-
公开(公告)号：US08754332B2
公开(公告)日：2014-06-17
申请号：US13058268
申请日：2009-08-03
Applicant: Yukihiro Sumida , Takeshi Muraoka
Inventor： Yukihiro Sumida , Takeshi Muraoka
IPC: H05K1/00
CPC classification number: H05K3/361 , G02F1/13452 , H05K1/0266 , H05K1/0269 , H05K1/117 , H05K3/323 , H05K2201/09381 , H05K2201/09663 , H05K2201/09727 , H05K2201/0979 , H05K2201/09936
Abstract: Provided is a flexible substrate wherein a connection portion between the flexible substrate and an electric circuit board meets requirements of narrow wiring pitch and low resistance at the connection portion. An electric circuit structure, which has the flexible substrate and the electric circuit board to which the flexible substrate is connected, is also provided. A wiring pattern (22) is formed on a flexible base film (21), a connection terminal (25) connected electrically to an electrode terminal of another electric circuit board is arranged at an end portion of the wiring pattern (22), and the connection terminal (25) includes wide connection terminals (25b, 25c) having a terminal width extending across plural lines of the wiring pattern (22).
Abstract translation: 提供了柔性基板，其中柔性基板和电路板之间的连接部分满足连接部分处的窄布线间距和低电阻的要求。 还提供了具有柔性基板和连接柔性基板的电路板的电路结构。 布线图案（22）形成在柔性基膜（21）上，与布线图案（22）的端部配置有与电极基板的电极端子电连接的连接端子（25） 连接端子（25）包括具有延伸穿过布线图案（22）的多条线的端子宽度的宽连接端子（25b，25c）。
-
公开(公告)号：US20140160708A1
公开(公告)日：2014-06-12
申请号：US14103850
申请日：2013-12-12
Applicant: Kuan-Yu Chu , Chen-Fu Huang , Chiu-Mei Liu , Ming-Wu Chen , Chin-Pei Hwang , Chun-Cheng Huang , Yu-Ching Wang , Chung-Hsien Li , Kuo-Hsing Chen , Yu-Ting Chen , Chen-Hao Su
Inventor： Kuan-Yu Chu , Chen-Fu Huang , Chiu-Mei Liu , Ming-Wu Chen , Chin-Pei Hwang , Chun-Cheng Huang , Yu-Ching Wang , Chung-Hsien Li , Kuo-Hsing Chen , Yu-Ting Chen , Chen-Hao Su
IPC: H02H9/02
CPC classification number: H02H9/02 , G06F3/0416 , G06F3/044 , G06F2203/04107 , H01L23/49838 , H01L2924/0002 , H05K1/0259 , H05K1/117 , H05K2201/0108 , H05K2201/0326 , H05K2201/0338 , H05K2201/09354 , H05K2201/09727 , H01L2924/00
Abstract: A lead structure disposed on a substrate is provided. The substrate includes a display area disposed with a device and a peripheral area disposed with a lead structure including first pads, a second pad, first traces and a second trace. The first traces are connected to the device. Each first trace has a first linear portion and a first bonding portion connected together. Each first trace is electrically connected to one of the first pads through the first bonding portion. The second trace has a second linear portion and a second bonding portion connected together. The second trace is electrically connected to the second pad through the second bonding portion. A width of the first linear portion is smaller than a width of the first bonding portion, and a width of the second linear portion is smaller than a width of the second bonding portion.
