公开(公告)号：US11750972B2

公开(公告)日：2023-09-05

申请号：US17657476

申请日：2022-03-31

Applicant: Shure Acquisition Holdings, Inc.

Inventor： Brent Robert Shumard ,  Mark Gilbert ,  James Michael Pessin ,  Emily Ann Wigley

IPC: H04R3/00 ,  H04R1/24 ,  H04R1/40 ,  H04R19/04

CPC classification number: H04R3/005 ,  H04R1/245 ,  H04R1/406 ,  H04R19/04 ,  H04R2201/003 ,  H04R2201/403

Abstract: Embodiments include an array microphone comprising a plurality of microphone sets arranged in a linear pattern relative to a first axis and configured to cover a plurality of frequency bands. Each microphone set comprises a first microphone arranged along the first axis and a second microphone arranged along a second axis orthogonal to the first microphone, wherein a distance between adjacent microphones along the first axis is selected from a first group consisting of whole number multiples of a first value, and within each element, a distance between the first and second microphones along the second axis is selected from a second group consisting of whole number multiples of a second value.

公开(公告)号：US11743666B2

公开(公告)日：2023-08-29

申请号：US17138487

申请日：2020-12-30

Applicant: Knowles Electronics, LLC

Inventor： Vezio Malandruccolo ,  Mark Niederberger ,  Luca Bettini ,  Weiwen Dai

IPC: H04R29/00 ,  H04R3/00 ,  H04R1/04 ,  B81B7/00 ,  H04R19/04

CPC classification number: H04R29/004 ,  B81B7/008 ,  H04R1/04 ,  H04R3/00 ,  H04R19/04 ,  B81B2201/0257 ,  B81B2207/03 ,  H04R2201/003

Abstract: The disclosure relates generally to microphone and vibration sensor assemblies (100) having a transducer (102), like a microelectromechanical systems (MEMS) device, and an electrical circuit (103) disposed in a housing (110) configured for integration with a host device. The electrical circuit includes a transducer bias circuit that applies a bias to the transducer and a bias control circuit (204) that compensates for transducer sensitivity drift caused by variation in an environmental condition of the transducer, and electrical circuits therefor.

公开(公告)号：US20230269534A1

公开(公告)日：2023-08-24

申请号：US17675801

申请日：2022-02-18

Applicant: Infineon Technologies AG

Inventor： Dietmar Straeussnigg ,  Niccoló De Milleri ,  Hong Chen ,  Simon Gruenberger ,  Andreas Wiesbauer

IPC: H04R3/06 ,  H04R19/04 ,  H04R3/02 ,  H03M1/12

CPC classification number: H04R3/06 ,  H03M1/12 ,  H04R3/02 ,  H04R19/04 ,  H04R2201/003

Abstract: According to an embodiment, a digital microphone includes an analog-to-digital converter (ADC) for receiving an analog input signal; a DC blocker component coupled to the ADC; a digital low pass filter coupled to the DC block component; and a nonlinear compensation component coupled to the digital low pass filter for providing a digital output signal.

公开(公告)号：US11726105B2

公开(公告)日：2023-08-15

申请号：US16900185

申请日：2020-06-12

Applicant: QUALCOMM Technologies, Inc.

Inventor： Robert J. Littrell

IPC: G01P15/09 ,  G01P1/00 ,  H10N30/30 ,  H04R19/04 ,  H04R17/00

CPC classification number: G01P15/09 ,  G01P1/00 ,  H04R17/00 ,  H04R19/04 ,  H10N30/302 ,  H10N30/306 ,  H04R2201/003

Abstract: A sensor device that senses proper acceleration. The sensor device includes a substrate, a spacer layer supported over a first surface of the substrate, at least a first tapered cantilever beam element having a base and a tip, the base attached to the spacer layer, and which is supported over and spaced from the substrate by the spacer layer. The at least first tapered cantilever beam element tapers in width from the base portion to the tip portion. The at least first cantilever beam element further including at least a first layer comprised of a piezoelectric material, a pair of electrically conductive layers disposed on opposing surfaces of the first layer, and a mass supported at the tip portion of the at least first tapered cantilever beam element.

公开(公告)号：US11716576B2

公开(公告)日：2023-08-01

申请号：US17674203

申请日：2022-02-17

Applicant: SKYWORKS SOLUTIONS, INC.

Inventor： Guofeng Chen ,  You Qian ,  Rakesh Kumar ,  Michael Jon Wurtz ,  Humberto Campanella-Pineda

IPC: H04R17/02 ,  H04R7/08 ,  H04R7/18 ,  H10N30/50

CPC classification number: H04R17/02 ,  H04R7/08 ,  H04R7/18 ,  H10N30/508 ,  H04R2201/003

Abstract: A piezoelectric microelectromechanical system microphone comprises a piezoelectric element configured to deform and generate an electrical potential responsive to impingement of sound waves on the piezoelectric element, a sensing electrode disposed on the piezoelectric element and configured to sense the electrical potential, and a dummy electrode electrically unconnected to the sensing electrode and disposed on a portion of the piezoelectric element that is free of the sensing electrode, the dummy electrode configured to reduce static deformation of the piezoelectric element caused by residual stresses in the piezoelectric element.

公开(公告)号：US20230239641A1

公开(公告)日：2023-07-27

申请号：US18156155

申请日：2023-01-18

Applicant: SKYWORKS SOLUTIONS, INC.

