公开(公告)号：US09107314B2

公开(公告)日：2015-08-11

申请号：US13799221

申请日：2013-03-13

Applicant: FUJITSU LIMITED

Inventor： Hideaki Yoshimura

IPC: H01K3/10 ,  H05K1/11 ,  H05K3/40 ,  H05K3/44 ,  H05K3/46 ,  G01R31/28 ,  H05K3/42

CPC classification number: H05K1/115 ,  G01R31/2889 ,  H05K1/0298 ,  H05K1/0366 ,  H05K3/4038 ,  H05K3/425 ,  H05K3/445 ,  H05K3/4608 ,  H05K2201/0323 ,  H05K2201/09545 ,  H05K2201/09554 ,  H05K2201/0959 ,  Y10T29/49165

Abstract: A method of manufacturing a wiring board includes: forming an outer through hole in a core substrate; filling the outer through hole with an insulation resin; forming a first conductive layer on a surface of the insulation resin at a portion where a core connecting via is formed; forming a land around the first conductive layer; laminating the wiring layer on the core substrate after the forming of the first conductive layer and the forming of the land; forming an inner through hole having a smaller diameter than that of the outer through hole and penetrating through the core substrate and the wiring layer so as to penetrate through the insulation resin; and coating a first conductive film on an inner wall surface of the inner through hole, in which the core substrate and the first conductive film are electrically connected through the first conductive layer and the land.

Abstract translation: 制造布线板的方法包括：在芯基板中形成外通孔; 用绝缘树脂填充外部通孔; 在形成芯连接通孔的部分上在绝缘树脂的表面上形成第一导电层; 形成围绕所述第一导电层的区域; 在形成第一导电层并形成焊盘之后，在芯基板上层叠布线层; 形成直径小于所述外通孔直径的内通孔，穿过所述芯基板和所述布线层以贯穿所述绝缘树脂; 并且在内部通孔的内壁表面上涂覆第一导电膜，其中芯基板和第一导电膜通过第一导电层和焊盘电连接。

公开(公告)号：US08878076B2

公开(公告)日：2014-11-04

申请号：US13629660

申请日：2012-09-28

Applicant: Fujitsu Limited

Inventor： Hideaki Yoshimura

IPC: H05K1/03 ,  H05K3/42 ,  H05K3/44 ,  H05K1/02

CPC classification number: H05K1/0353 ,  H05K1/0271 ,  H05K3/427 ,  H05K3/445 ,  H05K2201/0323 ,  H05K2201/068 ,  H05K2201/0959 ,  Y10T29/49165

Abstract: A wiring substrate includes: a plate-like base material containing carbon fibers; a wiring layer formed on a surface of the base material; a first via including a first through hole penetrating through the base material, a first resin layer formed on an inner wall of the first through hole and including a second through hole, and a first conductive layer formed on an inner wall of the second through hole; and a second via including a third through hole penetrating through the base material and a second conductive layer formed on an inner wall of the third through hole, wherein an inside diameter of the third through hole is greater than an inside diameter of the second through hole.

Abstract translation: 布线基板包括：含有碳纤维的板状基材; 形成在所述基材的表面上的布线层; 包括穿过所述基材的第一通孔的第一通孔，形成在所述第一通孔的内壁上并包括第二通孔的第一树脂层，以及形成在所述第二通孔的内壁上的第一导电层 ; 以及第二通孔，其包括穿过所述基材的第三通孔和形成在所述第三通孔的内壁上的第二导电层，其中所述第三通孔的内径大于所述第二通孔的内径 。