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    METHOD FOR PRODUCING WIRING BOARD
    61.
    发明申请
    METHOD FOR PRODUCING WIRING BOARD 审中-公开
    生产接线板的方法

    公开(公告)号：US20160189979A1

    公开(公告)日：2016-06-30

    申请号：US14963630

    申请日：2015-12-09

    Applicant: KYOCERA Circuit Solutions, Inc.

    Inventor： Yoshinori NAKATOMI

    IPC: H01L21/48 ,  H01L21/56

    CPC classification number: H01L21/486 ,  H01L21/4857 ,  H01L23/49822 ,  H01L23/49827 ,  H01L24/13 ,  H01L24/16 ,  H01L2224/131 ,  H01L2224/16227 ,  H01L2924/15313 ,  H05K1/185 ,  H05K3/4602 ,  H05K2201/10636 ,  H05K2203/1469 ,  Y02P70/611 ,  H01L2924/014 ,  H01L2924/00014

    Abstract: The method for producing a wiring board according to the present invention includes the steps of: preparing an insulating board including a cavity forming area and a wiring forming area; forming a first wiring conductor in the wiring forming area; forming a cavity in the cavity forming area and an opening in a part of the wiring forming area; inserting an electronic component including an external electrode into the cavity; forming insulating layers on upper and lower surfaces of the insulating board, the insulating layers filled into a gap in the cavity and into the opening; forming a through-hole penetrating through the opening from the insulating layer on an upper surface side to the insulating layer on a lower surface side; and forming a second wiring conductor on a surface of the insulating layer and in the through-hole.

    Abstract translation: 本发明的布线基板的制造方法包括以下步骤：制备包括空腔形成区域和布线形成区域的绝缘板; 在所述布线形成区域中形成第一布线导体; 在空腔形成区域中形成空腔，在所述布线形成区域的一部分中形成开口; 将包括外部电极的电子部件插入所述空腔中; 在所述绝缘板的上表面和下表面上形成绝缘层，所述绝缘层填充到所述空腔中的间隙中并进入所述开口中; 从上表面侧的绝缘层向下表面侧的绝缘层形成贯通开口的贯通孔; 以及在所述绝缘层的表面和所述通孔中形成第二布线导体。

    Substrate with built-in electronic component
    63.
    发明授权
    Substrate with built-in electronic component 有权
    基板内置电子元器件

    公开(公告)号：US09363897B2

    公开(公告)日：2016-06-07

    申请号：US14133372

    申请日：2013-12-18

    Applicant: Taiyo Yuden Co., Ltd.

    Inventor： Yuichi Sugiyama ,  Tatsuro Sawatari ,  Yusuke Inoue ,  Masashi Miyazaki

    IPC: H05K1/18 ,  H05K1/02 ,  H01L23/00 ,  H05K3/46

    CPC classification number: H05K1/183 ,  H01L24/19 ,  H01L2224/04105 ,  H01L2924/12042 ,  H01L2924/19105 ,  H05K1/0298 ,  H05K1/185 ,  H05K3/4602 ,  H05K2201/0209 ,  H05K2201/068 ,  H05K2201/10636 ,  H05K2203/1469 ,  Y02P70/611 ,  H01L2924/00

    Abstract: Provided is a substrate with built-in electronic component including a component storage layer and two buildup layers. The component storage layer includes an electronic component and a cover portion having an insulating property. The electronic component includes a terminal surface and a main body. The cover portion includes a first surface formed to be flush with the terminal surface, covers the main body of the electronic component, and has a first linear expansion coefficient. The two buildup layers each include an insulating layer and a via portion. The insulating layer is adjacent to the cover portion and has a second linear expansion coefficient larger than the first linear expansion coefficient. The via portion is provided in the insulating layer and connected to the terminal surface. The insulating layer of one of the two buildup layers is formed to be in contact with the terminal surface and the first surface.

    Abstract translation: 提供了具有内置电子部件的基板，包括部件存储层和两个累积层。 部件存储层包括电子部件和具有绝缘性的盖部。 电子部件包括终端面和主体。 盖部包括形成为与端子表面齐平的第一表面，覆盖电子部件的主体，并且具有第一线性膨胀系数。 两个堆积层各自包括绝缘层和通孔部分。 绝缘层与盖部相邻，并且具有大于第一线膨胀系数的第二线膨胀系数。 通孔部分设置在绝缘层中并连接到端子表面。 两个堆积层之一的绝缘层形成为与端子表面和第一表面接触。

    ELECTRONIC COMPONENT AND BOARD HAVING THE SAME
    65.
    发明申请
    ELECTRONIC COMPONENT AND BOARD HAVING THE SAME 有权
    具有相同功能的电子元件和板

    公开(公告)号：US20160141093A1

    公开(公告)日：2016-05-19

    申请号：US14936471

    申请日：2015-11-09

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Dong Jin JEONG

    IPC: H01F27/28 ,  H05K1/18 ,  H05K1/11 ,  H05K1/03

    CPC classification number: H01F17/0013 ,  H01F17/04 ,  H01F27/292 ,  H01F2017/048 ,  H05K3/3442 ,  H05K2201/1003 ,  H05K2201/10636 ,  Y02P70/611

    Abstract: An electronic component includes a body including internal electrodes; an insulating layer disposed on side surfaces of the body and at least one of an upper surface of the body and a lower surface of the body; and an external electrode disposed on an end surface of the body and connected to the internal electrodes. The external electrode extends to at least one of the upper surface of the body, the lower surface of the body, and the side surfaces of the body, and partially overlaps the insulating layer.

