公开(公告)号：US08542512B2

公开(公告)日：2013-09-24

申请号：US13244155

申请日：2011-09-23

Applicant: Paul Garrity

Inventor： Paul Garrity

IPC: H02M7/537 ,  H05K9/00

CPC classification number: H02M3/338 ,  H02J3/383 ,  H02M2001/007 ,  H02S40/32 ,  H05K3/284 ,  H05K2201/10166 ,  H05K2201/10371 ,  H05K2203/1316 ,  Y02E10/563 ,  Y10T29/4913

Abstract: The invention relates to improved techniques for manufacturing power conditioning units (inverters) for use with photovoltaic (PV) modules, and to inverters manufactured by these techniques. We describe a solar photovoltaic inverter, comprising: a power conditioning circuit mounted on a circuit board, the power conditioning circuit having a dc power input to receive dc power from one or more photovoltaic panels and an ac power output to deliver ac power to an ac mains power supply; an electrically conductive shield enclosing said circuit board; and a plastic overmould over said conductive shield and said circuit board; wherein said electrically conductive shield has one or more holes to allow said plastic overmould to extend through said shield to cover said circuit board.

Abstract translation: 本发明涉及用于制造用于光伏（PV）模块的功率调节单元（逆变器）的改进技术以及由这些技术制造的逆变器。 我们描述了一种太阳能光伏逆变器，包括：安装在电路板上的功率调节电路，功率调节电路具有直流电源输入以从一个或多个光伏面板接收直流电力和交流功率输出，以将交流电输送到交流 主电源; 封闭所述电路板的导电屏蔽; 以及在所述导电屏蔽和所述电路板上的塑料超模; 其中所述导电屏蔽具有一个或多个孔，以允许所述塑料覆盖模制延伸穿过所述屏蔽以覆盖所述电路板。

公开(公告)号：US08522426B2

公开(公告)日：2013-09-03

申请号：US12794735

申请日：2010-06-05

Applicant: Robert H. Dennis ,  Amanda Loehr ,  Robert E. Morris ,  Peter D. Patalano ,  Aaron J. Stein ,  John Stephens ,  Harold L. Wieck ,  Eli Holzman

Inventor： Robert H. Dennis ,  Amanda Loehr ,  Robert E. Morris ,  Peter D. Patalano ,  Aaron J. Stein ,  John Stephens ,  Harold L. Wieck ,  Eli Holzman

IPC: H05K3/34 ,  H05K3/20 ,  H05K3/30 ,  H05K3/00 ,  H01R9/00 ,  H01K3/10 ,  B29C65/00 ,  B32B37/00 ,  G05G15/00

CPC classification number: H05K3/3436 ,  H05K1/141 ,  H05K2201/10371 ,  H05K2201/10378 ,  Y02P70/613 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49149 ,  Y10T29/49165

Abstract: A vented BGA package is reconfigured by first applying a continuous bead of adhesive around the perimeter of the package to seal the gap between the lid and substrate. The continuous bead defines a channel through the pressure relief vents to a polarity through-hole in the lid. The BGA package is reflow soldered to a PWB at an elevated temperature using solder flux, clean or no-clean. The IC die achieves elevated temperature pressure relief through the pressure relief vents along the channel and out the polarity through-hole. After reflow a seal is applied to plug the polarity through-hole. The PWB is washed in an aqueous cleaner solution to remove flux residue. The continuous bead of adhesive and the seal form a cleaner solution barrier that prevents the solution from contacting conductors inside the package. The seal may be removed or left intact depending on the operating environment.

