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    MEMS Component and Method for Encapsulating MEMS Components
    71.
    发明申请
    MEMS Component and Method for Encapsulating MEMS Components 有权
    MEMS组件和封装MEMS组件的方法

    公开(公告)号：US20150325780A1

    公开(公告)日：2015-11-12

    申请号：US14650538

    申请日：2013-10-14

    Applicant: EPCOS AG

    Inventor： Hans Krüger ,  Alois Stelzl ,  Christian Bauer ,  Jürgen Portmann ,  Wolfgang Pahl

    IPC: H01L41/23 ,  H01L41/293 ,  H01L41/053 ,  H01L41/27 ,  H01L41/113 ,  H01L41/083

    CPC classification number: H01L41/23 ,  B81B7/007 ,  B81B2207/095 ,  H01L24/97 ,  H01L41/053 ,  H01L41/083 ,  H01L41/1132 ,  H01L41/27 ,  H01L41/293 ,  H01L2224/11 ,  H01L2224/16225

    Abstract: A MEMS component includes, on a substrate, component structures, contact areas connected to the component structures, metallic column structures seated on the contact areas, and metallic frame structures surrounding the component structures. A cured resist layer is seated on frame structure and column structures such that a cavity is enclosed between substrate, frame structure and resist layer. A structured metallization is provided directly on the resist layer or on a carrier layer seated on the resist layer. The structured metallization includes at least external contacts of the component and being electrically conductively connected both to metallic structures and to the contact areas of the component structures.

    Abstract translation: MEMS部件在基板上包括部件结构，连接到部件结构的接触区域，安置在接触区域上的金属柱结构以及围绕部件结构的金属框架结构。 固化的抗蚀剂层位于框架结构和柱结构上，使得空腔被封装在基板，框架结构和抗蚀剂层之间。 直接在抗蚀剂层上或位于抗蚀剂层上的载体层上提供结构化的金属化。 结构化金属化包括至少该部件的外部触点并且与导电连接的金属结构和部件结构的接触区域。

    Method for Producing an Electronic Component
    72.
    发明申请
    Method for Producing an Electronic Component 有权
    生产电子元器件的方法

    公开(公告)号：US20150318464A1

    公开(公告)日：2015-11-05

    申请号：US14646463

    申请日：2013-11-25

    Applicant: EPCOS AG

    Inventor： Alexander Glazunov

    IPC: H01L41/257 ,  H01L41/04 ,  H01L41/29

    CPC classification number: H01L41/257 ,  H01L41/042 ,  H01L41/29 ,  Y10T29/43

    Abstract: A method for producing an electronic component includes providing a piezoelectric main body, which is provided with electrodes. A first electric polarization field having a first polarity direction is applied to the piezoelectric main body between the two electrodes and then a second electric polarization field is applied in a second polarity direction, opposite to the first polarity direction, to the piezoelectric main body between the electrodes. The absolute value of the second electric polarization field differs from that of the first electric polarization field.

    Abstract translation: 一种电子部件的制造方法，其特征在于，具备设置有电极的压电体。 将具有第一极性方向的第一电极化场施加到两个电极之间的压电主体，然后在与第一极性方向相反的第二极性方向上将第二极化场施加到压电主体之间 电极。 第二电极化场的绝对值与第一电极化场的绝对值不同。

    Circuit Arrangement
    73.
    发明申请
    Circuit Arrangement 审中-公开
    电路布置

    公开(公告)号：US20150310987A1

    公开(公告)日：2015-10-29

    申请号：US14650300

    申请日：2013-11-27

    Applicant: EPCOS AG

    Inventor： Jürgen Kiwitt ,  Robert Koch ,  Maximilian Pitschi

    IPC: H01F38/14 ,  H01F27/28

    CPC classification number: H01F38/14 ,  H01F27/2804 ,  H01F2038/143 ,  H03H9/706 ,  H03H9/725

    Abstract: A circuit arrangement can be used for adapting the electroacoustic properties of an electroacoustic component. The circuit arrangement includes a first conductor loop and a further element. The first conductor loop includes a main loop and a negative feedback loop. The negative feedback loop has a sense of curvature that is opposite to a sense of curvature of the main loop. The negative feedback loop compensates for a coupling between the main loop and the further element.

    Abstract translation: 可以使用电路布置来适应电声部件的电声特性。 电路装置包括第一导体环和另一元件。 第一导体回路包括主回路和负反馈回路。 负反馈回路具有与主回路的曲率感相反的曲率感。 负反馈环补偿主回路和另一元件之间的耦合。

    SENSOR ARRANGEMENTS AND METHODS OF PRODUCTION THEREOF
    75.
    发明申请
    SENSOR ARRANGEMENTS AND METHODS OF PRODUCTION THEREOF 审中-公开
    传感器布置及其生产方法

    公开(公告)号：US20150285664A1

    公开(公告)日：2015-10-08

    申请号：US14740429

    申请日：2015-06-16

    Applicant: EPCOS AG

    Inventor： Benjamin Bohl ,  Oliver Bard

    IPC: G01D11/24 ,  G01K1/08

    CPC classification number: G01D11/245 ,  G01K1/08

    Abstract: A sensor arrangement includes at least one sensor element with electrical connections and arranged in a solid plastic-material body, and at least a first electrically insulating layer which embeds the sensor element arranged between the sensor element and the plastic-material body, wherein the first electrically insulating layer includes a liquid polymer, and the plastic-material body is closed in an end region at least to such extent that the liquid polymer is sealed inside the plastic-material body in an airtight manner.