    Abstract translation: 电子部件包括：内部电极; 设置在主体的侧表面上的绝缘层和主体的上表面和主体的下表面中的至少一个; 以及设置在主体的端面上并连接到内部电极的外部电极。 外部电极延伸到主体的上表面，主体的下表面和主体的侧表面中的至少一个，并且部分地与绝缘层重叠。

    BUILT-IN-ELECTRONIC-COMPONENT SUBSTRATE AND MANUFACTURING METHOD THEREFOR
    66.
    发明申请
    BUILT-IN-ELECTRONIC-COMPONENT SUBSTRATE AND MANUFACTURING METHOD THEREFOR 有权
    内置电子元件基板及其制造方法

    公开(公告)号：US20160128199A1

    公开(公告)日：2016-05-05

    申请号：US14928136

    申请日：2015-10-30

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Masaru TAKAHASHI ,  Choichiro FUJII

    IPC: H05K1/18 ,  H01G4/30 ,  H05K3/30

    CPC classification number: H05K1/185 ,  H01G2/106 ,  H01G4/224 ,  H01G4/30 ,  H01G4/33 ,  H05K1/0271 ,  H05K3/3442 ,  H05K2201/10015 ,  H05K2201/10636 ,  H05K2203/122 ,  Y02P70/611

    Abstract: A built-in-electronic-component substrate includes a core substrate, an electronic component mounted on one main surface of the core substrate via a joining member, and a resin layer including the electronic component embedded therein. The electronic component is a multilayer ceramic capacitor including a ceramic multilayer body, and a first outer electrode including an end surface portion and a second outer electrode including an end surface portion provided on end surfaces of the ceramic multilayer body. A first gap is provided between the resin layer and the end surface portion of the first outer electrode and the joining member and a second gap is provided between the resin layer and the end surface portion of the second outer electrode and the joining member.

    Abstract translation: 内置电子部件基板包括芯基板，通过接合部件安装在芯基板的一个主表面上的电子部件和包含嵌入其中的电子部件的树脂层。 电子部件是包括陶瓷多层体的多层陶瓷电容器和包括端面部的第一外部电极和包括设置在陶瓷多层体的端面上的端面部的第二外部电极。 树脂层与第一外部电极和接合部件的端面部之间设置有第一间隙，在第二外部电极和接合部件的树脂层与端面部之间设置第二间隙。

    Wiring substrate and manufacturing method of wiring substrate
    70.
    发明授权
    Wiring substrate and manufacturing method of wiring substrate 有权
    布线基板的布线基板和制造方法

    公开(公告)号：US09313894B2

    公开(公告)日：2016-04-12

    申请号：US14295721

    申请日：2014-06-04

    Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.

    Inventor： Takayuki Kiwanami ,  Junji Sato ,  Katsuya Fukase

    IPC: H05K1/16 ,  H05K1/18 ,  H05K3/46 ,  H05K1/11

    CPC classification number: H05K1/185 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/15311 ,  H05K1/113 ,  H05K1/18 ,  H05K1/182 ,  H05K3/4602 ,  H05K3/4644 ,  H05K3/4697 ,  H05K2201/10636 ,  Y02P70/611

    Abstract: A wiring substrate includes a core, a first wiring layer formed on a first surface of the core, a second wiring layer formed on a second surface of the core, and an electronic component partially accommodated in the cavity and including a projected portion projected from the first opening of the core. A first insulating layer covers a side surface of the electronic component and the first surface of the core and fills a portion of the cavity. A second insulating layer covers the first insulating layer. A third insulating layer covers the second surface of the core. The remainder of the cavity that is not filled with the first insulating layer is filled with the third insulating layer.

    Abstract translation: 布线基板包括芯，形成在芯的第一表面上的第一布线层，形成在芯的第二表面上的第二布线层和部分地容纳在空腔中的电子部件，并且包括从所述芯 首先打开核心。 第一绝缘层覆盖电子部件的侧表面和芯的第一表面并填充空腔的一部分。 第二绝缘层覆盖第一绝缘层。 第三绝缘层覆盖芯的第二表面。 未填充有第一绝缘层的空腔的其余部分填充有第三绝缘层。

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