Abstract translation: 通过首先在包装的周边施加连续的粘合剂珠以密封盖和基底之间的间隙来重新配置通气的BGA封装。 连续的胎圈限定通过压力释放通道的通道到盖子中的极性通孔。 BGA封装使用焊剂，清洁或不干净，在高温下回流焊接到PWB。 IC芯片通过沿通道的压力释放口和极性通孔实现升高的温度压力释放。 在回流焊后，应用密封来堵塞极性通孔。 将PWB在含水清洁剂溶液中洗涤以除去助熔剂残留物。 粘合剂和密封件的连续珠形成更清洁的溶液屏障，防止溶液接触包装内的导体。 根据操作环境，密封可以被移除或保持完好。

公开(公告)号：US20130148318A1

公开(公告)日：2013-06-13

申请号：US13473907

申请日：2012-05-17

Applicant: SUN-KI KIM

Inventor： SUN-KI KIM

IPC: H05K7/14

CPC classification number: H05K9/0035 ,  H05K3/341 ,  H05K7/12 ,  H05K7/14 ,  H05K7/1405 ,  H05K7/1417 ,  H05K9/00 ,  H05K9/0009 ,  H05K9/0024 ,  H05K9/0032 ,  H05K2201/10371 ,  H05K2201/10962

Abstract: A clip terminal soldered to and mounted on a circuit board, includes a connection part bent at an angle corresponding to that of a corner of a case and at least a pair of clips connected to each other by the connection part. The connection part and the clips are integrated with each other. The connection part has a width less than or equal to that of a solder pattern of the circuit board on which the clip terminal is soldered. A lower end of the corner of a sidewall of the case is fitted into the clips.

Abstract translation: 焊接并安装在电路板上的夹子端子包括以与壳体的角部相对应的角度弯曲的连接部和通过连接部彼此连接的至少一对夹子。 连接部分和夹子彼此集成。 连接部分具有小于或等于焊接夹子端子的电路板的焊料图案的宽度的宽度。 壳体侧壁角落的下端装入夹子中。

公开(公告)号：US20130135832A1

公开(公告)日：2013-05-30

申请号：US13643785

申请日：2011-04-19

Applicant: Jörg Stritzelberger ,  Fritz Frey

Inventor： Jörg Stritzelberger ,  Fritz Frey

IPC: H05K5/02

CPC classification number: H05K5/02 ,  H02B1/28 ,  H05K1/182 ,  H05K2201/10371 ,  H05K2201/10409

Abstract: An explosion protected circuit board assembly that includes a circuit board having a carrier plate with conductive strips and at least one electrical component thereon. The circuit board assembly includes a housing part that defines a hollow space encasing the electronic component in intrinsically safe fashion while preventing flame transmission from the electrical component to the outside environment. In an alternative embodiment, housing parts defining hollow electrical component receiving spaces are mounted on opposite sides of the circuit board, with the components being electrically interconnected.

Abstract translation: 一种防爆电路板组件，其包括电路板，该电路板具有带导电条的载体板和至少一个电气部件。 电路板组件包括壳体部件，其以本质安全的方式限定封装电子部件的中空空间，同时防止火焰从电气部件传递到外部环境。 在替代实施例中，限定中空电气部件容纳空间的壳体部件安装在电路板的相对侧上，其中部件是电互连的。

公开(公告)号：US08434670B2

公开(公告)日：2013-05-07

申请号：US12485642

申请日：2009-06-16

Applicant: Toru Okada ,  Satoshi Emoto

Inventor： Toru Okada ,  Satoshi Emoto

IPC: B23K3/00 ,  B23K3/04 ,  B23K1/00 ,  B23K1/018

CPC classification number: H05K3/3494 ,  B23K1/012 ,  B23K3/04 ,  H05K3/225 ,  H05K2201/10371 ,  H05K2203/081

Abstract: A repair apparatus includes a heating head device configured to heat a soldering member, which is soldered to a circuit board. The heating head device includes a heating head and a contact member heated by the heating head. The contact member is formed of a material having a spring characteristic and a thermal conductivity higher than a thermal conductivity of the heating head. The contact member is configured to be brought into contact with a soldered surface of the soldering member with an elastic force so as to melt a solder joining the soldering member to the circuit board.

