

Inventor： Petteri Palm ,  Thorsten Scharf ,  Ralf Wombacher

IPC: H01L23/00 ,  H01L23/538 ,  H01L21/78 ,  H01L23/055 ,  H01L23/48 ,  H01L21/48 ,  H01L21/56 ,  H01L23/498

Abstract: Electronic module, which comprises a first substrate, a first dielectric layer on the first substrate, at least one electronic chip, which is mounted with a first main surface directly or indirectly on partial region of the first dielectric layer, a second substrate over a second main surface of the at least one electronic chip, and an electrical contacting for the electric contact of the at least one electronic chip through the first dielectric layer, wherein the first adhesion layer on the first substrate extends over an area, which exceeds the first main surface.

公开(公告)号：US20190259688A1

公开(公告)日：2019-08-22

申请号：US16280181

申请日：2019-02-20

Applicant: Infineon Technologies AG

Inventor： Thorsten Scharf ,  Thorsten Meyer

IPC: H01L23/495 ,  H01L23/31 ,  H01L23/00 ,  H01L21/56 ,  H01L21/48

Abstract: A package comprising a carrier, at least one electronic chip mounted on one side of the carrier, an encapsulant at least partially encapsulating the at least one electronic chip and partially encapsulating the carrier, and at least one component attached to an opposing other side of the carrier via at least one contact opening.

公开(公告)号：US10366924B2

公开(公告)日：2019-07-30

申请号：US15590520

申请日：2017-05-09

Applicant: Infineon Technologies AG

Inventor： Thorsten Scharf ,  Steffen Jordan

IPC: H01L21/78 ,  H01L23/00 ,  H01L23/373 ,  H01L23/492 ,  H01L23/498 ,  H01L23/538 ,  H01L25/065 ,  H01L23/34

Abstract: A chip carrier includes a redistribution structure, wherein the redistribution structure includes: a dielectric layer extending in a horizontal direction; a first electrically conductive layer arranged over the dielectric layer and extending in the horizontal direction; a trench arranged in the dielectric layer and extending in the horizontal direction; and a filling material filling the trench, wherein the filling material is different from the material of the dielectric layer.

公开(公告)号：US20170345714A1

公开(公告)日：2017-11-30

申请号：US15590520

申请日：2017-05-09

Applicant: Infineon Technologies AG

Inventor： Thorsten Scharf ,  Steffen Jordan

IPC: H01L21/78 ,  H01L23/492 ,  H01L23/373 ,  H01L23/498 ,  H01L25/065 ,  H01L23/00

CPC classification number: H01L21/78 ,  H01L23/34 ,  H01L23/373 ,  H01L23/492 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49844 ,  H01L23/5384 ,  H01L23/5386 ,  H01L23/5389 ,  H01L24/03 ,  H01L24/06 ,  H01L24/13 ,  H01L24/19 ,  H01L24/20 ,  H01L24/36 ,  H01L24/48 ,  H01L25/0655 ,  H01L2224/04105 ,  H01L2224/06181 ,  H01L2224/1134 ,  H01L2224/12105 ,  H01L2224/13101 ,  H01L2224/13147 ,  H01L2224/16227 ,  H01L2224/24137 ,  H01L2224/24246 ,  H01L2224/2518 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73267 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2224/45099 ,  H01L2924/00012 ,  H01L2924/014

Abstract: A chip carrier includes a redistribution structure, wherein the redistribution structure includes: a dielectric layer extending in a horizontal direction; a first electrically conductive layer arranged over the dielectric layer and extending in the horizontal direction; a trench arranged in the dielectric layer and extending in the horizontal direction; and a filling material filling the trench, wherein the filling material is different from the material of the dielectric layer.

公开(公告)号：US20170294403A1

公开(公告)日：2017-10-12

申请号：US15632680

申请日：2017-06-26

Applicant: Infineon Technologies AG

Inventor： Petteri Palm ,  Thorsten Scharf ,  Ralf Wombacher

IPC: H01L23/00 ,  H01L21/78 ,  H01L23/538 ,  H01L21/48

CPC classification number: H01L24/82 ,  H01L21/4853 ,  H01L21/486 ,  H01L21/561 ,  H01L21/568 ,  H01L21/78 ,  H01L23/055 ,  H01L23/481 ,  H01L23/49816 ,  H01L23/5384 ,  H01L23/5385 ,  H01L23/5386 ,  H01L23/5389 ,  H01L24/25 ,  H01L24/83 ,  H01L24/97 ,  H01L2224/04105 ,  H01L2224/24137 ,  H01L2224/2518 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/82039 ,  H01L2224/8285 ,  H01L2224/83005 ,  H01L2224/83132 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/92144 ,  H01L2224/97 ,  H01L2924/12042 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/00 ,  H01L2224/82 ,  H01L2224/83

Abstract: Electronic module (100), which comprises a first substrate (102), a first dielectric layer (104) on the first substrate (102), at least one electronic chip (106), which is mounted with a first main surface (108) directly or indirectly on partial region of the first dielectric layer (104), a second substrate (110) over a second main surface (114) of the at least one electronic chip (106), and an electrical contacting (116) for the electric contact of the at least one electronic chip (106) through the first dielectric layer (104), wherein the first adhesion layer (104) on the first substrate (102) extends over an area, which exceeds the first main surface (108).