公开(公告)号：US09253890B2

公开(公告)日：2016-02-02

申请号：US14080810

申请日：2013-11-15

Applicant: Industrial Technology Research Institute

Inventor： Yu-Pei Chang ,  Ming-Huan Yang ,  Chun-Yi Chiu

IPC: B32B3/02 ,  H05K3/02 ,  G06F3/044 ,  H05K3/20 ,  H05K1/09 ,  B82Y40/00 ,  H05K3/46

CPC classification number: H05K3/02 ,  B82Y40/00 ,  G06F3/044 ,  G06F2203/04103 ,  G06F2203/04112 ,  H05K1/097 ,  H05K3/20 ,  H05K3/4685 ,  H05K2201/0108 ,  H05K2201/0257 ,  H05K2201/026 ,  H05K2201/09245 ,  H05K2203/1105 ,  H05K2203/1142 ,  Y10S977/932 ,  Y10T428/24802

Abstract: Provided is a patterned conductive film may include a conductive interconnected nano-structure film. The conductive interconnected nano-structure film may include a first region and a second region adjacent to the first region. A conductivity of the first region may be at least 1000 times a conductivity of the second region.

Abstract translation: 提供了图案化的导电膜可以包括导电互连的纳米结构膜。 导电互连的纳米结构膜可以包括与第一区域相邻的第一区域和第二区域。 第一区域的电导率可以是第二区域的电导率的至少1000倍。

公开(公告)号：US20160014894A1

公开(公告)日：2016-01-14

申请号：US14864895

申请日：2015-09-25

Applicant: FUJIFILM CORPORATION

Inventor： YASUSHI ENDO ,  NOBUYUKI TADA ,  KENJI NAOI ,  TOMOHITO ASAI ,  HIDEO IKEDA ,  MICHIHIRO SHIBATA

IPC: H05K1/11 ,  H05K1/09

CPC classification number: H05K1/11 ,  C08F220/18 ,  C09J133/08 ,  C09J133/10 ,  C09J133/26 ,  G06F3/044 ,  G06F2203/04103 ,  G06F2203/04112 ,  H05K1/0289 ,  H05K1/092 ,  H05K3/285 ,  H05K3/4673 ,  H05K2201/0108 ,  H05K2201/0761 ,  H05K2201/0769 ,  C08F2220/1858 ,  C08F220/20

Abstract: This wiring board is provided with: a plurality of metal wires disposed upon an insulating substrate; and a transparent adhesive agent layer which is disposed upon the metal wires, and which is in direct contact with the metal wires. The metal wires include: a first metal wire which has a pulse signal supplied thereto; and a second metal wire which has a fixed electric potential applied thereto. The pulse signal has a reference level identical to the fixed electric potential, and has a pulse train in which a plurality of pulses having a pulse width of not more than 3 msec are arranged, the integral time of the pulses in a period of 600 seconds being less than 60 seconds.

Abstract translation: 该布线板设置有：设置在绝缘基板上的多个金属线; 以及设置在金属线上并与金属线直接接触的透明粘合剂层。 金属线包括：具有供给脉冲信号的第一金属线; 以及施加有固定电位的第二金属线。 脉冲信号具有与固定电位相同的参考电平，并且具有脉冲序列，其中布置脉冲宽度不超过3毫秒的多个脉冲，脉冲在600秒的周期内的积分时间 小于60秒。

公开(公告)号：US20150382475A1

公开(公告)日：2015-12-31

申请号：US14527134

申请日：2014-10-29

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Lin Li ,  Chen Tang ,  Yangyang Xin ,  Shan Chang

IPC: H05K3/06 ,  H05K1/02 ,  H05K1/09

CPC classification number: H05K3/062 ,  H05K1/097 ,  H05K3/064 ,  H05K2201/0108 ,  H05K2201/026 ,  H05K2201/10128 ,  H05K2203/0574

Abstract: Embodiments of the present invention provide a preparation method of a patterned film, a display substrate and a display device, avoiding falling off of a film layer occurring in the process of peeling off a photoresist layer. The preparation method of the patterned film comprises: forming a preset film layer on a surface of a preset substrate; covering the preset film layer with an isolation layer; forming a photoresist layer on a surface of the isolation layer and forming a pattern of the isolation layer with a patterning process; then removing the preset film layer which is not covered by the pattern of the isolation layer, peeling off the photoresist layer and removing the remaining, isolation layer to form a pattern of the preset film layer.

