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    Multilayer polyimide film, laminate, and metal-clad laminate
    62.
    发明授权
    Multilayer polyimide film, laminate, and metal-clad laminate 有权
    多层聚酰亚胺膜，层压板和覆金属层压板

    公开(公告)号：US08993108B2

    公开(公告)日：2015-03-31

    申请号：US12671719

    申请日：2008-07-18

    Applicant: Masayoshi Shimizu ,  Hisayasu Kaneshiro ,  Shogo Fujimoto

    Inventor： Masayoshi Shimizu ,  Hisayasu Kaneshiro ,  Shogo Fujimoto

    IPC: B32B27/08 ,  B32B27/28 ,  H05K1/03 ,  B32B15/08 ,  B32B27/34

    CPC classification number: H05K1/0346 ,  B32B7/02 ,  B32B7/12 ,  B32B15/08 ,  B32B27/08 ,  B32B27/20 ,  B32B27/281 ,  B32B27/34 ,  B32B2307/206 ,  B32B2307/50 ,  B32B2307/51 ,  B32B2307/546 ,  B32B2307/734 ,  B32B2457/08 ,  H05K1/036 ,  H05K2201/0154 ,  H05K2201/068 ,  Y10T428/24942 ,  Y10T428/2495 ,  Y10T428/31678 ,  Y10T428/31681 ,  Y10T428/31721

    Abstract: An object of this invention is to provide a polyimide film suitable for use in flexible printed circuit boards and the like which have high flexibility and dimensional stability, and to provide a laminate and metal-clad laminate which uses such a polyimide film. This invention relates to a multilayer polyimide film being a polyimide film having a multilayer structure, including: a core layer; and clad layers provided on each side of the film, which clad layers are exposed, the core layer being a non-thermoplastic polyimide having an average coefficient of linear expansion at a temperature from 100° C. to 200° C. in a range of 5 ppm/° C. to 20 ppm/° C., each of the clad layers being a polyimide having a peeling strength of 3 N/cm or less, the film as a whole having an average coefficient of linear expansion at a temperature range of 100° C. to 200° C. in a range of 9 ppm/° C. to 30 ppm/° C., and (a)>(b), where (a) is an average modulus of elasticity of the core layer and (b) is an average modulus of elasticity of the clad layers.

    Abstract translation: 本发明的目的是提供一种适用于具有高柔性和尺寸稳定性的柔性印刷电路板等的聚酰亚胺膜，并且提供使用这种聚酰亚胺膜的层压体和覆金属层压板。 本发明涉及一种具有多层结构的聚酰亚胺膜的多层聚酰亚胺膜，包括：芯层; 在覆盖层露出的膜的两面上设置覆层，芯层是在100℃〜200℃的温度范围内具有平均线膨胀系数的非热塑性聚酰亚胺 5ppm /℃至20ppm /℃，每个包覆层是剥离强度为3N / cm以下的聚酰亚胺，该膜在整个温度范围内具有平均线性膨胀系数 （a）>（b），其中（a）是芯的平均弹性模量， 层和（b）是包层的平均弹性模量。

    DISPLAY DEVICE
    63.
    发明申请
    DISPLAY DEVICE 有权
    显示设备

    公开(公告)号：US20150077950A1

    公开(公告)日：2015-03-19

    申请号：US14482177

    申请日：2014-09-10

    Applicant: MITSUBISHI ELECTRIC CORPORATION

    Inventor： Tomohiro TASHIRO

    IPC: H05K1/02 ,  H05K1/03 ,  H05K5/00

    CPC classification number: H05K1/0281 ,  G02F1/13452 ,  G02F2001/133302 ,  H05K1/0271 ,  H05K1/0306 ,  H05K3/323 ,  H05K3/361 ,  H05K5/0017 ,  H05K2201/068 ,  H05K2201/09154

    Abstract: A display device includes: a glass substrate including a driver circuit and a plurality of connection terminals that is connected to the driver circuit and is arranged in array, and an elongated FPC, which has a plurality of panel connection terminals that correspond to the connection terminals and which is mounted on the glass substrate, wherein the FPC has a coverlay. The FPC has a chamfered-area end gap between an end portion of the coverlay facing an end face of the glass substrate and a chamfered-area end portion of the glass substrate in a mounted state, wherein the chamfered-area end gap is covered with an insulating resin, and wherein the chamfered-area end gap at a center portion of the FPC is narrower than the chamfered-area end gap at both end portions of the FPC.

