-
公开(公告)号：US12035029B2
公开(公告)日：2024-07-09
申请号：US17833025
申请日：2022-06-06
Applicant: NINGBO SUNNY OPOTECH CO., LTD.
Inventor： Mingzhu Wang , Bojie Zhao , Zhenyu Chen , Nan Guo , Takehiko Tanaka
IPC: H04N5/335 , G02B7/00 , G02B7/02 , G03B13/36 , H01L27/146 , H04N23/45 , H04N23/54 , H04N23/55 , H04N23/57 , H04N23/90 , H05K1/18 , G02B5/20 , G02B7/08 , G02B7/09 , H02K41/035 , H02N2/02 , H05K1/02 , H05K3/28
CPC classification number: H04N23/55 , G02B7/006 , G02B7/02 , G03B13/36 , H01L27/14618 , H01L27/14625 , H01L27/14627 , H01L27/14645 , H04N23/45 , H04N23/54 , H04N23/57 , H04N23/90 , H05K1/182 , G02B5/208 , G02B7/021 , G02B7/08 , G02B7/09 , H01L27/14636 , H01L2224/48091 , H02K41/0354 , H02N2/026 , H05K1/0274 , H05K1/181 , H05K3/284 , H05K2201/10083 , H05K2201/10121 , H05K2201/10151 , H05K2201/10522 , H05K2201/2018 , H05K2203/1316 , H01L2224/48091 , H01L2924/00014
Abstract: A camera module and an array camera module based on an integral packing process are disclosed. The camera module or each of the camera module units of the array camera module includes a circuit board, an integral base, a photosensitive element operatively connected to the circuit board, a lens, a light filter holder installed at the integral base and a light filter installed at the light filter holder. The light filter is not required to be directly installed to the integral base, so that the light filter is protected and the requiring area of the light filter is reduced.
-
公开(公告)号：US12007583B2
公开(公告)日：2024-06-11
申请号：US18074882
申请日：2022-12-05
Applicant: NINGBO SUNNY OPOTECH CO., LTD.
Inventor： Mingzhu Wang , Bojie Zhao , Chunmei Liu , Feifan Chen , Zhenyu Chen
CPC classification number: G02B3/00 , G02B13/004 , H04N23/54 , H04N23/55 , G02B2003/0093
Abstract: A lens (10) and a camera module (100) and a manufacturing method thereof, wherein the lens (10) comprises an edge-cut lens sheet (114), wherein the edge-cut lens sheet (14) includes at least one chord edge (1141) and at least one circular edge (1142), wherein the chord edge (1141) and the circular edge (1142) are adjacently connected to each other, and wherein the chord edge (1141) and the circular edge (1142) have different curvatures, so that the lens sheet (114) becomes narrow and the width of the lens (10) become narrow, to form an ultra-narrow camera module (100).
-
公开(公告)号：US11877044B2
公开(公告)日：2024-01-16
申请号：US15999858
申请日：2016-07-28
Applicant: NINGBO SUNNY OPOTECH CO., LTD.
Inventor： Mingzhu Wang , Bojie Zhao , Takehiko Tanaka , Nan Guo , Zhenyu Chen , Zhen Huang , Feifan Chen , Liang Ding
CPC classification number: H04N23/57 , H04N23/55 , G06F1/1686 , H04N23/67
Abstract: A camera module, an integral base component of same, and a manufacturing method therefor are provided. The camera module includes at least one lens, at least one photosensitive chip, at least one filter, and at least one integral base component. The integral base component includes a base part and a circuit board part. The base part is integrally packaged in the circuit board part. The photosensitive chip is mounted on the circuit board part. The base part forms at least one through hole so as to provide the photosensitive chip with a light path. The lens is arranged on the light path of the photosensitive chip.
-
公开(公告)号：US11867965B2
公开(公告)日：2024-01-09
申请号：US17145248
申请日：2021-01-08
Applicant: NINGBO SUNNY OPOTECH CO., LTD.