Abstract translation: 本发明的实施方式提供了图案化膜，显示基板和显示装置的制备方法，避免了在剥离光致抗蚀剂层的过程中发生的膜层脱落。 图案化膜的制备方法包括：在预设衬底的表面上形成预定的膜层; 用隔离层覆盖预置的膜层; 在隔离层的表面上形成光致抗蚀剂层，并用图案化工艺形成隔离层的图案; 然后除去未被隔离层的图案覆盖的预定膜层，剥离光致抗蚀剂层并除去剩余的隔离层以形成预设膜层的图案。

公开(公告)号：US20150370377A1

公开(公告)日：2015-12-24

申请号：US14836273

申请日：2015-08-26

Applicant: Toppan Printing Co., Ltd.

Inventor： Takanori OHARA

IPC: G06F3/044 ,  H05K3/06 ,  H05K1/02

CPC classification number: G06F3/044 ,  G06F2203/04103 ,  H05K1/0274 ,  H05K1/0296 ,  H05K1/097 ,  H05K3/06 ,  H05K2201/0108 ,  H05K2201/026 ,  Y10T29/49163

Abstract: A touch panel includes a transparent substrate, a wiring formed on at least one surface of the transparent substrate, a conductive layer formed on the wiring and the transparent substrate, and a protective layer formed on the conductive layer. The wiring transmits a signal from the conductive layer. The conductive layer is transparent and has a pattern formed by patterning a material formed on the wiring.

Abstract translation: 触摸面板包括透明基板，形成在透明基板的至少一个表面上的布线，形成在布线和透明基板上的导电层以及形成在导电层上的保护层。 布线从导电层传输信号。 导电层是透明的，并且具有通过图案化形成在布线上的材料形成的图案。

公开(公告)号：US09213139B2

公开(公告)日：2015-12-15

申请号：US14097812

申请日：2013-12-05

Applicant: Ronald Steven Cok ,  Todd Mathew Spath

Inventor： Ronald Steven Cok ,  Todd Mathew Spath

IPC: H01L31/12 ,  H01L31/18 ,  G02B6/13 ,  G02B6/122 ,  H05K3/12 ,  H01L23/538 ,  H01L21/768 ,  G02B6/42 ,  G06F3/044 ,  H05K3/32 ,  G02B6/12

CPC classification number: G02B6/122 ,  G02B6/13 ,  G02B6/138 ,  G02B6/4214 ,  G02B6/4274 ,  G02B2006/121 ,  G02B2006/12104 ,  G02B2006/12126 ,  G02B2006/12147 ,  G06F3/044 ,  H01L21/76895 ,  H01L23/5386 ,  H01L31/12 ,  H01L31/18 ,  H01L2924/0002 ,  H05K1/0274 ,  H05K3/10 ,  H05K3/101 ,  H05K3/1258 ,  H05K3/32 ,  H05K2201/0108 ,  H05K2201/09036 ,  H05K2201/10356 ,  H05K2203/0108 ,  H01L2924/00

Abstract: A method of making an imprinted optical micro-channel structure for transmitting light to an optical receiver or receiving light from an optical transmitter includes forming a curable optical layer over a substrate and imprinting one or more optical micro-channels in the optical layer with a first stamp. The curable optical layer is cured to form a cured optical layer having the optical micro-channels imprinted in the cured optical layer. A curable light-transparent material is located in the optical micro-channels and cured to form light-pipes of cured light-transparent material in the optical micro-channels. The optical transmitter located in alignment with a light-pipe for transmitting light through the light-pipe or the optical receiver is located in alignment with a light-pipe for receiving light from the light-pipe.

Abstract translation: 一种制造用于将光传输到光接收器或从光发射器接收光的压印光学微通道结构的方法包括在衬底上形成可固化的光学层，并在第一个光学层中将一个或多个光学微通道压印在光学层中 邮票。 固化光学层被固化以形成固化的光学层，该光学层具有印刷在固化的光学层中的光学微通道。 可光固化的透光材料位于光学微通道中并固化，以在光学微通道中形成固化的透光材料的光管。 与用于透过光管或光接收器透射光的光管对准的光发射器与用于接收来自光管的光的光管对准。

公开(公告)号：US20150359105A1

公开(公告)日：2015-12-10

申请号：US14733783

申请日：2015-06-08

Applicant: Iinnova Dynamics, Inc.

