公开(公告)号：US20020104681A1

公开(公告)日：2002-08-08

申请号：US09779691

申请日：2001-02-07

Inventor： Masayuki Ishiwa ,  Kenji Iizuka ,  Takeshi Nishimura

IPC: H05K001/00

CPC classification number: H05K1/144 ,  H05K1/056 ,  H05K3/28 ,  H05K3/4641 ,  H05K2201/0367 ,  H05K2201/0382 ,  H05K2201/09054 ,  H05K2201/2036 ,  H05K2203/167

Abstract: A multilayer circuit board formed by integrally laminating a plurality of printed wiring boards in a multilayer structure so as to provide air gaps therebetween. An insulating layer is formed on each of both surfaces of a metal core substrate having through-hole forming apertures and a printed wiring layer is formed on the each insulating layer. Metal projections integrally formed on the metal core substrate serve as bonding electrodes between the adjacent wiring boards in the multilayer structure. The width of the air gap provided between the adjacent wiring boards is determined by the height of the metal projections.

Abstract translation: 一种多层电路板，其通过以多层结构整体层叠多个印刷电路板而形成，以便在它们之间提供气隙。 在具有通孔形成孔的金属芯基板的每个表面上形成绝缘层，并且在每个绝缘层上形成印刷布线层。 整体形成在金属芯基板上的金属突起在多层结构中用作相邻布线板之间的接合电极。 设置在相邻布线板之间的气隙的宽度由金属突起的高度确定。

公开(公告)号：US20010036065A1

公开(公告)日：2001-11-01

申请号：US09834710

申请日：2001-04-13

Applicant: Matsushita Electric Industrial Co., Ltd.

Inventor： Koichi Hirano ,  Seiichi Nakatani ,  Mitsuhiro Matsuo ,  Yoshihisa Yamashita

IPC: H05K007/02

CPC classification number: H05K7/205 ,  H01L23/3737 ,  H01L23/4334 ,  H01L23/49861 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/451 ,  H01L2224/48247 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/19041 ,  H05K1/0204 ,  H05K1/056 ,  H05K3/0061 ,  H05K3/202 ,  H05K3/4084 ,  H05K7/20463 ,  H05K2201/0209 ,  H05K2201/0382 ,  H05K2201/09054 ,  H05K2201/0969 ,  H05K2201/10416 ,  H05K2203/1189 ,  Y10T29/49121 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49158 ,  Y10T29/49171 ,  Y10T29/49172 ,  H01L2924/00 ,  H01L2224/05599

Abstract: A sheet-like thermally conductive resin composition containing 70 to 95 wt. % inorganic filler and 5 to 30 wt. % thermosetting resin composition, a lead frame as a wiring pattern, and an electrically conductive heat sink with a metal pole placed therein are superposed, heated and compressed, and thus are combined to form one body. Consequently, a thermally conductive circuit board with a flat surface is obtained in which a grounding pattern is grounded to the heat sink inside the insulating layer. Thus, the grounding pattern and the heat sink can be connected electrically with each other in an arbitrary position inside the insulating layer of the thermally conductive circuit board. Accordingly, there are provided a thermally conductive circuit board with high heat dissipation, high conductivity and high ground-connection reliability, a method of manufacturing the same, and a power module allowing its size to be reduced and its density to be increased.

Abstract translation: 一种片状导热性树脂组合物，其含有70〜95重量％ ％无机填料和5〜30wt。 热固性树脂组合物，作为布线图案的引线框架和放置有金属极的导电散热器叠加，加热和压缩，从而组合形成一体。 因此，获得了具有平坦表面的导热电路板，其中接地图被接地到绝缘层内的散热片。 因此，接地图案和散热器可以在导热电路板的绝缘层内的任意位置彼此电连接。 因此，提供了具有高散热，高导电性和高接地连接可靠性的导热电路板，其制造方法以及允许其尺寸减小并且其密度增加的功率模块。

公开(公告)号：US06297959B1

公开(公告)日：2001-10-02

申请号：US09437245

申请日：1999-11-10

Applicant: Hitoshi Ueno ,  Shigeru Yoshida

Inventor： Hitoshi Ueno ,  Shigeru Yoshida

IPC: H05K720

CPC classification number: H05K1/0204 ,  H01L23/3677 ,  H01L2924/0002 ,  H05K3/0061 ,  H05K2201/09054 ,  H05K2201/09745 ,  H05K2201/10416 ,  H05K2201/10689 ,  H01L2924/00

