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61.发明申请公开(公告)号：US20120037409A1
公开(公告)日：2012-02-16
申请号：US13256114
申请日：2010-03-09
Applicant: Norihiro Yamaguchi , Hiroaki Umeda , Ken Yukawa
Inventor： Norihiro Yamaguchi , Hiroaki Umeda , Ken Yukawa
CPC classification number: H05K3/46 , H01B1/22 , H05K1/0298 , H05K1/095 , H05K3/0032 , H05K3/4069 , H05K3/462 , H05K2201/0191 , H05K2201/0272 , H05K2201/0355 , H05K2201/10378 , H05K2203/0278 , H05K2203/0425 , H05K2203/1105 , H05K2203/111 , H05K2203/1194 , H05K2203/1461 , H05K2203/1572 , Y10T29/49117 , Y10T29/49124 , Y10T29/49139 , Y10T29/49155 , Y10T29/49165
Abstract: In a method of manufacturing a multilayer board, including: a drilling step for forming a via hole through a pre-preg by laser beam machining, a step of filling the via hole with conductive paste containing a resin component and metal powder, and a step of arranging copper layers or copper layer portions of patterned boards on and under the filled conductive paste and pressing the same, a multilayer printed wiring board superior in conductivity and long-term stability is obtained by using alloying paste as the conductive paste in which at least part of the metal powder is melted and the metal powders adjacent to each other are alloyed, using a pre-preg having a ratio A/B of at least 10 before subjected to preheating, where A is a storage modulus at an inflection point where the storage modulus changes from increasing to decreasing and B is a storage modulus at an inflection point where the storage modulus changes from decreasing to increasing in a temperature profile rising from 60° C. to 200° C., and preheating the pre-preg before the drilling step to reduce the ratio A/B to below 10.
Abstract translation: 在制造多层板的方法中，包括：通过激光束加工形成通孔的钻孔步骤，用含有树脂成分和金属粉末的导电膏填充通孔的步骤，以及步骤 在填充的导电糊料上和下方布置图案化板的铜层或铜层部分并对其进行压制，通过使用合金糊作为导电浆料，获得导电性和长期稳定性优异的多层印刷线路板，其中至少 使用在进行预热之前，使用比例A / B为10以上的预浸料，将金属粉末的一部分熔融并且彼此相邻的金属粉末合金化，其中A是在拐点处的储能模量， 储能模量从增加到减少变化，B是在从60℃升高的温度分布中储能模量从降低到升高的拐点处的储能模量 到200℃，并且在钻井步骤之前预热预浸料以将A / B比率降低到10以下。
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公开(公告)号：US20110253428A1
公开(公告)日：2011-10-20
申请号：US12759761
申请日：2010-04-14
Applicant: Kevin W. Lim , Seah S. Too , Mohammad Z. Khan
Inventor： Kevin W. Lim , Seah S. Too , Mohammad Z. Khan
CPC classification number: H01L23/16 , H01L21/563 , H01L24/16 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/92 , H01L25/0655 , H01L25/0657 , H01L2224/16225 , H01L2224/16227 , H01L2224/73204 , H01L2224/81815 , H01L2224/83007 , H01L2224/83102 , H01L2224/83385 , H01L2224/92125 , H01L2924/01029 , H01L2924/14 , H01L2924/15311 , H01L2924/15312 , H01L2924/3511 , H05K1/181 , H05K2201/0272 , H05K2201/10674 , H05K2201/2018 , Y10T29/49117 , H01L2924/00
Abstract: Various embodiments of a semiconductor chip device that include a circuit board and a stiffener frame and methods of fabricating the same are disclosed. In one aspect, a method of manufacturing is provided that includes providing a circuit board and coupling a stiffener frame to the circuit board. The stiffener frame includes a first opening that defines an interior wall. The interior wall includes a notch.