Inventor： Mingzhu Wang , Bojie Zhao , Liang Ding , Chunmei Liu , Feifan Chen , Nan Guo , Heng Jiang
CPC classification number: G02B7/003 , B29C65/7802 , G02B7/006 , G02B7/021 , G02B7/025 , G02B7/09 , H01L27/14618 , H04N23/54 , H04N23/55 , H04N23/57
Abstract: An adjustable optical lens and camera module and manufacturing method thereof are provided, wherein the camera module includes an optical sensor and an adjustable optical lens. The adjustable optical lens, which is arranged in a photosensitive path of the optical sensor, includes an optical structural member and at least two lenses. Each of the lens is arranged in an internal space of the optical structural member along an axial direction of the optical structural member, wherein before packaging the adjustable optical lens and the optical sensor, at least one position of the lens in the internal space of the optical structural member is able to be adjusted, so that a central axis line of the adjustable optical lens and a central axis line of the optical sensor are coincided, so as to improve the image quality of the camera module.
-
公开(公告)号：US11743569B2
公开(公告)日：2023-08-29
申请号：US17685587
申请日：2022-03-03
Applicant: NINGBO SUNNY OPOTECH CO., LTD.
Inventor： Mingzhu Wang , Bojie Zhao , Takehiko Tanaka , Feifan Chen , Qimin Mei , Liang Ding , Heng Jiang
IPC: H04N23/57 , H01L27/146 , H04N13/239 , H04N23/45 , H04N23/51 , H04N23/54 , H04N23/55
CPC classification number: H04N23/57 , H01L27/1469 , H01L27/14618 , H01L27/14634 , H01L27/14636 , H04N13/239 , H04N23/45 , H04N23/51 , H04N23/54 , H04N23/55 , H01L2224/48091 , H04N2213/001 , H01L2224/48091 , H01L2924/00014
Abstract: A camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof is provided. The array camera module comprises two or more camera lenses and a circuit unit. The circuit unit comprises a circuit board portion for electrically connecting two or more photosensitive sensors of the array camera module, and a conjoined encapsulation portion integrally encapsulated on the circuit board portion. The camera lenses are respectively arranged along the photosensitive paths of the photosensitive sensors.
-
Patent Agency Ranking
公开(公告)号：US11729483B2
公开(公告)日：2023-08-15
申请号：US17829721
申请日：2022-06-01
Applicant: Ningbo Sunny Opotech Co., Ltd.
Inventor： Mingzhu Wang , Zhenyu Chen , Zhongyu Luan , Zhen Huang , Nan Guo , Fengsheng Xi , Takehiko Tanaka , Bojie Zhao , Heng Jiang , Ye Wu , Zilong Deng
CPC classification number: H04N23/54 , H04N23/55 , H05K1/0274 , H05K2201/10121
Abstract: A photosensitive component, and a camera module and a manufacturing method therefor. The photosensitive component comprises at least a photosensitive element, at least a window-form circuit board and at least a packaging body, wherein the photosensitive element and the window-form circuit board are integrally packaged through the packaging body. The window-form circuit board comprises a circuit board main body which comprises at least one window arranged thereon, wherein the photosensitive element is arranged within the window.
-
67.发明授权公开(公告)号：US11706514B2
公开(公告)日：2023-07-18
申请号：US17983592
申请日：2022-11-09
Applicant: Ningbo Sunny Opotech Co., Ltd.
Inventor： Zhen Huang , Qimin Mei , Bojie Zhao , Zhewen Mei , Li Liu , Jiawei Chen , Chenxiang Xu
CPC classification number: H04N23/55 , B29C43/18 , H04N23/54 , H04N23/57 , B29L2011/00 , B29L2031/34
Abstract: A camera module and a molded photosensitive assembly and manufacturing methods thereof, and an electronic device are disclosed. The molded photosensitive assembly includes an imaging assembly, a molded base and a filter assembly. The imaging assembly includes a circuit board and at least one photosensitive element, and each photosensitive element is conductively connected to the circuit board. The molded base has at least one stepped peripheral groove to define a light window through each stepped peripheral groove, the molded base embeds a part of the imaging assembly, and a photosensitive region of each photosensitive element respectively corresponds to each light window of the molded base. The filter assembly includes at least one filter element, and each filter element is correspondingly arranged in each stepped peripheral groove of the molded base, so that each filter element respectively corresponds to each light window of the molded base.