Inventor： Hichang Yoon ,  James Kundrat ,  Andrew Loxley ,  Arjun D. Srinivas ,  J. Russell Renzas ,  James W. Borchert ,  Sheng Peng ,  Vyankat Sindphale ,  Ralph E. Korenbrekke ,  Christopher L. Anderson

IPC: H05K3/06 ,  H05K1/02 ,  C09D5/00 ,  C09D7/12 ,  C09D129/04 ,  C09D139/02

CPC classification number: H05K3/067 ,  C08K5/17 ,  C09D5/00 ,  C09D5/24 ,  C09D7/40 ,  C09D7/63 ,  C09D7/65 ,  C09D129/04 ,  C09D139/02 ,  H05K1/0213 ,  H05K3/02 ,  H05K3/061 ,  H05K2201/0108 ,  H05K2201/026 ,  H05K2203/0307 ,  H05K2203/1142 ,  H05K2203/1157

Abstract: A manufacturing method of a patterned transparent conductor includes: (1) providing a transparent conductor including nanowires formed of a metal; and (2) applying a percolation-inhibition composition to a portion of the transparent conductor to partially degrade nanowires included in the portion. The percolation-inhibition composition includes a complexing agent for the metal.

Abstract translation: 图案化透明导体的制造方法包括：（1）提供包括由金属形成的纳米线的透明导体; 和（2）将渗透抑制组合物施加到所述透明导体的一部分以部分地降解所述部分中包括的纳米线。 渗滤抑制组合物包括金属络合剂。

公开(公告)号：US20150357512A1

公开(公告)日：2015-12-10

申请号：US14828663

申请日：2015-08-18

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Jeffrey P. Gambino ,  Derrick Liu ,  Daniel S. Vanslette

IPC: H01L31/18 ,  H01L51/00 ,  H01L33/42 ,  H01L31/0224 ,  H01L33/00

CPC classification number: H01L31/1884 ,  B82Y10/00 ,  B82Y30/00 ,  H01B1/24 ,  H01L31/022408 ,  H01L31/022425 ,  H01L31/022466 ,  H01L33/005 ,  H01L33/42 ,  H01L51/0021 ,  H05K3/105 ,  H05K2201/0108 ,  H05K2201/026 ,  H05K2203/1194 ,  Y02E10/50

Abstract: Disclosed are embodiments of a structure with a metal silicide transparent conductive electrode, which is commercially viable, robust and safe to use and, thus, optimal for incorporation into devices, such as flat panel displays, touch panels, solar cells, light emitting diodes (LEDs), organic optoelectronic devices, etc. Specifically, the structure can comprise a substrate (e.g., a glass or plastic substrate) and a transparent conducting film on that substrate. The transparent conducting film can comprise a metal silicide nanowire network. For example, in one embodiment, the metal silicide nanowire network can comprise multiple metal silicide nanowires fused together in a disorderly arrangement so that they form a mesh. In another embodiment, the metal silicide nanowire network can comprise multiple metal silicide nanowires patterned so that they form a grid. Also disclosed herein are various different method embodiments for forming such a structure.

Abstract translation: 公开了具有金属硅化物透明导电电极的结构的实施例，其具有商业上可行性，稳健且安全使用，并且因此最佳地结合到诸如平板显示器，触摸面板，太阳能电池，发光二极管 LED），有机光电子器件等。具体地，该结构可以包括衬底（例如，玻璃或塑料衬底）和该衬底上的透明导电膜。 透明导电膜可以包括金属硅化物纳米线网络。 例如，在一个实施例中，金属硅化物纳米线网络可以包括以无序布置融合在一起的多个金属硅化物纳米线，使得它们形成网状物。 在另一个实施例中，金属硅化物纳米线网络可以包括图案化的多个金属硅化物纳米线，使得它们形成网格。 本文还公开了用于形成这种结构的各种不同的方法实施例。

公开(公告)号：US09207393B2

公开(公告)日：2015-12-08

申请号：US13963664

申请日：2013-08-09

Applicant: LG INNOTEK CO., LTD.