Abstract translation: 公开了包括电路板和加强筋框架的半导体芯片器件的各种实施例及其制造方法。 一方面，提供一种制造方法，其包括提供电路板并将加强框架耦合到电路板。 加强框架包括限定内壁的第一开口。 内墙包括一个凹口。
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63.发明申请Conductive paste and method of manufacturing printed circuit board using the same 审中-公开导电浆料及使用其制造印刷电路板的方法公开(公告)号：US20110073252A1
公开(公告)日：2011-03-31
申请号：US12656019
申请日：2010-01-13
Applicant: Jun Oh Hwang , Jee Soo Mok , Eung Suek Lee
Inventor： Jun Oh Hwang , Jee Soo Mok , Eung Suek Lee
CPC classification number: H01B1/02 , H01B1/22 , H05K1/095 , H05K3/4069 , H05K3/4647 , H05K2201/0129 , H05K2201/0221 , H05K2201/0272 , H05K2201/0355 , H05K2203/0425
Abstract: The present invention provides a conductive paste including: a conductive powder particle including a polymer powder and a first low melting point metal and a second low melting point metal which are sequentially provided on a surface of the polymer powder and have different melting points; and a binder mixed in the conductive powder particle, and a method of manufacturing a printed circuit board using the same.
Abstract translation: 本发明提供一种导电性糊料，其特征在于，具备：具有聚合物粉末和第一低熔点金属和第二低熔点金属的导电性粉末粒子，其依次设置在所述聚合物粉末的表面上且具有不同的熔点; 和粘合剂混合在导电粉末颗粒中，以及制造使用其的印刷电路板的方法。
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公开(公告)号：US20110067912A1
公开(公告)日：2011-03-24
申请号：US12959752
申请日：2010-12-03
Applicant: Akhiro Nomura , Hidekiyo Takaoka , Kosuke Nakano
Inventor： Akhiro Nomura , Hidekiyo Takaoka , Kosuke Nakano
CPC classification number: H05K3/321 , C08K3/08 , C08K7/00 , C09J9/02 , C09J11/04 , H01B1/22 , H05K2201/0272 , H05K2201/10636 , H05K2203/0425 , Y02P70/611 , Y10T428/2857 , Y10T428/31678
Abstract: An electroconductive bonding material contains a thermosetting resin, a low-melting-point metal powder which is melted at a temperature equal to or lower than the thermosetting temperature of the thermosetting resin, a high-melting-point metal powder which is not melted at a temperature equal to or lower than the thermosetting temperature of the thermosetting resin and which reacts with the low-melting-point metal powder to form a reaction product having a high melting point of 300° C. or higher during heat-hardening of the thermosetting resin, and a reducing substance which removes an oxide formed on the surface of the high-melting-point metal powder. The total content of the low-melting-point metal powder and the high-melting-point metal powder is 75% to 88% by weight, and the particle size ratio D1/D2 of the average particle size D1 of the low-melting-point metal powder to the average particle size D2 of the high-melting-point metal powder is 0.5 to 6.0. Thereby, an electroconductive bonding material is provided which has good conduction properties and high connection strength even when reflow heat treatment is repeatedly carried out or thermal shock accompanied with a rapid temperature change is applied to the electroconductive bonding material, and an electronic apparatus using such an electroconductive bonding material.
Abstract translation: 导电接合材料包含热固性树脂，在等于或低于热固性树脂的热固化温度的温度下熔化的低熔点金属粉末，在 温度等于或低于热固性树脂的热固化温度，并且与低熔点金属粉末反应以形成热固性树脂的热硬化期间具有300℃以上的高熔点的反应产物 以及除去形成在高熔点金属粉末的表面上的氧化物的还原物质。 低熔点金属粉末和高熔点金属粉末的总含量为75〜88重量％，低熔点金属粉末和高熔点金属粉末的平均粒径D1的粒径比D1 / 点金属粉末与高熔点金属粉末的平均粒径D2为0.5〜6.0。 由此，即使在反复进行回流热处理时也具有良好的导电性和高连接强度的导电性接合材料，或者对导电性接合材料施加伴随着快速变化的热冲击，使用这样的电子设备 导电接合材料。
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公开(公告)号：US20100252616A1
公开(公告)日：2010-10-07
申请号：US12751030
申请日：2010-03-31
Applicant: Catherine Shearer , Kenneth C. Holcomb , G. Delbert Friesen , Michael C. Matthews
Inventor： Catherine Shearer , Kenneth C. Holcomb , G. Delbert Friesen , Michael C. Matthews
CPC classification number: B22F1/0003 , B22F1/0059 , B22F7/064 , H05K3/321 , H05K2201/0221 , H05K2201/0272
Abstract: The present invention provides electrically and thermally conductive compositions for forming interconnections between electronic elements. Invention compositions comprise three or more metal or metal alloy particle types and an organic vehicle comprising a flux that is application specific. The first particle type includes a reactive high melting point metal that reacts with a reactive low melting point metal(s) in the other particles to form intermetallic species. The reactive low melting point metal(s) of the invention are provided in two distinct particle forms. The first reactive low melting point metal particle includes a carrier that facilitates the reaction with the reactive high melting point metal. The second reactive low melting point metal particle acts primarily as a source of the reactive low melting point metal. Combination of the three particle types provides several advantages including reduction of the undesirable characteristics of the carrier metal while preserving and, in some embodiments, enhancing, the advantageous facilitation of the metallic reaction.