    Abstract translation: 传感器装置包括具有电连接并布置在固体塑料体中的至少一个传感器元件和至少第一电绝缘层，其嵌入设置在传感器元件和塑料材料体之间的传感器元件，其中第一 电绝缘层包括液体聚合物，并且塑料材料体在端部区域中至少封闭，使得液体聚合物以气密的方式密封在塑料材料体内。

    Light-emitting Diode Device
    77.
    发明申请
    Light-emitting Diode Device 有权
    发光二极管装置

    公开(公告)号：US20150243865A1

    公开(公告)日：2015-08-27

    申请号：US14422673

    申请日：2013-07-22

    Applicant: EPCOS AG

    Inventor： Thomas Feichtinger ,  Sebastian Brunner ,  Oliver Dernovsek ,  Klaus-Dieter Aichholzer ,  Georg Krenn ,  Axel Pecina ,  Christian Faistauer

    IPC: H01L33/64

    CPC classification number: H01L33/644 ,  H01L33/642 ,  H01L33/647

    Abstract: A light-emitting diode device has a first carrier and at least one light-emitting diode chip, which is arranged on the first carrier. The first carrier has at least one first and one second carrier part, wherein the light-emitting diode chip rests only on the first carrier part. Furthermore, the first and second carrier parts each have a thermal conductivity. The thermal conductivity of the first carrier part is at least 1.5 times the thermal conductivity of the second carrier part. The first carrier part is surrounded laterally by the second carrier part.

    Abstract translation: 发光二极管装置具有第一载体和布置在第一载体上的至少一个发光二极管芯片。 第一载体具有至少一个第一和第二载体部分，其中发光二极管芯片仅在第一载体部分上。 此外，第一和第二载体部分各自具有导热性。 第一载体部分的热导率为第二载体部分的热导率的至少1.5倍。 第一载体部分被第二载体部分横向包围。

    DUPLEXER
    78.
    发明申请
    DUPLEXER 有权
    双机

    公开(公告)号：US20150222300A1

    公开(公告)日：2015-08-06

    申请号：US14424975

    申请日：2013-07-29

    Applicant: EPCOS AG

    Inventor： Edgar Schmidhammer ,  Juha Ellae

    IPC: H04B1/04 ,  H04L5/14

    CPC classification number: H04B1/0475 ,  H04B1/52 ,  H04L5/14

    Abstract: A duplexer having good insulation, small geometric dimensions and good decoupling of the transmit signal path from an antenna which may have poor matching is specified. To that end, the duplexer comprises two transmit filters, a receive filter and two 90° hybrids.

    Abstract translation: 规定具有良好绝缘性，小几何尺寸以及发射信号路径与可能具有差匹配的天线的良好去耦的双工器。 为此，双工器包括两个发射滤波器，接收滤波器和两个90°混合器。

    METHOD OF PRODUCING A CERAMIC COMPONENT AND CERAMIC COMPONENT
    79.
    发明申请
    METHOD OF PRODUCING A CERAMIC COMPONENT AND CERAMIC COMPONENT 有权
    生产陶瓷部件和陶瓷部件的方法

    公开(公告)号：US20150203982A1

    公开(公告)日：2015-07-23

    申请号：US14406622

    申请日：2013-05-28

    Applicant: EPCOS AG

    Inventor： Franz Rinner ,  Christoph Auer ,  Christian Hoffmann

    IPC: C25D13/12 ,  H01L41/09 ,  H01G4/12 ,  H01L41/047 ,  H01G4/30 ,  H01G4/012

    CPC classification number: C25D13/12 ,  H01G4/012 ,  H01G4/12 ,  H01G4/232 ,  H01G4/30 ,  H01L41/0471 ,  H01L41/0472 ,  H01L41/09 ,  H01L41/273 ,  H01L41/293

    Abstract: A method of producing a ceramic component includes a) providing a main body having internal electrodes, outer edges of which are located on at least one first outer surface of the main body, b) contacting the first outer surface of the main body with a composition including an electrophoretically mobile insulating material and electrophoretically depositing the insulating material on outer edges of the internal electrodes on the first outer surface of the main body, and c) producing an insulating layer from the insulating material on the outer edges of the internal electrodes.

    Abstract translation: 一种制造陶瓷部件的方法包括：a）提供具有内部电极的主体，其外边缘位于主体的至少一个第一外表面上，b）使主体的第一外表面与组合物 包括电泳移动绝缘材料，并且将绝缘材料电泳沉积在主体的第一外表面上的内部电极的外边缘上，以及c）从内部电极的外边缘上的绝缘材料制造绝缘层。

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