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    Electrostatic bimorph actuator
    61.
    发明申请
    Electrostatic bimorph actuator 有权
    静电双压电晶片致动器

    公开(公告)号：US20040227428A1

    公开(公告)日：2004-11-18

    申请号：US10868603

    申请日：2004-06-14

    Applicant: Microsoft Corporation

    Inventor： Michael J. Sinclair

    IPC: H02K005/16 ,  H02K007/08 ,  H02N001/00

    CPC classification number: B81B3/0054 ,  B81B2201/032 ,  B81B2201/038 ,  B81B2201/045 ,  B81B2201/047

    Abstract: An electrostatic bimorph actuator includes a cantilevered flexible bimorph arm that is secured and insulated at one end to a planar substrate. In an electrostatically activated state the bimorph arm is generally parallel to the planar substrate. In a relaxed state, residual stress in the bimorph arm causes its free end to extend out-of-plane from the planar substrate. The actuator includes a substrate electrode that is secured to and insulated from the substrate and positioned under and in alignment with the bimorph arm. An electrical potential difference applied between the bimorph arm and the substrate electrode imparts electrostatic attraction between the bimorph arm and the substrate electrode to activate the actuator. As an exemplary application in which such actuators could be used, a microelectrical mechanical optical display system is described.

    Abstract translation: 静电双压电晶片致动器包括悬臂式柔性双压电晶臂，其在一端固定并绝缘到平面衬底。 在静电激活状态下，双压电晶片臂通常平行于平面衬底。 在松弛状态下，双压电晶片臂中的残余应力使其自由端从平面基板向外延伸。 致动器包括固定到基板并与基板绝缘并位于双压电晶片臂下方并与之对准的基板电极。 施加在双压电晶片臂和衬底电极之间的电势差使得双压电晶片臂和衬底电极之间的静电吸引力激活致动器。 作为可以使用这种致动器的示例性应用，描述了一种微电子机械光学显示系统。

    Microsystem with element deformable by the action of heat-actuated device
    62.
    发明授权
    Microsystem with element deformable by the action of heat-actuated device 有权
    微系统通过热驱动装置的作用可变形

    公开(公告)号：US06812820B1

    公开(公告)日：2004-11-02

    申请号：US09554272

    申请日：2000-06-06

    Applicant: Yves Fouillet

    Inventor： Yves Fouillet

    IPC: H01H3732

    CPC classification number: H01H1/0036 ,  B81B3/0024 ,  B81B2201/016 ,  B81B2201/032 ,  H01G5/16 ,  H01H2001/0042 ,  H01H2037/008 ,  Y10T29/42 ,  Y10T29/49105 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49128 ,  Y10T29/49155

    Abstract: The invention concerns a microsystem, in particular for producing microswitches or microvalves, constituted on a substrate (50) and used for producing a shift between a first operating state and a second operating state by means of a heat actuated device with bi-metal switch effect. The heat-actuated device comprises a deformable element (51) connected, by opposite ends, to the substrate (50) so as to present naturally a deflection without stress relative to the substrate surface which faces it, said natural deflection determining the first operating state, the second operating state being produced by the heat-actuated device which induces, by the effect of temperature variation, a deformation of the deformable element (51) tending to reduce its deflection and submitting it to a compressive stress by buckling effect in a direction opposite to its natural deflection.

    Abstract translation: 本发明涉及一种微系统，特别是用于制造微型开关或微型阀，其构造在基板（50）上并用于通过具有双金属开关效应的热致动装置在第一操作状态和第二操作状态之间产生换档 。 热致动装置包括通过相对端连接到基板（50）的可变形元件（51），以便相对于面向其的基板表面自然地呈现不受应力的偏转，所述自然偏转确定第一操作状态 所述第二操作状态由所述热驱动装置产生，所述热致动装置通过温度变化而引起所述可变形元件（51）的变形，所述变形元件倾向于减小其偏转，并且通过在方向上的屈曲效应使其变形为压缩应力 与其自然变形相反。

    High sensitive micro-cantilever sensor and fabricating method thereof
    63.
    发明授权
    High sensitive micro-cantilever sensor and fabricating method thereof 失效
    高灵敏度微悬臂传感器及其制造方法

