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公开(公告)号：US20180048057A1
公开(公告)日：2018-02-15
申请号：US15234907
申请日：2016-08-11
Applicant: Apple Inc.
Inventor： Rex T. Ehman , Jayesh Nath , Carlo Di Nallo , James G. Horiuchi , Erik G. de Jong , Jason C. Sauers , Makiko K. Brzezinski , Siwen Yong , Lijun Zhang , Yi Jiang , Zheyu Wang , Mario Martinis , Eduardo Da Costa Bras Lima , Xu Han , Mattia Pascolini , Trevor J. Ness
CPC classification number: H01Q1/273 , H01Q1/243 , H01Q1/48 , H01Q1/50 , H01Q7/00 , H01Q9/0421 , H01Q9/14 , H04B5/00 , H04B5/0012 , H04B5/0031
Abstract: An electronic device such as a wristwatch may have a housing with metal portions such as metal sidewalls. The housing may form an antenna ground for an antenna. An antenna resonating element for the antenna may be formed from a stack of capacitively coupled component layers such as a display layer, touch sensor layer, and near-field communications antenna layer at a front face of the device. An additional antenna may be formed from a peripheral resonating element that runs along a peripheral edge of the device and the antenna ground. A rear face antenna may be formed using a wireless power receiving coil as a radio-frequency antenna resonating element or may be formed from metal antenna traces on a plastic support for light-based components.
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公开(公告)号：US09863822B2
公开(公告)日：2018-01-09
申请号：US14721111
申请日：2015-05-26
Applicant: Apple Inc.
Inventor： Jason C. Sauers , Po-Jui Chen , Tyler S. Bushnell
CPC classification number: G01L1/142 , G01L1/26 , G06F3/0414 , G06F3/044
Abstract: A force sensor includes compliant material that is configured to stay within a maximum uncompressed dimension in a first direction when compressed in a second direction. The first direction may be perpendicular to the second direction. The compliant material may stay within the maximum uncompressed dimension when compressed by expanding into one or more gaps defined in the compliant material. Such gaps may be defined on an external surface of the compliant material and/or internal to the compliant material. The gaps may be formed using a variety of different processes during or after formation of the compliant material.
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公开(公告)号：US20160366765A1
公开(公告)日：2016-12-15
申请号：US14843000
申请日：2015-09-02
Applicant: Apple Inc.
Inventor： Paul A. Martinez , Tyler S. Bushnell , Jason C. Sauers
CPC classification number: H05K1/0295 , H05K3/301 , H05K3/3436 , H05K3/3442 , H05K2201/094 , H05K2201/09954 , H05K2201/1031 , H05K2201/10515 , H05K2201/10636 , H05K2201/10962 , H05K2201/2036 , Y02P70/611 , Y02P70/613
Abstract: An electronic device may include surface mount technology components mounted to a printed circuit board. The surface mount technology components may include electrical components such as resistors, inductors, and capacitors. In order to reduce the size of the electronic device, surface mount technology components may be stacked. A surface mount technology component may be mounted to metal members that electrically connect the surface mount technology component to contact pads on a printed circuit board. A surface mount technology component may be provided with integral standoff portions, and a second surface mount technology component may be mounted to the integral standoff portions. A single surface mount technology component may be used to implement different circuits depending on which face of the surface mount technology component is mounted to the printed circuit board.
Abstract translation: 电子设备可以包括安装到印刷电路板的表面贴装技术部件。 表面贴装技术部件可以包括诸如电阻器，电感器和电容器的电气部件。 为了减小电子设备的尺寸，可以堆叠表面贴装技术部件。 表面贴装技术部件可以安装到将表面贴装技术部件电连接到印刷电路板上的接触焊盘的金属部件上。 表面贴装技术部件可以设置有一体的支座部分，并且第二表面安装技术部件可以安装到整体支座部分。 可以使用单个表面贴装技术部件来实现不同的电路，这取决于表面贴装技术部件的哪个面安装到印刷电路板上。
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公开(公告)号：US20160064840A1
公开(公告)日：2016-03-03
申请号：US14641316
申请日：2015-03-07
Applicant: Apple Inc.
Inventor： Dustin J. Verhoeve , Jason C. Sauers , Benjamin J. Kallman
CPC classification number: H05K1/09 , H01R12/61 , H01R12/7082 , H01R12/77 , H01R13/5202 , H01R13/74
Abstract: Connector receptacles that may be space efficient and provide a direct connection to a flexible circuit board. One example may provide an electronic device having a receptacle including a recess formed in a housing of the electronic device. The recess may have a sidewall and a bottom surface portion, and the bottom surface portion may include one or more openings extending through the bottom surface portion from an external surface to an internal surface. One or more contacts formed on a flexible circuit board may be aligned with the one or more openings in the bottom surface portion. In this way, the receptacle may be space efficient and provide a direct connection to a flexible circuit board inside an electronic device. A cosmetic cap may be placed in the recess to obscure the existence of the connector receptacle.
Abstract translation: 连接器插座可能是空间有效的，并提供与柔性电路板的直接连接。 一个示例可以提供具有插座的电子设备，该插座包括形成在电子设备的壳体中的凹部。 凹部可以具有侧壁和底表面部分，并且底表面部分可以包括从外表面延伸穿过底表面部分到内表面的一个或多个开口。 形成在柔性电路板上的一个或多个触点可以与底表面部分中的一个或多个开口对齐。 以这种方式，插座可以是空间有效的并且提供与电子设备内部的柔性电路板的直接连接。 化妆品盖可以放置在凹槽中以遮蔽连接器插座的存在。
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公开(公告)号：US12300183B2
公开(公告)日：2025-05-13
申请号：US18479397
申请日：2023-10-02
Applicant: Apple Inc.