Abstract: A heating element (IC, transistor or the like) is placed on a printed circuit board and silicon grease is coated on the surface of the printed circuit board side of the heating element. The projection portion of a radiator with a step portion is inserted into the through hole of the printed circuit board and closely contacted with the lower portion of the heating element through the silicon grease. As a result, heat generated from the heating element is transferred to the projection portion of the radiator through the silicon grease and then transferred to the entirety of the radiator. Excessive silicon grease is collected in a step portion provided at the base of the projection portion of the radiator and prevented from leaking to other portion such as a portion on the board.

公开(公告)号：US06295200B1

公开(公告)日：2001-09-25

申请号：US09511227

申请日：2000-02-23

Applicant: Detlef Schmidt

Inventor： Detlef Schmidt

IPC: H05H720

CPC classification number: H01L21/4882 ,  H01L23/3677 ,  H01L2924/0002 ,  H05K1/0204 ,  H05K1/021 ,  H05K1/182 ,  H05K3/0061 ,  H05K2201/09054 ,  H05K2201/0969 ,  H05K2201/10416 ,  H01L2924/00

Abstract: A carrier assembly (10) for a circuit board includes a copper insert (12) pressed into an aluminum carrier (14). The copper insert has an undercut recess (36). As the insert (12) is pressed into the carrier (14), a portion of the carrier material is flowed into the undercut recess (36) to provide a firm interlocking of the insert (12) with the carrier (14).

Abstract translation: 用于电路板的载体组件（10）包括被压入铝载体（14）中的铜插入件（12）。 铜插件具有底切凹部（36）。 当插入件（12）被压入载体（14）中时，载体材料的一部分流入底切凹部（36），以提供插入件（12）与载体（14）的牢固互锁。

公开(公告)号：US06259603B1

公开(公告)日：2001-07-10

申请号：US09183223

申请日：1998-10-30

Applicant: Rupert Fackler ,  Thomas Laux

Inventor： Rupert Fackler ,  Thomas Laux

IPC: H05K720

CPC classification number: H05K7/20854 ,  H05K1/0204 ,  H05K1/141 ,  H05K3/0061 ,  H05K3/3442 ,  H05K3/368 ,  H05K2201/09054

Abstract: An electronic control unit, in particular for motor vehicles, having at least one electronic circuit arranged on at least one p.c. board and at least one additional circuit designed as a hybrid circuit which is attached to the at least one circuit arranged on the at least one p.c. board with an electrically conductive connection. A heat-conducting carrier element, which has mounting surfaces for attaching the at least one p.c. board and the at least one hybrid, is provided.

Abstract translation: 一种电子控制单元，特别是用于机动车辆的电子控制单元，具有至少一个电子电路，该电子电路布置在至少一个电感上。 板和至少一个设计成混合电路的附加电路，其连接到布置在至少一个电感上的至少一个电路。 电路板与导电连接。 导热载体元件，其具有用于附接至少一个直流电压的安装表面。 板和至少一个混合物。

公开(公告)号：US06219243B1

公开(公告)日：2001-04-17

申请号：US09461469

申请日：1999-12-14

Applicant: Qing Ma ,  Lise Varner ,  Harry Fujimoto

Inventor： Qing Ma ,  Lise Varner ,  Harry Fujimoto

IPC: H05K720

CPC classification number: H05K1/0204 ,  H01L23/36 ,  H01L23/3677 ,  H01L2224/32225 ,  H01L2924/15311 ,  H05K2201/09054 ,  H05K2201/10734

Abstract: An enhanced heat dissipation device for a chip-on-flex packaged unit includes a flex circuit material attached to a front side of an integrated circuit die. The flex circuit material further attached to a bottom side of a printed circuit board having an opening to expose the flex circuit material. A top heat spreader thermally coupled to the flex circuit material through the opening in the printed circuit to dissipate heat from the front side of the integrated circuit die. The device further includes a bottom heat spreader, that is thermally coupled to back side of the integrated circuit die, to dissipate heat from the back side of the integrated circuit die. This enables the heat dissipation device to dissipate heat from both the front side and back side of the integrated circuit die, and thereby enhancing the heat dissipation for a given unit surface are of the integrated circuit die without increasing the volume of the heat dissipation device.