Abstract translation: 修理装置包括加热头装置，其被配置为加热焊接到电路板的焊接部件。 加热头装置包括加热头和由加热头加热的接触构件。 接触构件由具有比加热头的热导率高的弹簧特性和导热性的材料形成。 接触构件被配置成以弹性力与焊接构件的焊接表面接触，以便熔化将焊接构件接合到电路板的焊料。

公开(公告)号：US20130107475A1

公开(公告)日：2013-05-02

申请号：US13309706

申请日：2011-12-02

Applicant: MING-CHUN HSIEH ,  CHANG-SHIUN YANG ,  CHUN-WEI WU ,  HE-LONG WU ,  REN-CHING HUA ,  CHUN-YING HUANG

Inventor： MING-CHUN HSIEH ,  CHANG-SHIUN YANG ,  CHUN-WEI WU ,  HE-LONG WU ,  REN-CHING HUA ,  CHUN-YING HUANG

IPC: H05K1/14

CPC classification number: H05K1/144 ,  H05K1/0254 ,  H05K3/0061 ,  H05K9/0022 ,  H05K2201/0999 ,  H05K2201/10371

Abstract: A FCB stack assembly includes a PCB, a shield can, and a FCB. The shield can is fixed on the PCB for receiving and shielding electronic components on the PCB. The FCB is fixed onto and directly supported by the shield can.

Abstract translation: FCB堆叠组件包括PCB，屏蔽罐和FCB。 屏蔽罐固定在PCB上，用于接收和屏蔽PCB上的电子元件。 FCB固定在屏蔽罐上并直接由屏蔽罐支撑。

公开(公告)号：US08422234B2

公开(公告)日：2013-04-16

申请号：US13056833

申请日：2009-06-19

Applicant: Jacques Goriaux ,  Alain Bironneau ,  Jean-Pierre Mauclerc

Inventor： Jacques Goriaux ,  Alain Bironneau ,  Jean-Pierre Mauclerc

IPC: H05K7/20

CPC classification number: H05K7/205 ,  H05K1/0204 ,  H05K9/0032 ,  H05K2201/10371 ,  H05K2201/10416 ,  H05K2201/10545

Abstract: A device is provided for electromagnetic shielding an electronic component and for dissipating heat generated by the component. The component includes a package designed to be fastened to a first face of a printed circuit, called a rear face, by a heat sink, the heat sink passing through the rear face of the printed circuit and emerging on a second face of the printed circuit, called a front face. The device includes a metal structure mounted on the front face of the printed circuit and defining an electromagnetic shielding enclosure. The metal structure having a first heat discharge opening lying approximately opposite the heat sink. The device further includes at least one thermal connector, a first end of which is fastened to the metal structure and a second end of which is fastened to the heat sink and/or to the front face of the printed circuit near the heat sink.

Abstract translation: 提供了用于电磁屏蔽电子部件并且用于耗散由部件产生的热量的装置。 该组件包括被设计成通过散热器紧固到印刷电路的第一面（称为后表面）的封装，散热片穿过印刷电路的背面并出现在印刷电路的第二面上 称为前脸。 该装置包括安装在印刷电路的正面上并限定电磁屏蔽外壳的金属结构。 金属结构具有大致相对于散热器的第一散热开口。 该装置还包括至少一个热连接器，其第一端紧固到金属结构，并且其第二端紧固到散热器附近的散热器和/或印刷电路的正面。

公开(公告)号：US20130089992A1

公开(公告)日：2013-04-11

申请号：US13419715

申请日：2012-03-14

Applicant: Hyun Mo YANG

Inventor： Hyun Mo YANG

IPC: H05K1/11

CPC classification number: H05K1/144 ,  H05K1/0218 ,  H05K1/141 ,  H05K9/0032 ,  H05K9/0035 ,  H05K2201/042 ,  H05K2201/0715 ,  H05K2201/1031 ,  H05K2201/10371 ,  Y02P70/611

Abstract: A structure for stacking Printed Board Assemblies (PBAs) in an electronic device is provided. The structure for stacking PBAs in an electronic device includes a clip mounted on a main Printed Circuit Board (PCB), a sub-PCB including a ground portion, a sub-PBA including the sub-PCB, and a clip header mounted on a lower part of the sub-PBA, wherein the clip header is inserted into the clip. Therefore, electronic components mounted on a main PCB can be shielded from outer electromagnetic waves while reducing material costs without using a shield can, and a sub-PBA can be stacked on the main PBA.