    Abstract translation: 显示装置包括：玻璃基板，包括驱动电路和连接到驱动电路并且排列成阵列的多个连接端子，以及细长FPC，其具有与连接端子对应的多个面板连接端子 并且其安装在玻璃基板上，其中FPC具有覆盖层。 FPC在安装状态下在覆盖物的面向玻璃基板的端面的端部与玻璃基板的倒角区域端部之间具有倒角区域端部间隙，其中，倒角区域端部间隙被覆盖 绝缘树脂，并且其中FPC的中心部分处的倒角区域端部间隙比FPC的两个端部处的倒角区域端部间隙窄。

    Electric terminal device and method of connecting the same
    65.
    发明授权
    Electric terminal device and method of connecting the same 有权
    电气终端装置及其连接方法

    公开(公告)号：US08975756B2

    公开(公告)日：2015-03-10

    申请号：US11783932

    申请日：2007-04-13

    Applicant: Iwane Ichiyama

    Inventor： Iwane Ichiyama

    IPC: H01L23/48 ,  H05K3/36 ,  H05K1/11

    CPC classification number: H05K3/361 ,  H01L2924/0002 ,  H05K1/117 ,  H05K2201/068 ,  H05K2201/09781 ,  H05K2203/0278 ,  H05K2203/166 ,  H01L2924/00

    Abstract: An electric terminal device is provided with glass substrate 11, glass-substrate-side electric terminals 15 formed on glass substrate 11, tape carrier packages 16a and 16b which are larger in thermal expansion rate than glass substrate 11, and tape-side electric terminals 21 provided to correspond to glass-substrate-side electric terminals 15. Tape-side electric terminals 21 include alignment terminals 25 to align with terminals at the outer most edges of glass-substrate-side electric terminals 15, and connecting terminals 26 electrically and mechanically connected to glass-substrate-side electric terminals 15 due to thermal expansion of tape carrier packages 16a and 16b by thermo-compression bonding on a condition that alignment terminals 25 of tape-side electric terminals 21 are aligned with the terminals of glass-substrate-side electric terminals 15.

    Abstract translation: 电气端子装置设置有玻璃基板11，形成在玻璃基板11上的玻璃基板侧电端子15，热膨胀率比玻璃基板11大的带状载体封装16a，16b，以及带侧电气端子21 设置为对应于玻璃基板侧电端子15.带侧电端子21包括对准端子25，以与玻璃基板侧电端子15的最外边缘处的端子对准，并且连接端子26电和机械连接 由于带状侧电端子21的对准端子25与玻璃基板侧的端子对准的状态，通过热压接合，由于带载体包装体16a，16b的热膨胀而向玻璃基板侧电端子15 电气端子15。

    WIRING BOARD, MOUNTING STRUCTURE USING SAME, AND METHOD OF MANUFACTURING WIRING BOARD
    66.
    发明申请
    WIRING BOARD, MOUNTING STRUCTURE USING SAME, AND METHOD OF MANUFACTURING WIRING BOARD 有权
    接线板，使用其的安装结构以及制造接线板的方法