Abstract translation: 设置在基板上的引线结构。 衬底包括布置有器件的显示区域和设置有包括第一焊盘，第二焊盘，第一迹线和第二迹线的引线结构的周边区域。 第一条迹线连接到设备。 每个第一迹线具有连接在一起的第一直线部分和第一接合部分。 每个第一迹线通过第一接合部分电连接到第一焊盘之一。 第二迹线具有连接在一起的第二直线部分和第二接合部分。 第二迹线通过第二接合部电连接到第二焊盘。 第一直线部分的宽度小于第一接合部分的宽度，并且第二直线部分的宽度小于第二接合部分的宽度。
-
公开(公告)号：US20140077902A1
公开(公告)日：2014-03-20
申请号：US14087004
申请日：2013-11-22
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Noburo KATO
IPC: H01P3/08
CPC classification number: H01P3/003 , H01P1/20363 , H01P3/08 , H01P3/085 , H03H7/38 , H05K1/0221 , H05K1/0225 , H05K1/0242 , H05K1/0253 , H05K1/028 , H05K2201/09618 , H05K2201/0969 , H05K2201/09727
Abstract: A flexible high-frequency signal transmission line includes a dielectric body including laminated flexible dielectric layers. A signal line is provided in the dielectric body. A grounding conductor is arranged in the dielectric body to be opposed to the signal line via one of the dielectric layers. The grounding conductor is of a ladder structure including a plurality of openings and a plurality of bridges arranged alternately along the signal line. A characteristic impedance of the signal line changes between two adjacent ones of the plurality of bridges such that the characteristic impedance of the signal line rises from a minimum value to an intermediate value and to a maximum value and falls from the maximum value to the intermediate value and to the minimum value in this order.
Abstract translation: 柔性高频信号传输线包括电介质体，其包括层叠的柔性电介质层。 信号线设置在电介质体中。 接地导体布置在电介质体中，以经由一个电介质层与信号线相对。 接地导体是梯形结构，包括沿着信号线交替布置的多个开口和多个桥。 信号线的特征阻抗在多个桥中的两个相邻桥之间变化，使得信号线的特性阻抗从最小值上升到中间值，并从最大值下降到中间值 并以此顺序达到最小值。
-
公开(公告)号：US20140071646A1
公开(公告)日：2014-03-13
申请号：US13610663
申请日：2012-09-11
Applicant: Zhiguo Qian , Kemal Aygun
Inventor： Zhiguo Qian , Kemal Aygun
CPC classification number: H05K1/0228 , H05K1/0219 , H05K1/0243 , H05K1/113 , H05K3/4644 , H05K2201/09336 , H05K2201/09672 , H05K2201/09709 , H05K2201/09727 , Y10T29/49155
Abstract: Certain embodiments relate to routing structures and their formation. In one embodiment a routing structure includes a first region including a first layer comprising alternating signal traces and ground traces separated by a dielectric. The first region also includes a second layer including alternating signal traces and ground traces separated by a dielectric, wherein the second layer signal positioned over the first layer ground traces, and the second layer ground traces positioned over the first layer signal traces. The first region may also include additional layers of alternating signal and ground traces. The first region may also be formed with the ground traces having a width that is larger than that of the signal traces. The routing structure may also include a second region including pads to which the traces are coupled. Other embodiments are described and claimed.
Abstract translation: 某些实施例涉及路由结构及其形成。 在一个实施例中，路由结构包括包括第一层的第一区域，第一层包括交替的信号迹线和由电介质隔开的接地迹线。 第一区域还包括第二层，其包括由电介质隔开的交替信号迹线和接地迹线，其中位于第一层接地迹线上方的第二层信号，以及位于第一层信号迹线上的第二层接地迹线。 第一区域还可以包括交替信号和接地迹线的附加层。 第一区域也可以形成有具有大于信号迹线的宽度的接地迹线。 路由结构还可以包括包括跟踪耦合到其上的焊盘的第二区域。 描述和要求保护其他实施例。
-
公开(公告)号：US08664806B2
公开(公告)日：2014-03-04
申请号：US11473243
申请日：2006-06-23
Applicant: Jean Pierre Conil , Victor Cruchet , Louis Linares
Inventor： Jean Pierre Conil , Victor Cruchet , Louis Linares
IPC: G06F13/00
CPC classification number: H05K1/0265 , H05K2201/0352 , H05K2201/09236 , H05K2201/09254 , H05K2201/09727
Abstract: Communication bus having at least one pair of communication lines designed to be connected in series respectively to conductors of a main communication bus designed to be connected to communicating devices of at least one electric panel. Said communication bus comprises at least two branched outputs each having at least two branch lines, said branch lines respectively having a first end connected to a communication line and having a second end designed for connection of the communicating devices. The communication lines are etched on a first conducting layer of a printed circuit, and the branch lines are etched on a second conducting layer of said printed circuit. The communication lines are separated from one another by a distance.