Abstract translation: 用于芯片上的柔性封装单元的增强的散热装置包括附接到集成电路管芯的前侧的柔性电路材料。 柔性电路材料进一步附接到具有开口的印刷电路板的底侧以暴露柔性电路材料。 顶部散热器，其通过印刷电路中的开口热耦合到柔性电路材料，以从集成电路管芯的前侧消散热量。 该装置还包括热耦合到集成电路管芯的背侧的底部散热器，以从集成电路管芯的背面散发热量。 这使得散热装置能够从集成电路管芯的前侧和后侧散发热量，从而增加给定单元表面的散热是集成电路管芯而不增加散热装置的体积。

公开(公告)号：US5973923A

公开(公告)日：1999-10-26

申请号：US86365

申请日：1998-05-28

Applicant: Ionel Jitaru

Inventor： Ionel Jitaru

IPC: H01F27/06 ,  H05K1/02 ,  H05K1/05 ,  H05K1/16 ,  H05K7/20

CPC classification number: H05K1/165 ,  H01F27/06 ,  H05K1/0206 ,  H05K7/209 ,  H05K1/0203 ,  H05K1/05 ,  H05K2201/066 ,  H05K2201/086 ,  H05K2201/09054 ,  H05K2201/09063 ,  H05K2201/09572 ,  H05K2201/09745 ,  H05K2201/10166 ,  H05K3/0061 ,  Y10T29/49165

Abstract: A package for power converters in which a multilayers circuits board holds the components. The winding of the magnetic elements are incorporated in the multilayers circuit board. The top and some portion of the bottom layer are also support for electronic components. Some of the components are placed on the top layer, which may not be utilized for magnetic winding, reducing the footprint of the magnetic elements to the footprint of the magnetic core. The power dissipating devices placed on pads which have a multitude of copper coated via connecting the top to bottom layers. Through these via the heat is transferred from the power devices to the other side of the PCB. In some of the embodiment of this invention the heat can be further transferred to a metal plate connected to the multilayers circuit board via a thermally conductive insulator. The baseplate has cutouts or cavities to accommodate the magnetic cores. A thermally conductive is placed between the magnetic core and the metal plate on the bottom of the cavity.

Abstract translation: 用于电力转换器的封装，其中多层电路板保持部件。 磁性元件的绕组结合在多层电路板中。 底层的顶部和一部分也支持电子部件。 一些部件被放置在顶层上，其可能不用于磁性绕组，从而将磁性元件的占地面积减小到磁芯的占地面积。 功率耗散器件放置在焊盘上，通过连接顶层到底层，镀有多种铜。 通过这些通过热量从功率器件传递到PCB的另一侧。 在本发明的一些实施例中，可以通过导热绝缘体将热量进一步转移到连接到多层电路板的金属板上。 底板具有切口或空腔以容纳磁芯。 将导热材料放置在磁芯和空腔底部的金属板之间。

公开(公告)号：US5747876A

公开(公告)日：1998-05-05

申请号：US680614

申请日：1996-07-16

Applicant: Gourab Majumdar ,  Satoshi Mori ,  Sukehisa Noda ,  Tooru Iwagami ,  Yoshio Takagi ,  Hisashi Kawafuji

Inventor： Gourab Majumdar ,  Satoshi Mori ,  Sukehisa Noda ,  Tooru Iwagami ,  Yoshio Takagi ,  Hisashi Kawafuji

IPC: H01L23/28 ,  H01L23/24 ,  H01L23/36 ,  H01L23/433 ,  H01L23/495 ,  H01L25/07 ,  H01L25/16 ,  H01L25/18 ,  H05K1/02 ,  H01L23/22

CPC classification number: H05K1/0204 ,  H01L23/24 ,  H01L23/4334 ,  H01L23/49575 ,  H01L25/16 ,  H01L25/165 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/8547 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/13055 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/19107 ,  H05K2201/0382 ,  H05K2201/09054 ,  H05K2201/10689

Abstract: It is an object to facilitate assembly of an application device. A device (101) is provided with a heat sink (51) to radiate loss heat of an IGBT element (11) as a power semiconductor element to an external radiation fin. External terminals (5 and 6) connected to an external circuit substrate protrude in the direction in which the exposed surface of the heat sink (51) is directed. Accordingly, when assembling an application device by mounting the device (101) on the external circuit substrate together with other circuit elements, it is possible to mount the device (101) and other circuit elements together on the common main surface of the circuit substrate, i.e., on its main surface on the side opposite to the side where the radiation fin is attached. Accordingly, it is possible to collectively apply solder on the common main surface of the circuit substrate and collectively solder the device (101) and the other circuit elements.