    公开(公告)号：US20150037611A1

    公开(公告)日：2015-02-05

    申请号：US14380207

    申请日：2013-02-20

    Applicant: KYOCERA Corporation

    Inventor： Tadashi Nagasawa ,  Katsura Hayashi

    IPC: H05K1/03 ,  H05K3/46

    CPC classification number: H05K1/036 ,  H05K3/3436 ,  H05K3/4602 ,  H05K3/4661 ,  H05K3/467 ,  H05K3/4673 ,  H05K2201/0175 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/0269 ,  H05K2201/068

    Abstract: A wiring board (3) according to an embodiment of the present invention includes an inorganic insulating layer (11A); a first resin layer (12A) on one main surface of the inorganic insulating layer (11A); a second resin layer (13A) on another main surface of the inorganic insulating layer (11A); and a conductive layer (8) partially on one main surface of the second resin layer (13A), the one main surface being on an opposite side to the inorganic insulating layer (11A). The inorganic insulating layer (11A) includes a plurality of first inorganic insulating particles (14) which are bound to each other at a part of each of the first inorganic insulating particles and gaps (G) surrounded by the plurality of first inorganic insulating particles (14). A part of the first resin layer (12A) and a part of the second resin layer (13A) are located inside the gaps (G).

    Abstract translation: 根据本发明实施例的布线板（3）包括无机绝缘层（11A）; 在无机绝缘层（11A）的一个主表面上的第一树脂层（12A）; 在无机绝缘层（11A）的另一个主表面上的第二树脂层（13A）; 以及部分地在所述第二树脂层（13A）的一个主表面上的导电层（8），所述一个主表面与所述无机绝缘层（11A）相反。 无机绝缘层（11A）包括多个第一无机绝缘粒子（14），它们在由多个第一无机绝缘粒子包围的第一无机绝缘粒子和间隙（G）的一部分彼此结合 14）。 第一树脂层（12A）的一部分和第二树脂层（13A）的一部分位于间隙（G）的内部。

    CORE OF PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
    67.
    发明申请
    CORE OF PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME 审中-公开
    印刷电路板的核心及其制造方法

    公开(公告)号：US20140357147A1

    公开(公告)日：2014-12-04

    申请号：US14068389

    申请日：2013-10-31

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Tae Hong MIN ,  Sang Hoon KIM ,  Hye Jin KIM

    IPC: H05K1/02 ,  H05K3/02 ,  H05K1/03

    CPC classification number: H05K1/0271 ,  H05K1/0306 ,  H05K1/038 ,  H05K3/022 ,  H05K3/4605 ,  H05K2201/0212 ,  H05K2201/0278 ,  H05K2201/029 ,  H05K2201/068 ,  H05K2201/09136 ,  H05K2203/1545 ,  Y10T428/249921 ,  Y10T442/2861 ,  Y10T442/2902

    Abstract: Disclosed herein is a core made of a glass material so as to be capable of preventing generation of warpage in a printed circuit board due to a difference in a coefficient of thermal expansion at the time of manufacturing the printed circuit board. The core includes: an organic cloth; and a glass having the organic cloth formed therein. The core is manufactured in a form in which rigidity thereof is increased by impregnating the organic cloth having a negative coefficient of thermal expansion is impregnated in a liquid-phase glass, thereby making it possible to effectively prevent generation of warpage in the printed circuit board due to the difference in a coefficient of thermal expansion.

    Abstract translation: 这里公开了一种由玻璃材料制成的芯体，以便能够防止由于印刷电路板制造时的热膨胀系数的差异而在印刷电路板中产生翘曲。 核心包括：有机布; 以及其中形成有机布的玻璃。 通过将具有负的热膨胀系数的有机布浸渍浸渍在液相玻璃中，使其硬度提高的形式制造芯，由此能够有效地防止由于印刷电路板产生翘曲 到热膨胀系数的差异。

    Wiring substrate and manufacturing method for wiring substrate
    68.
    发明授权
    Wiring substrate and manufacturing method for wiring substrate 有权
    布线基板的布线基板和制造方法