-
公开(公告)号：US11659263B2
公开(公告)日：2023-05-23
申请号：US16497433
申请日：2018-03-22
Applicant: NINGBO SUNNY OPOTECH CO., LTD.
Inventor： Mingzhu Wang , Shoujie Wang , Nan Guo , Liang Ding , Bojie Zhao , Feifan Chen , Chunmei Liu , Qimin Mei
CPC classification number: H04N5/2254 , G03B13/36 , H04N5/2257
Abstract: A split lens includes a first lens group including a first set of lenses, a second lens group including a second set of lenses, and at least one light shielding element. The light shielding element is disposed between the lens at the bottom position of the first lens group and the lens at the top position of the second lens group, such that a predetermined light path is formed between the first lens group and the second lens group, thereby conforming to the structure of the split lens.
-
公开(公告)号：US11653079B2
公开(公告)日：2023-05-16
申请号：US16472405
申请日：2017-12-25
Applicant: NINGBO SUNNY OPOTECH CO., LTD.
Inventor： Mingzhu Wang , Nan Guo , Zhenyu Chen , Bojie Zhao , Takehiko Tanaka , Feifan Chen , Ye Wu
CPC classification number: H04N5/2257 , G01N15/0656 , G03B17/02 , H04M1/0264 , H04N5/2253 , H04N5/2254
Abstract: The present disclosure provides a camera module, a circuit board assembly and a manufacturing method thereof, and an electronic device with the camera module, wherein the circuit board assembly comprises at least one electronic component, a substrate, and a molding unit. At least one of the electronic components is connected to the substrate conductively on a back face of the substrate. The molding unit comprises a back molding portion and a molding base, wherein the molding base is bonded to a front face of the substrate integrally when the back molding portion is bonded to at least a part of an area of the back face of the substrate integrally. There may be no need to reserve a position on the front face of the substrate to conductively connect the electronic components, so that the length and width of the camera module can be reduced, thereby reducing the volume of the camera module.
-
公开(公告)号：US11575816B2
公开(公告)日：2023-02-07
申请号：US17824415
申请日：2022-05-25
Applicant: NINGBO SUNNY OPOTECH CO., LTD.
Inventor： Mingzhu Wang , Zhenyu Chen , Nan Guo , Takehiko Tanaka , Bojie Zhao , Zilong Deng
IPC: B29K101/12 , H04N5/225 , B29C45/14 , B29C33/44 , G02B19/00 , G02B7/10 , B29C70/72 , B29C70/88 , G02B13/00 , H05K1/02 , H05K1/18 , H05K3/28 , B29C43/18 , B29C43/36 , B29C43/52 , G02B7/02 , B29L31/34 , B29C45/40 , B29C45/00 , B29D11/00 , B29L31/00
Abstract: A camera module, a molded circuit board assembly, a molded photosensitive assembly and manufacturing method thereof are disclosed. The camera module includes a molded base which is integrally formed with a circuit board through a molding process, wherein a photosensitive element may be electrically connected on the circuit board and at least a portion of a non-photosensitive area portion of the photosensitive element is also connected by the molded base through the molding process. A light window is formed in a central portion of the molded base to provide a light path for the photosensitive element, wherein a cross section of the light window is configured to have a trapezoidal or multi-step trapezoidal shape which has a size increasing from bottom to top to facilitate demoulding and avoiding stray lights.
-
-
-
-
-
-
-
-
-
Search Results
156
records
(took 0.023 seconds)