Inventor： Cheng Chen , Jason C. Sauers , Fletcher R. Rothkopf , David W. Lum , Chun-Yao Huang , Enkhamgalan Dorjgotov , Graham B. Myhre , Bennett S. Wilburn , Paolo Sacchetto , Shih Chang Chang , Wonjae Choi , Cheuk Chi Lo
IPC: G09G3/3275 , G09G3/20 , G09G3/3225 , G09G3/3266 , G09G3/36
Abstract: An electronic device such as a head-mounted device may have displays. The display may have regions of lower and higher resolution to reduce data bandwidth and power consumption for the display while preserving satisfactory image quality. Data lines may be shared by lower and higher resolution portions of a display or different portions of a display with different resolutions may be supplied with different numbers of data lines. Data line length may be varied in transition regions between lower resolution and higher resolution portions of a display to reduce visible discontinuities between the lower and higher resolution portions. The lower and higher resolution portions of the display may be dynamically adjusted using dynamically adjustable gate driver circuitry and dynamically adjustable data line driver circuitry.
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Patent Agency Ranking
公开(公告)号：US12248153B2
公开(公告)日：2025-03-11
申请号：US18428126
申请日：2024-01-31
Applicant: APPLE INC.
Inventor： Killian J. Poore , Marinus Meursing , Jeffrey C. Olson , Fletcher R. Rothkopf , Jason C. Sauers
Abstract: A head-mounted display configured to be worn by a user includes a housing and a headband configured to secure the housing to a head of the user. The headband includes a proximal end coupled to the housing and a distal end that is free from connection to the housing. The head-mounted display includes an adjustment mechanism configured to change a fit of the headband relative to the head of the user.
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公开(公告)号：US20250060603A1
公开(公告)日：2025-02-20
申请号：US18934225
申请日：2024-10-31
Applicant: Apple Inc.
Inventor： Jeremy C. Franklin , Jason C. Sauers , Trevor J. Ness , Marinus Meursing
IPC: G02B27/01
Abstract: A head-mountable display device includes a housing defining a front opening and a rear opening, a display screen disposed in the front opening, a display assembly disposed in the rear opening, a first securement strap coupled to the housing, the first securement strap including a first electronic component, a second securement strap coupled to the housing, the second securement strap including a second electronic component, and a securement band extending between and coupled to the first securement strap and the second securement strap.
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公开(公告)号：US20240405430A1
公开(公告)日：2024-12-05
申请号：US18423041
申请日：2024-01-25
Applicant: Apple Inc.
Inventor： Jiangfeng Wu , Mei-Li Chi , Killian J. Poore , Jason C. Sauers , Siwen Yong , Yi Jiang , Jing Zhu , Lu Zhang , Junying Liu
Abstract: An electronic device may have first and second rear-facing displays, a front-facing display, a cover layer at a front side with a central region overlapping the front-facing display and a peripheral region, and wireless circuitry with a transceiver and antennas. The transceiver may convey audio data with left and right earbuds using a non-Bluetooth low-latency-audio communications protocol. The antenna(s) may be mounted at a bottom side of the device overlapping the peripheral region, at a rear side of the device, or may be mounted to a head strap. The antenna(s) may be tilted to optimize field(s) of view, to match polarization of the earbuds, and/or to allow multiple antennas to exhibit orthogonal polarizations. The antennas may include a single antenna that concurrently conveys packets of audio data to both earbuds or may include first and second antennas that concurrently convey audio data to the left and right earbuds.
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公开(公告)号：US20240405407A1
公开(公告)日：2024-12-05
申请号：US18425299
申请日：2024-01-29
Applicant: Apple Inc.
Inventor： Killian J. Poore , Jiangfeng Wu , Mei-Li Chi , Jason C. Sauers , Siwen Yong , Yi Jiang
Abstract: An electronic device may have first and second rear-facing displays, a front-facing display, a cover at a front side overlapping the front-facing display, and an antenna that radiates through the cover. The antenna may be formed from sheet metal. The antenna may have a resonating element formed from a first portion of the sheet metal and an antenna ground that includes a second portion of the sheet metal separated from the first portion by a cavity. A third portion of the sheet metal may couple the first portion to the second portion and may be folded around the cavity to produce a spring force that presses the first portion against the cover. The first portion and the cover may have the same compound curvature. The second portion may form a conductive cavity for the antenna.
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公开(公告)号：US20240397680A1
公开(公告)日：2024-11-28
申请号：US18478596
申请日：2023-09-29
Applicant: Apple Inc.
Inventor： David J. Dunsmoor , Enoch Mylabathula , Jason C. Sauers , Jesse T. Dybenko , Laura M. Campo
Abstract: An electronic cooling assembly includes a heat-generating electronic component and a fan. In some examples the fan includes a housing defining an internal volume, the housing thermally coupled to the heat-generating electronic component, and a plurality of blades disposed in the internal volume. In some examples, the fan housing is thermally coupled directly to the heat-generating component via a thermal paste disposed between the heat-generating component and the housing.
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