Abstract translation: 提供了一种用于在电子设备中堆叠印刷电路板组件（PBA）的结构。 用于在电子设备中堆叠PBA的结构包括安装在主印刷电路板（PCB）上的夹子，包括接地部分的子PCB，包括子PCB的子PBA和安装在下部PCB上的夹头 子片段的一部分，其中剪辑头部插入到剪辑中。 因此，安装在主PCB上的电子部件可以屏蔽外部电磁波，同时在不使用屏蔽壳的同时降低材料成本，并且可以在主PBA上堆叠副PBA。

公开(公告)号：US08415788B2

公开(公告)日：2013-04-09

申请号：US12860811

申请日：2010-08-20

Applicant: Ming Li ,  Donald R. Mullen

Inventor： Ming Li ,  Donald R. Mullen

IPC: H05K7/20

CPC classification number: H01L23/3677 ,  H01L23/4093 ,  H01L23/427 ,  H01L25/0652 ,  H01L2224/16225 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/15321 ,  H05K1/0206 ,  H05K1/141 ,  H05K2201/066 ,  H05K2201/10371 ,  H05K2203/1572 ,  H01L2224/0401

Abstract: A system includes a circuit board, a multi-die package, and a heat dissipator. The circuit board has substantially planar opposing first and second sides. The multi-die package includes a substrate and a first set of one or more semiconductor devices on a first substrate side and a second set of one or more semiconductor devices on a second substrate side. The multi-die package is located at the first circuit board side. The heat dissipator is located at the second circuit board side, and thermally coupled to the second set of semiconductor devices. One or more portions of the circuit board are removed between the first circuit board side and the second circuit board side so as to define one or more holes through the circuit board and to facilitate thermal coupling between the second set of semiconductor devices and the heat dissipator through the one or more holes.

Abstract translation: 一种系统包括电路板，多管芯封装和散热器。 电路板具有大致相对的第一和第二侧面。 所述多管芯封装包括衬底和第一组第一衬底侧上的一个或多个半导体器件以及在第二衬底侧上的第二组一个或多个半导体器件。 多模封装位于第一电路板侧。 散热器位于第二电路板侧，并且热耦合到第二组半导体器件。 在第一电路板侧和第二电路板侧之间移除电路板的一个或多个部分，以便限定通过电路板的一个或多个孔，并且促进第二组半导体器件与散热器之间的热耦合 通过一个或多个孔。

公开(公告)号：US08379390B2

公开(公告)日：2013-02-19

申请号：US12869843

申请日：2010-08-27

Applicant: Yoshihiko Inoue

Inventor： Yoshihiko Inoue

IPC: H05K7/20

CPC classification number: H01L23/552 ,  H01L23/3675 ,  H01L23/4006 ,  H01L24/29 ,  H01L24/32 ,  H01L2224/73253 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/14 ,  H01L2924/16152 ,  H01L2924/1616 ,  H01L2924/167 ,  H05K1/0203 ,  H05K9/0026 ,  H05K2201/10371 ,  H05K2201/10393

Abstract: A package substrate includes a circuit board, an electronic component, an electromagnetic shield cover, and a heat conducting member. The electronic component is disposed on the circuit board. The electromagnetic shield cover is fixedly coupled to the circuit board. The electromagnetic shield cover houses the electronic component within an inside space defined between the electromagnetic shield cover and the circuit board. The heat conducting member is disposed between the electronic component and the electromagnetic shield cover within the inside space. The heat conducting member contacts both of the electronic component and the electromagnetic shield cover such that the heat conducting member establishes a thermal connection between the electronic component and the electromagnetic shield cover.

Abstract translation: 封装基板包括电路板，电子部件，电磁屏蔽罩和导热部件。 电子部件设置在电路板上。 电磁屏蔽罩固定在电路板上。 电磁屏蔽罩将电子部件容纳在电磁屏蔽罩和电路板之间限定的内部空间内。 导热构件设置在内部空间内的电子部件和电磁屏蔽罩之间。 导热构件接触电子部件和电磁屏蔽罩两者，使得导热构件在电子部件和电磁屏蔽罩之间建立热连接。