Abstract translation: 本发明提供用于形成电子元件之间的互连的导电和导热组合物。 本发明组合物包含三种或更多种金属或金属合金颗粒类型和包含特异性应用的助熔剂的有机载体。 第一颗粒型包括与其它颗粒中的反应性低熔点金属反应以形成金属间物质的反应性高熔点金属。 本发明的反应性低熔点金属以两种不同的颗粒形式提供。 第一反应性低熔点金属颗粒包括促进与反应性高熔点金属反应的载体。 第二反应性低熔点金属颗粒主要作为反应性低熔点金属的来源。 三种颗粒类型的组合提供了几个优点，包括减少载体金属的不期望的特性，同时保留并且在一些实施方案中增强对金属反应的有利促进。
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Patent Agency Ranking
公开(公告)号：US07763187B1
公开(公告)日：2010-07-27
申请号：US11895170
申请日：2007-08-23
Applicant: Vinod P. Veedu , Christopher J. Sullivan
Inventor： Vinod P. Veedu , Christopher J. Sullivan
CPC classification number: H01B1/22 , C09D11/03 , C09D11/52 , H01B1/24 , H05K1/097 , H05K2201/026 , H05K2201/0272
Abstract: Conductive silver ink is reinforced using carbon nanotubes. Carbon nanomaterials are stabilized and uniformly dispersed in a solvent and mechanically mixed with conductive silver ink. The reinforcement material bridges the gap between separated silver flakes in the conductive silver ink. The carbon nanotubes reinforced conductive silver ink exhibits superior performance over unreinforced silver ink in its mechanical, electrical and thermal properties without significantly greater weight.
Abstract translation: 使用碳纳米管增强导电银墨。 碳纳米材料被稳定化并均匀地分散在溶剂中并与导电银墨机械混合。 增强材料桥接导电银墨中分离的银薄片之间的间隙。 碳纳米管增强的导电银墨在机械，电和热性能方面表现出优于非增强银墨的性能，而没有显着更大的重量。
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67.发明申请Voltage Switchable Dielectric Material Containing Insulative and/or Low-Dielectric Core Shell Particles 审中-公开包含绝缘和/或低电介质芯壳的电压可切换电介质材料公开(公告)号：US20100148129A1
公开(公告)日：2010-06-17
申请号：US12638632
申请日：2009-12-15
Applicant: Lex Kosowsky , Robert Fleming , Ning Shi , Junjun Wu , Pragnya Saraf
Inventor： Lex Kosowsky , Robert Fleming , Ning Shi , Junjun Wu , Pragnya Saraf
CPC classification number: H05K1/0257 , H05K1/0259 , H05K1/0373 , H05K2201/0221 , H05K2201/0272 , H05K2201/0738
Abstract: A composition of voltage switchable dielectric (VSD) material that comprises a concentration of core shell particles that individually comprise an insulative core and one or more shell layers.
Abstract translation: 可变压电介质（VSD）材料的组合物，其包含单独包含绝缘芯和一个或多个壳层的芯壳颗粒的浓度。
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公开(公告)号：US07681777B2
公开(公告)日：2010-03-23
申请号：US10547539
申请日：2004-03-31
Applicant: Masahiko Hirata , Toshihiko Taguchi , Masanobu Okuyama , Yoshitaka Toyoda
Inventor： Masahiko Hirata , Toshihiko Taguchi , Masanobu Okuyama , Yoshitaka Toyoda
IPC: B23K35/14
CPC classification number: H05K3/3484 , B23K35/0244 , B23K35/262 , H05K3/3463 , H05K2201/0272
Abstract: In a solder paste formed by blending an alloy powder and a flux, the alloy powder is a powder mixture formed by mixing at least one powder of a Sn—Zn based alloy and at least one powder of a Sn—Ag based alloy. The alloys powders are blended so that the composition of the powder mixture is 5-10 mass % of Zn; 0.005-1.5 mass % of Ag; optionally at least one of 0.002-1.0 mass % of Cu, 0.005-15 mass % of Bi, 0.005-15 mass % of In, and 0.005-1.0 mass % of Sb; and a remainder of Sn.