Abstract translation: 其目的是便于组装应用装置。 设备（101）设置有散热器（51），以将作为功率半导体元件的IGBT元件（11）的损耗散热到外部散热片。 连接到外部电路基板的外部端子（5和6）沿着散热器（51）的暴露表面被引导的方向突出。 因此，当通过将装置（101）与其它电路元件一起安装在外部电路基板上来组装应用装置时，可以将装置（101）和其它电路元件安装在电路基板的公共主表面上， 即，在与辐射翅片附接的一侧相对的一侧的主表面上。 因此，可以在电路基板的公共主表面上共同地施加焊料，并且一起焊接器件（101）和其他电路元件。

公开(公告)号：US5353192A

公开(公告)日：1994-10-04

申请号：US14936

申请日：1993-02-08

Applicant: Ronald A. Nordin

Inventor： Ronald A. Nordin

IPC: H05K1/02 ,  H05K7/20

CPC classification number: H05K1/0204 ,  H05K2201/064 ,  H05K2201/09054 ,  H05K2201/10689

Abstract: A plug-in circuit card assembly for mounting high power electrical and optical components. The apparatus comprises a printed wiring circuit mounting high power electrical and optical components and connectors with conducting paths interconnecting the components and ones of the components with the connectors. The assembly has a structure attached to the printed wiring circuit with a heat sink formed at one end and having a pair of plates extending outward therefrom. One plate mounts a plurality of high thermal conducting pedestals each engaging corresponding ones of the components. Vent tubes are positioned between the plates with each vent tube having one end engaging one of the pedestals and an opposite end engaging the heat sink and functions to conduct heat from the components to the heat sink for dissipation.

Abstract translation: 用于安装大功率电气和光学部件的插入式电路卡组件。 该装置包括印刷布线电路，其安装大功率电气和光学部件以及具有将部件和部件与连接器互连的导电路径的连接器。 组件具有附接到印刷布线电路的结构，其中散热器在一端形成并且具有从其向外延伸的一对板。 一个板安装多个高导热基座，每个高导热基座接合相应的部件。 排气管定位在板之间，每个排气管具有接合一个基座的一端和与散热器接合的相对端，并且用于将热量从组件传导到散热器以进行散热。

公开(公告)号：US5123074A

公开(公告)日：1992-06-16

申请号：US432727

申请日：1989-10-26

Applicant: Takashi Yokota ,  Eiji Kikuchi ,  Shoichi Miura ,  Hirosuke Furuta ,  Masayuki Shiga

Inventor： Takashi Yokota ,  Eiji Kikuchi ,  Shoichi Miura ,  Hirosuke Furuta ,  Masayuki Shiga

IPC: G02B6/42 ,  H01L25/16 ,  H05K1/02

CPC classification number: H05K1/0204 ,  G02B6/42 ,  H01L25/167 ,  H05K1/0274 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2924/19105 ,  H05K2201/09054 ,  H05K2201/10416

Abstract: A substrate for mounting optical components and electric circuit components thereon, comprising an insulating substrate on which an electric circuit is to be formed and a metallic portion on which optical components are to be fixed by welding. This construction may be reversed; that is, an insulated layer on which an electric circuit is to be formed may be provided on a metallic board on which optical components are to be fixed by welding. A device constituted using this substrate permits improvement of the frequency band characteristic and a long-term stabilization of optical coupling efficiency.

Abstract translation: PCT No.PCT / JP89 / 00176 Sec。 371日期1989年10月26日第 102（e）日期1989年10月26日PCT提交1989年2月22日PCT公布。 公开号WO89 / 08374 日期：1989年9月8日。一种用于在其上安装光学部件和电路部件的基板，包括要在其上形成电路的绝缘基板和通过焊接固定光学部件的金属部分。 这种结构可能会相反; 也就是说，要在其上形成电路的绝缘层可以设置在通过焊接固定光学部件的金属板上。 使用该衬底构成的器件允许提高频带特性和光耦合效率的长期稳定性。