    公开(公告)号：US06797631B2

    公开(公告)日：2004-09-28

    申请号：US10209866

    申请日：2002-08-02

    Applicant: Tae-Song Kim ,  Hyung-Joon Kim ,  Yong-Bum Kim

    Inventor： Tae-Song Kim ,  Hyung-Joon Kim ,  Yong-Bum Kim

    IPC: H01L21301

    CPC classification number: G01N29/036 ,  B81B3/0021 ,  B81B2201/0214 ,  B81B2201/032 ,  B81B2203/0118 ,  B81C1/0015 ,  G01N2291/0256

    Abstract: A high-sensitive micro cantilever sensor and a method for fabricating the same which is able to reduce size of a system greatly using a functional thin film has a structure in which an upper substrate comprising one or two piezoelectric cells including a cantilever, a piezoelectric layer formed on lower or upper surface of the cantilever, and electrodes formed on upper and lower surfaces of the piezoelectric layer is attached to a lower substrate including a cavity of an even depth by contacting the lower surface of the piezoelectric cell on the upper substrate with the cavity surface of the lower substrate.

    Abstract translation: 使用功能性薄膜能够大大减小系统尺寸的高灵敏度微悬臂式传感器及其制造方法具有如下结构：其中，包括一个或两个压电单元的上基板包括悬臂，压电层 形成在悬臂的下表面或上表面上，并且形成在压电层的上表面和下表面上的电极通过使上基板上的压电单元的下表面与 下基板的腔表面。

    Bimorph MEMS devices and methods to make same
    64.
    发明申请
    Bimorph MEMS devices and methods to make same 失效
    双极性MEMS器件和方法制作相同

    公开(公告)号：US20040164649A1

    公开(公告)日：2004-08-26

    申请号：US10375975

    申请日：2003-02-25

    Applicant: PALO ALTO RESEARCH CENTER INCORPORATED

    Inventor： Baomin Xu ,  William S. Wong

    IPC: H02N002/00 ,  H01L041/04 ,  H01L041/08 ,  H01L041/18

    CPC classification number: B81B3/0024 ,  B81B2201/032 ,  H01L41/094 ,  H01L41/22 ,  H01L41/313 ,  H01L41/314 ,  H01L41/337 ,  Y10T29/42 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49147 ,  Y10T29/49155 ,  Y10T29/49156

    Abstract: A bimorph structure is produced by depositing a first material on a first surface of a first substrate to form a first element structure. A second material is deposited onto a surface of a second substrate to form a second element structure. Electrodes are deposited on a surface of each of the first element structure and the second element structure. The first element structure is bonded to a first transfer substrate, and the second element structure is bonded to a second transfer substrate. The first substrate is removed from the first element structure, and the second substrate is removed from the second element structure. Second side electrodes are deposited on a second surface of each of the first element structures and the second element structure. The first element structure and the second element structure are directly bonded to each other. One of the first transfer substrate and the second transfer substrate is then removed, and the surface of the element structure from which one of the transfer substrates has been removed is bonded to a final target substrate. Thereafter, the other transfer substrate is removed, and electrical connections are made. In a further embodiment, a micro-electromechanical dimensioned bimorph structure includes a first element structure, and a second element structure. A bonding layer bonds the first element structure directly to the second element structure.

    Abstract translation: 通过在第一基板的第一表面上沉积第一材料以形成第一元件结构来生产双压电晶片结构。 将第二材料沉积到第二基板的表面上以形成第二元件结构。 电极沉积在第一元件结构和第二元件结构中的每一个的表面上。 第一元件结构被结合到第一转移衬底，并且第二元件结构被结合到第二转移衬底。 从第一元件结构去除第一衬底，并且从第二元件结构去除第二衬底。 第二侧电极沉积在每个第一元件结构和第二元件结构的第二表面上。 第一元件结构和第二元件结构彼此直接结合。 然后去除第一转印衬底和第二转印衬底之一，并且去除了一个转印衬底的元件结构的表面被结合到最终靶衬底。 此后，移除另一转印基板，并进行电连接。 在另一实施例中，微机电尺寸的双压电晶片结构包括第一元件结构和第二元件结构。 结合层将第一元件结构直接结合到第二元件结构。