Abstract translation: 在通过混合合金粉末和焊剂形成的焊膏中，合金粉末是通过混合至少一种Sn-Zn基合金粉末和至少一种Sn-Ag基合金粉末形成的粉末混合物。 将合金粉末混合，使粉末混合物的组成为Zn的5-10质量％ Ag：0.005〜1.5质量％ 可任意选择Cu：0.002〜1.0质量％，Bi：0.005〜15质量％，In：0.005〜15质量％，Sb：0.005〜1.0质量％ 和Sn的剩余部分。
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公开(公告)号：US20100006325A1
公开(公告)日：2010-01-14
申请号：US12495860
申请日：2009-07-01
Applicant: Masayuki KITAJIMA , Takeshi Ishitsuka , Satoshi Emoto
Inventor： Masayuki KITAJIMA , Takeshi Ishitsuka , Satoshi Emoto
CPC classification number: H05K3/249 , H05K1/118 , H05K2201/0272 , H05K2201/035 , H05K2201/0769 , H05K2203/1105
Abstract: A printed wiring board includes a first conductive paste forming a wiring pattern, and a second conductive paste including kneaded first conductive material and second conductive material whose particles are finer than those of the first conductive material.
Abstract translation: 印刷布线板包括形成布线图案的第一导电浆料和包含捏合的第一导电材料的第二导电浆料和其颗粒比第一导电材料的颗粒更细的第二导电材料。
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公开(公告)号：US20090155608A1
公开(公告)日：2009-06-18
申请号：US12394113
申请日：2009-02-27
Applicant: Akihiro Nomura , Hidekiyo Takaoka , Kosuke Nakano
Inventor： Akihiro Nomura , Hidekiyo Takaoka , Kosuke Nakano
CPC classification number: H05K3/321 , C08K3/08 , C08K7/00 , C09J9/02 , C09J11/04 , H01B1/22 , H05K2201/0272 , H05K2201/10636 , H05K2203/0425 , Y02P70/611 , Y10T428/2857 , Y10T428/31678
Abstract: An electroconductive bonding material contains a thermosetting resin, a low-melting-point metal powder which is melted at a temperature equal to or lower than the thermosetting temperature of the thermosetting resin, a high-melting-point metal powder which is not melted at a temperature equal to or lower than the thermosetting temperature of the thermosetting resin and which reacts with the low-melting-point metal powder to form a reaction product having a high melting point of 300° C. or higher during heat-hardening of the thermosetting resin, and a reducing substance which removes an oxide formed on the surface of the high-melting-point metal powder. The total content of the low-melting-point metal powder and the high-melting-point metal powder is 75% to 88% by weight, and the particle size ratio D1/D2 of the average particle size D1 of the low-melting-point metal powder to the average particle size D2 of the high-melting-point metal powder is 0.5 to 6.0. Thereby, an electroconductive bonding material is provided which has good conduction properties and high connection strength even when reflow heat treatment is repeatedly carried out or thermal shock accompanied with a rapid temperature change is applied to the electroconductive bonding material, and an electronic apparatus using such an electroconductive bonding material.
Abstract translation: 导电接合材料包含热固性树脂，在等于或低于热固性树脂的热固化温度的温度下熔化的低熔点金属粉末，在 温度等于或低于热固性树脂的热固化温度，并且与低熔点金属粉末反应以形成热固性树脂的热硬化期间具有300℃以上的高熔点的反应产物 以及除去形成在高熔点金属粉末的表面上的氧化物的还原物质。 低熔点金属粉末和高熔点金属粉末的总含量为75〜88重量％，低熔点金属粉末和高熔点金属粉末的平均粒径D1的粒径比D1 / 点金属粉末与高熔点金属粉末的平均粒径D2为0.5〜6.0。 由此，即使在反复进行回流热处理时也具有良好的导电性和高连接强度的导电性接合材料，或者对导电性接合材料施加伴随着快速变化的热冲击，使用这样的电子设备 导电接合材料。
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