    公开(公告)号：US08878076B2

    公开(公告)日：2014-11-04

    申请号：US13629660

    申请日：2012-09-28

    Applicant: Fujitsu Limited

    Inventor： Hideaki Yoshimura

    IPC: H05K1/03 ,  H05K3/42 ,  H05K3/44 ,  H05K1/02

    CPC classification number: H05K1/0353 ,  H05K1/0271 ,  H05K3/427 ,  H05K3/445 ,  H05K2201/0323 ,  H05K2201/068 ,  H05K2201/0959 ,  Y10T29/49165

    Abstract: A wiring substrate includes: a plate-like base material containing carbon fibers; a wiring layer formed on a surface of the base material; a first via including a first through hole penetrating through the base material, a first resin layer formed on an inner wall of the first through hole and including a second through hole, and a first conductive layer formed on an inner wall of the second through hole; and a second via including a third through hole penetrating through the base material and a second conductive layer formed on an inner wall of the third through hole, wherein an inside diameter of the third through hole is greater than an inside diameter of the second through hole.

    Abstract translation: 布线基板包括：含有碳纤维的板状基材; 形成在所述基材的表面上的布线层; 包括穿过所述基材的第一通孔的第一通孔，形成在所述第一通孔的内壁上并包括第二通孔的第一树脂层，以及形成在所述第二通孔的内壁上的第一导电层 ; 以及第二通孔，其包括穿过所述基材的第三通孔和形成在所述第三通孔的内壁上的第二导电层，其中所述第三通孔的内径大于所述第二通孔的内径 。

    MULTILAYER CERAMIC SUBSTRATE AND ELECTRONIC COMPONENT USING SAME
    69.
    发明申请
    MULTILAYER CERAMIC SUBSTRATE AND ELECTRONIC COMPONENT USING SAME 审中-公开
    多层陶瓷基板和使用相同的电子元件

    公开(公告)号：US20140301053A1

    公开(公告)日：2014-10-09

    申请号：US14311766

    申请日：2014-06-23

    Applicant: MURATA MANUFACTURING CO., LTD.

    Inventor： Yuichi Iida ,  Satoru Adachi ,  Kazuo Kishida

    IPC: H05K1/03 ,  H05K1/02

    CPC classification number: H05K1/0306 ,  H01L23/15 ,  H01L23/49822 ,  H01L2224/16225 ,  H05K1/0298 ,  H05K1/113 ,  H05K3/4629 ,  H05K2201/068 ,  Y10T428/24942

    Abstract: A multilayer ceramic substrate including an inner-layer section, surface-layer sections stacked on opposed principal surfaces of the inner-layer section, and surface electrodes provided on at least one surface of the surface-layer sections. The surface-layer sections contain SiO2-MO—B2O3—Al2O3 based glass and an Al2O3 filler, wherein MO is at least one selected from the group consisting of CaO, MgO, SrO, and BaO. The coefficient of thermal expansion in the surface-layer sections is lower than the coefficient of thermal expansion in the inner-layer section, and the peak intensity ratio through an XRD analysis between MAl2Si2O8 and Al2O3 in the surface-layer sections falls within the range of 0.05≦(MAl2Si2O8/Al2O3)≦5, wherein M is at least one selected from the group consisting of Ca, Mg, Sr, and Ba.

    Abstract translation: 一种多层陶瓷基板，包括内层部分，堆叠在内层部分的相对主表面上的表面层部分和设置在表层部分的至少一个表面上的表面电极。 表层部分含有SiO 2 -MO-B 2 O 3 -Al 2 O 3基玻璃和Al 2 O 3填料，其中MO是选自CaO，MgO，SrO和BaO中的至少一种。 表层部的热膨胀系数低于内层部的热膨胀系数，表层部的MAl 2 Si 2 O 8与Al 2 O 3的XRD分析的峰强度比落在 0.05＆amp;（MAl2Si2O8 / Al2O3）＆nlE; 5，其中M是选自Ca，Mg，Sr和Ba中的至少一种。

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