    High sensitive micro-cantilever sensor and fabricating method thereof
    65.
    发明申请
    High sensitive micro-cantilever sensor and fabricating method thereof 失效
    高灵敏度微悬臂传感器及其制造方法

    公开(公告)号：US20030032293A1

    公开(公告)日：2003-02-13

    申请号：US10209866

    申请日：2002-08-02

    Applicant: Korean Institute of Science And Technology

    Inventor： Tae-Song Kim ,  Hyung-Joon Kim ,  Yong-Bum Kim

    IPC: H01L021/311

    CPC classification number: G01N29/036 ,  B81B3/0021 ,  B81B2201/0214 ,  B81B2201/032 ,  B81B2203/0118 ,  B81C1/0015 ,  G01N2291/0256

    Abstract: A high-sensitive micro cantilever sensor and a method for fabricating the same which is able to reduce size of a system greatly using a functional thin film has a structure in which an upper substrate comprising one or two piezoelectric cells including a cantilever, a piezoelectric layer formed on lower or upper surface of the cantilever, and electrodes formed on upper and lower surfaces of the piezoelectric layer is attached to a lower substrate including a cavity of an even depth by contacting the lower surface of the piezoelectric cell on the upper substrate with the cavity surface of the lower substrate.

    Abstract translation: 使用功能性薄膜能够大大减小系统尺寸的高灵敏度微悬臂式传感器及其制造方法具有如下结构：其中，包括一个或两个压电单元的上基板包括悬臂，压电层 形成在悬臂的下表面或上表面上，并且形成在压电层的上表面和下表面上的电极通过使上基板上的压电单元的下表面与 下基板的腔表面。

    Bistable micromechanical switches
    67.
    发明授权
    Bistable micromechanical switches 有权
    双稳态微机械开关

    公开(公告)号：US06239685B1

    公开(公告)日：2001-05-29

    申请号：US09418011

    申请日：1999-10-14

    Applicant: Thomas Robert Albrecht ,  Timothy Clark Reiley

    Inventor： Thomas Robert Albrecht ,  Timothy Clark Reiley

    IPC: H01H3746

    CPC classification number: G11C23/00 ,  B81B3/0024 ,  B81B2201/016 ,  B81B2201/032 ,  G11B5/40 ,  G11B19/04 ,  H01H1/0036 ,  H01H1/20 ,  H01H37/52 ,  H01H2001/0042 ,  H01H2001/0084 ,  H01H2037/008

    Abstract: A bistable micromechanical switch that includes a substrate, at least two anchor points formed on the substrate, and a beam structure that includes a two-material beam attached to at least two anchor points. The two-material beam has a first portion, a second portion and a center portion. The first portion of the two-material beam is formed from a first layer of a first material and a second layer of a second material such that the first layer of the first portion is proximate to the surface of the substrate and the second layer of the first portion is remote from the surface of the substrate. The first material has a first coefficient of thermal expansion and the second material has a second coefficient of thermal expansion such that the second coefficient of thermal expansion is greater than the first coefficient of thermal expansion. The second portion of the two-material beam is formed from a first layer of the second material and a second layer of the first material such that the first layer of the second portion is proximate to the surface of the substrate and the second layer of the second portion is remote from the surface of the substrate. The beam structure has a first and a second stable state such that the center portion of the beam structure is deflected toward the surface of the substrate for the first stable state and is deflected away from the surface of the substrate for the second stable state.

    Abstract translation: 一种双稳态微机械开关，其包括基板，形成在基板上的至少两个锚定点以及包括连接到至少两个锚定点的双材料梁的梁结构。 双材料梁具有第一部分，第二部分和中心部分。 双材料束的第一部分由第一材料的第一层和第二材料的第二层形成，使得第一部分的第一层靠近衬底的表面，并且第二层的第二层 第一部分远离基板的表面。 第一材料具有第一热膨胀系数，第二材料具有第二热膨胀系数，使得第二热膨胀系数大于第一热膨胀系数。 双材料束的第二部分由第二材料的第一层和第一材料的第二层形成，使得第二部分的第一层靠近基板的表面，并且第二层的第二层 第二部分远离基板的表面。 梁结构具有第一和第二稳定状态，使得梁结构的中心部分朝向基板的表面偏转第一稳定状态，并且偏转离开基板的表面用于第二稳定状态。

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