Inventor： Guofeng Chen ,  Yu Hui

IPC: H04R31/00 ,  B81B3/00 ,  B81C1/00 ,  H04R7/04 ,  H04R7/18 ,  H04R17/02 ,  H04R19/04

CPC classification number: H04R31/006 ,  B81B3/0072 ,  B81C1/00666 ,  H04R7/04 ,  H04R7/18 ,  H04R17/02 ,  H04R19/04 ,  H04R31/003 ,  B81B2201/0257 ,  B81B2203/0127 ,  B81B2203/0307 ,  B81C2201/0105 ,  B81C2201/0132 ,  B81C2203/0118 ,  H04R2201/003

Abstract: A method for manufacturing a microelectromechanical systems (MEMS) microphone comprises depositing a membrane on a first sacrificial layer, wherein the first sacrificial layer is deposited on a substrate, etching the substrate to define a cavity, releasing the membrane by removing at least the first sacrificial layer, and forming at least one anchor at the edge of the membrane.

公开(公告)号：US20230232165A1

公开(公告)日：2023-07-20

申请号：US18151207

申请日：2023-01-06

Applicant: STMicroelectronics S.R.I.

Inventor： Paolo Angelini ,  Roberto Pio Baorda

IPC: H04R19/04 ,  G01R19/165

CPC classification number: H04R19/04 ,  G01R19/16576 ,  H04R2201/003

Abstract: A read circuit for capacitive sensors such as a MEMS microphones includes a sensor node configured to be coupled to a capacitive sensor to apply a bias voltage to the sensor and sense the capacitance value of the sensor wherein the voltage at the sensor node is indicative of the capacitance value of the capacitive sensor. A switch is provided between the sensor node and the intermediate node. A shock detector coupled to the sensor node and the switch asserts a shock signal to make the switch conductive in response to a shock applied to the capacitive sensor, and de-asserts the shock signal to make the switch non-conductive with a delay after the end of the shock applied to the capacitive sensor.

公开(公告)号：US11706551B2

公开(公告)日：2023-07-18

申请号：US17842408

申请日：2022-06-16

Applicant: Cochlear Limited

Inventor： Nathan Isaacson ,  Adam Mujaj

IPC: H04R3/00 ,  H04R1/08 ,  H04R1/04 ,  H04R19/04 ,  H04R31/00 ,  H04R25/00

CPC classification number: H04R1/086 ,  H04R1/04 ,  H04R3/00 ,  H04R19/04 ,  H04R31/006 ,  H04R25/604 ,  H04R2201/003 ,  H04R2225/67

Abstract: Presented herein are contaminant-proof microphone assemblies for use with devices/apparatuses, such as auditory prostheses, that include one or more microphones disposed within a housing. A contaminant-proof microphone assembly in accordance with certain embodiments presented herein includes a microphone, a microphone plug, and a contaminant-proof membrane. The microphone plug has a first end coupled to the microphone and a second end that is configured to be positioned adjacent the contaminant-proof membrane. As such, the microphone plug is disposed between a sound inlet of the microphone and the contaminant-proof membrane. The microphone plug may be configured to mate with the housing or a gasket attached to the housing.

公开(公告)号：US20230217191A1

公开(公告)日：2023-07-06

申请号：US17827813

申请日：2022-05-30

Applicant: AAC Kaitai Technologies (Wuhan) CO., LTD

Inventor： Bei Tong ,  Rui Zhang

IPC: H04R19/02 ,  H04R7/04 ,  H04R7/18 ,  B81B3/00

CPC classification number: H04R19/02 ,  H04R7/04 ,  H04R7/18 ,  B81B3/0037 ,  H04R2201/003 ,  B81B2201/0257 ,  B81B2203/0127 ,  B81B2203/0163 ,  B81B2203/019

Abstract: The present invention provides a MEMS microphone, including a substrate and a capacitive structure. The capacitive structure includes a back plate and a vibration diaphragm. The vibration diaphragm includes a main body and a plurality of supporting structures for supporting the main body. Each supporting structure includes a supporting beam and two spring structures. Each spring structure includes at least two beam arms extending along the extension direction of the peripheral edge of the main body, and the beam arm closest to the main body is spaced apart from the main body. The sensitivity of the MEMS microphone in the present invention is higher.

公开(公告)号：US11689863B2

公开(公告)日：2023-06-27

申请号：US16503221

申请日：2019-07-03

Applicant: DB HITEK CO., LTD.

Inventor： Jong Won Sun

IPC: H04R7/02 ,  H04R19/04 ,  H04R31/00

CPC classification number: H04R19/04 ,  H04R7/02 ,  H04R31/00 ,  H04R2201/003

Abstract: A MEMS microphone includes a substrate having a cavity, a diaphragm disposed over the substrate to cover the cavity, an anchor extending from and end portion of the diaphragm to surround a periphery of the diaphragm, the anchor being fixed to a lower surface of the substrate to support the diaphragm from the substrate, a back plate disposed over the diaphragm, the back plate being spaced apart from the diaphragm to define an air gap therebetween and having a plurality of acoustic holes, an upper insulation layer covering an upper surface of the back plate to hold the back plate, and a strut positioned on the anchor, the strut being connected to the upper insulation layer and making contact with a lower surface of the anchor to support the upper insulation layer and to be spaced from the diaphragm.