Abstract translation: 通信总线具有至少一对通信线路，其被设计成分别串联连接到设计成连接到至少一个电子面板的通信设备的主通信总线的导体。 所述通信总线包括至少两个分支输出，每个分支输出具有至少两个分支线，所述分支线分别具有连接到通信线路的第一端并且具有设计用于连接通信设备的第二端。 通信线被蚀刻在印刷电路的第一导电层上，并且在所述印刷电路的第二导电层上蚀刻分支线。 通信线路彼此分开一段距离。
-
Patent Agency Ranking
公开(公告)号：US08659906B2
公开(公告)日：2014-02-25
申请号：US13442801
申请日：2012-04-09
Applicant: Stephen R. McClure , Joshua D. Banko , John P. Ternus
Inventor： Stephen R. McClure , Joshua D. Banko , John P. Ternus
IPC: H05K1/00
CPC classification number: G06F1/1613 , G06F1/1626 , G06F1/1643 , G06F1/1656 , H04M1/0252 , H04M1/0266 , H04M1/0277 , H05K1/0281 , H05K1/118 , H05K1/147 , H05K2201/09727 , Y10T29/49124 , Y10T29/49126 , Y10T29/49128 , Y10T29/49135 , Y10T29/4914 , Y10T29/49155 , Y10T29/49169
Abstract: A methodology for connecting device components with circuitry located at different levels and orientations relative to one another is described. First circuitry can be located on a multi-plane rigid circuit board where the multi-plane rigid circuit board can include at least one flexible member sharing a common substrate with the multi-plane rigid circuit board that extends from a body portion of the multi-plane rigid circuit board. The flexible member can include traces used to convey power and/or data and an interface coupled to the power and/or data traces. The flexible member can be deflected or twisted to connect first circuitry on the body portion of the multi-plane rigid circuit board to second circuitry associated with another device component.
Abstract translation: 描述了一种用于将设备组件与相对于彼此在不同级别和取向上的电路连接的方法。 第一电路可以位于多平面刚性电路板上，其中多平面刚性电路板可以包括至少一个与多平面刚性电路板共用公共衬底的柔性构件，该多平面刚性电路板从多层刚性电路板的主体部分延伸， 平面刚性电路板。 柔性构件可以包括用于传递功率和/或数据的迹线以及耦合到功率和/或数据迹线的接口。 柔性构件可以被偏转或扭曲以将多平面刚性电路板的主体部分上的第一电路连接到与另一个装置部件相关联的第二电路。
-
公开(公告)号：US08659370B2
公开(公告)日：2014-02-25
申请号：US13945947
申请日：2013-07-19
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Noboru Kato , Shigeru Tago , Jun Sasaki , Junichi Kurita , Satoshi Sasaki
IPC: H03H7/38
CPC classification number: H01P3/085 , H01L2224/16225 , H01L2924/19105 , H01P1/20363 , H01P3/003 , H01P3/026 , H01P3/08 , H01P3/10 , H01P3/121 , H03H7/38 , H04B15/00 , H05K1/0219 , H05K1/0225 , H05K1/0242 , H05K1/025 , H05K1/0253 , H05K1/028 , H05K1/0393 , H05K1/113 , H05K2201/09618 , H05K2201/0969 , H05K2201/09727
Abstract: An easily bendable high-frequency signal transmission line includes a dielectric body including a protection layer and dielectric sheets laminated on each other, a surface and an undersurface. A signal line is a linear conductor disposed in the dielectric body. A ground conductor is disposed in the dielectric body, faces the signal line via the dielectric sheet, and continuously extends along the signal line. A ground conductor is disposed in the dielectric body, faces the ground conductor via the signal line sandwiched therebetween, and includes a plurality of openings arranged along the signal line. The surface of the dielectric body on the side of the ground conductor with respect to the signal line is in contact with a battery pack.