Inventor： Hyun Duck Yang ,  Jin Hee Kim ,  Chul Hong Kim ,  Gwang Ho Park ,  Moo Ryoung Park

IPC: F21V8/00 ,  H05K1/18 ,  F21V5/02 ,  F21V5/00 ,  F21V13/04 ,  F21Y101/02 ,  F21S8/10 ,  H01L25/075 ,  H05K3/00

CPC classification number: F21V5/002 ,  F21S43/14 ,  F21S43/26 ,  F21V5/004 ,  F21V5/008 ,  F21V5/02 ,  F21V13/04 ,  F21V17/101 ,  F21V19/0015 ,  F21Y2101/00 ,  F21Y2115/10 ,  G02B6/0088 ,  H01L25/0753 ,  H01L2924/0002 ,  H01L2933/0091 ,  H05K1/189 ,  H05K3/0064 ,  H05K2201/0108 ,  H05K2201/10106 ,  H05K2201/2054 ,  H01L2924/00

Abstract: Disclosed is a lighting device which comprises: an optical member comprising a protruding optical pattern forming a gap with an adjacent layer; at least one light emitting unit inserted into the optical member; and a resin layer formed on the optical member and the at least one light emitting unit, whereby it is possible to obtain an effect that the shapes of light change depending on the viewing angle when viewing the light source by producing various protruding optical patterns, an effect that the whole thickness can be reduced, and an effect that the degree of design freedom can be enhanced when designing products thanks to an enhanced flexibility.

Abstract translation: 公开了一种照明装置，其包括：光学构件，包括与相邻层形成间隙的突出光学图案; 至少一个发光单元插入到光学构件中; 以及形成在所述光学构件和所述至少一个发光单元上的树脂层，由此可以获得当通过产生各种突出的光学图案来观察光源时，光的形状随着视角而变化的效果， 可以降低整个厚度，并且由于增强的灵活性，在设计产品时可以提高设计自由度。

公开(公告)号：US20150345042A1

公开(公告)日：2015-12-03

申请号：US14329009

申请日：2014-07-11

Applicant: JTOUCH Corporation

Inventor： Yu-Chou Yeh ,  Chih-Ming Hu ,  Chiu-Cheng Tsui

IPC: C25D5/02 ,  C25D5/34 ,  C25D5/48 ,  C23F1/02

CPC classification number: C25D5/02 ,  C23F1/02 ,  C25D5/34 ,  C25D5/48 ,  C25D7/123 ,  G06F3/044 ,  G06F3/047 ,  G06F2203/04103 ,  G06F2203/04112 ,  H05K3/108 ,  H05K3/16 ,  H05K3/244 ,  H05K3/282 ,  H05K2201/0108 ,  H05K2201/10053 ,  H05K2203/121

Abstract: A method of manufacturing a metal line microstructure is provided. Firstly, a substrate is provided. Then, a seed layer is formed on a surface of the substrate. Then, a photoresist layer is formed on a surface of the seed layer, and a photolithography and etching process is performed to form a trench in the photoresist layer, wherein the trench has a specified width. Then, an electroplating process is performed to fill a conductive layer into the trench. Afterwards, the photoresist layer and a portion of the seed layer uncovered by the conductive layer are removed, so that the metal line microstructure is produced.

Abstract translation: 提供一种制造金属线微结构的方法。 首先，提供基板。 然后，在基板的表面上形成种子层。 然后，在种子层的表面上形成光致抗蚀剂层，并且进行光刻和蚀刻处理以在光致抗蚀剂层中形成沟槽，其中沟槽具有指定的宽度。 然后，执行电镀工艺以将导电层填充到沟槽中。 之后，去除未被导电层覆盖的光致抗蚀剂层和种子层的一部分，从而产生金属线微结构。

公开(公告)号：US09204539B2

公开(公告)日：2015-12-01

申请号：US14560567

申请日：2014-12-04

Applicant: INNOLUX CORPORATION

Inventor： Kai Meng ,  Lien-Hsin Lee

IPC: H03K17/96 ,  H05K1/02 ,  G06F3/044 ,  H05K1/03 ,  H05K3/10 ,  H05K3/12

CPC classification number: H05K1/0296 ,  G06F3/044 ,  G06F2203/041 ,  G06F2203/04103 ,  G06F2203/04111 ,  G06F2203/04112 ,  H03K17/9622 ,  H03K2017/9613 ,  H03K2217/96075 ,  H03K2217/960755 ,  H03K2217/960765 ,  H05K1/0274 ,  H05K1/0306 ,  H05K3/10 ,  H05K3/125 ,  H05K2201/0108 ,  H05K2201/017 ,  Y10T29/49105 ,  Y10T29/49155 ,  Y10T29/49162

Abstract: A method of fabricating a capacitance touch panel module includes forming a plurality of first conductive patterns on a substrate comprising a touching area and a peripheral area along a first orientation, a plurality of second conductive patterns along a second orientation, and a plurality of connecting portions in the touching area; forming a plurality of insulated protrusions, in which each insulated protrusion covering one connecting portion, and forming an insulated frame on the peripheral area; and forming a bridging member on each insulated protrusion.