Abstract translation: 容易弯曲的高频信号传输线包括电介质体，其包括彼此层叠的保护层和电介质片，表面和下表面。 信号线是布置在电介质体中的线状导体。 接地导体设置在电介质体中，经由电介质片面对信号线，并沿信号线连续延伸。 接地导体设置在电介质体中，经由夹在其间的信号线面对接地导体，并且包括沿信号线布置的多个开口。 接地导体相对于信号线一侧的电介质体的表面与电池组接触。
-
公开(公告)号：US08653910B2
公开(公告)日：2014-02-18
申请号：US13945950
申请日：2013-07-19
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Noboru Kato , Shigeru Tago , Jun Sasaki , Junichi Kurita , Satoshi Sasaki
IPC: H03H7/38
CPC classification number: H01P3/085 , H01L2224/16225 , H01L2924/19105 , H01P1/20363 , H01P3/003 , H01P3/026 , H01P3/08 , H01P3/10 , H01P3/121 , H03H7/38 , H04B15/00 , H05K1/0219 , H05K1/0225 , H05K1/0242 , H05K1/025 , H05K1/0253 , H05K1/028 , H05K1/0393 , H05K1/113 , H05K2201/09618 , H05K2201/0969 , H05K2201/09727
Abstract: An easily bendable high-frequency signal transmission line includes a dielectric body including a protection layer and dielectric sheets laminated on each other, a surface and an undersurface. A signal line is a linear conductor disposed in the dielectric body. A ground conductor is disposed in the dielectric body, faces the signal line via the dielectric sheet, and continuously extends along the signal line. A ground conductor is disposed in the dielectric body, faces the ground conductor via the signal line sandwiched therebetween, and includes a plurality of openings arranged along the signal line. The surface of the dielectric body on the side of the ground conductor with respect to the signal line is in contact with a battery pack.
-
公开(公告)号：US20130306362A1
公开(公告)日：2013-11-21
申请号：US13730874
申请日：2012-12-29
Inventor： FENG ZHANG
IPC: H05K1/03
CPC classification number: H05K1/03 , H05K1/024 , H05K3/3452 , H05K2201/0191 , H05K2201/09727 , H05K2201/09972
Abstract: A printed circuit board includes a line intensive distribution area, a line sparse distribution area, a solder mask layer, and a signal layer. A first signal line is laid on the signal layer. The first signal line crosses the line intensive distribution area and the line sparse distribution area. The first signal line is narrower in the line intensive distribution area than in the line sparse distribution area. The solder mask layer is thicker in the line intensive distribution area than in the line sparse distribution area.
Abstract translation: 印刷电路板包括线密集分布区域，线稀疏分布区域，焊接掩模层和信号层。 第一信号线被放置在信号层上。 第一条信号线穿过线密集分布区和线稀疏分布区。 第一条信号线在线密集分布区域比线稀疏分布区域窄。 在线密集分布区域中的焊料掩模层比线稀疏分布区域更厚。
-
公开(公告)号：US20130300515A1
公开(公告)日：2013-11-14
申请号：US13945947
申请日：2013-07-19
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Noboru KATO , Shigeru TAGO , Jun SASAKI , Junichi KURITA , Satoshi SASAKI
IPC: H03H7/38
CPC classification number: H01P3/085 , H01L2224/16225 , H01L2924/19105 , H01P1/20363 , H01P3/003 , H01P3/026 , H01P3/08 , H01P3/10 , H01P3/121 , H03H7/38 , H04B15/00 , H05K1/0219 , H05K1/0225 , H05K1/0242 , H05K1/025 , H05K1/0253 , H05K1/028 , H05K1/0393 , H05K1/113 , H05K2201/09618 , H05K2201/0969 , H05K2201/09727
Abstract: An easily bendable high-frequency signal transmission line includes a dielectric body including a protection layer and dielectric sheets laminated on each other, a surface and an undersurface. A signal line is a linear conductor disposed in the dielectric body. A ground conductor is disposed in the dielectric body, faces the signal line via the dielectric sheet, and continuously extends along the signal line. A ground conductor is disposed in the dielectric body, faces the ground conductor via the signal line sandwiched therebetween, and includes a plurality of openings arranged along the signal line. The surface of the dielectric body on the side of the ground conductor with respect to the signal line is in contact with a battery pack.
-
-
-
-
-
-
-
-
-
Search Results
1095
records
(took 0.027 seconds)
