-
公开(公告)号:US20220115806A1
公开(公告)日:2022-04-14
申请号:US17561048
申请日:2021-12-23
Applicant: Greatbatch Ltd.
Inventor: Thomas Marzano , Keith W. Seitz , Robert A. Stevenson , Christine A. Frysz , Marc Gregory Martino
IPC: H01R13/52 , H01R13/426 , H01G4/35 , H01R13/719 , A61N1/375
Abstract: A hermetic feedthrough terminal pin connector for an active implantable medical device (AIMD) includes an electrical insulator hermetically sealed to an opening of an electrically conductive ferrule. A feedthrough terminal pin is hermetically sealed to and disposed through the insulator, the feedthrough terminal pin extending outwardly beyond the insulator on the inside of the casing of the AIMD. A circuit board is disposed on the inside of the casing of the AIMD. A terminal pin connector includes: an electrically conductive connector housing disposed on the circuit board, wherein the connector housing is electrically connected to at least one electrical circuit disposed on the circuit board; and at least one electrically conductive prong supported by the connector housing, the at least one prong contacting and compressed against the feedthrough terminal pin, the at least one prong making a removable electrical connection.
-
72.
公开(公告)号:US11011787B2
公开(公告)日:2021-05-18
申请号:US16240173
申请日:2019-01-04
Applicant: Greatbatch Ltd.
Inventor: Keith W. Seitz , Robert S. Rubino , Gary Freitag , David Dianetti , Todd C. Sutay , Ho-Chul Yun , Thomas Marzano , Brian P. Hohl
IPC: H01M50/10 , H01M50/116 , H01M50/147 , H01M50/155 , H01M50/169 , H01M50/186 , H01M50/191 , H01M50/543 , H01M4/131 , H01M10/0525
Abstract: A miniature electrochemical cell having a total volume that is less than 0.5 cc is described. The cell casing is formed by joining two ceramic casing halves together. One or both casing halves are machined from ceramic to provide a recess that is sized and shaped to contain the electrode assembly. The opposite polarity terminals are metal feedthroughs, such as of gold, and are formed by brazing gold into openings machined into one or both ceramic casing halves. The two ceramic casing halves are separated from each other by a metal interlayer, such as of gold, bonded to a thin film metallization adhesion layer, such as of titanium, that contacts an edge periphery of each ceramic casing half. A solid electrolyte (LixPOyNz) is used to activate the electrode assembly.
-
公开(公告)号:US10596369B2
公开(公告)日:2020-03-24
申请号:US16121716
申请日:2018-09-05
Applicant: Greatbatch Ltd.
Inventor: Robert A. Stevenson , Christine A. Frysz , Thomas Marzano , Keith W. Seitz , Marc Gregory Martino
IPC: A61N1/08 , H01G4/005 , H01G4/30 , H01G4/35 , A61N1/375 , H01G4/236 , H01G4/12 , H03H1/00 , A61N1/37
Abstract: A hermetically sealed filtered feedthrough assembly includes an electrically conductive ferrule sealed by a first gold braze to an insulator disposed at least partially within a ferrule opening. A conductive wire is disposed within a via hole disposed through the insulator extending from a body fluid side to a device side. A second gold braze hermetically seals the conductive leadwire to the via hole. A capacitor is disposed on the device side having a capacitor dielectric body with a dielectric constant k that is greater than 0 and less than 1000. The capacitor is the first filter capacitor electrically connected to the conductive leadwire coming from the body fluid side into the device side. An active electrical connection electrically connects the conductive leadwire to the capacitor active metallization. A ground electrical connection electrically connects the capacitor ground metallization to the ferrule and housing of the active implantable medical device.
-
74.
公开(公告)号:US10559409B2
公开(公告)日:2020-02-11
申请号:US16362862
申请日:2019-03-25
Applicant: Greatbatch Ltd.
Inventor: Keith W. Seitz , Dallas J. Rensel , Brian P. Hohl , Jonathan Calamel , Xiaohong Tang , Robert A. Stevenson , Christine A. Frysz , Thomas Marzano , Jason Woods , Richard L. Brendel
IPC: A61N1/375 , B23K1/19 , C04B41/51 , H01B17/30 , C04B41/45 , C04B41/88 , H01B19/02 , B23K1/00 , C04B41/00 , B23K1/008 , B23K26/32 , B23K26/21 , B22F7/04 , B23K101/36 , B23K103/14 , B22F7/08
Abstract: A method for manufacturing a feedthrough dielectric body for an active implantable medical device includes the steps of first forming a ceramic reinforced metal composite (CRMC) paste by mixing platinum with a ceramic material to form a CRMC material, subjecting the CRMC material to a first sintering step to thereby form a sintered CRMC material, ball-milling or grinding the sintered CRMC material to form a powdered CRMC material; and then mixing the powdered CRMC material with a solvent to form the CRMC paste. The method further includes forming an alumina ceramic body in a green state, forming at least one via hole through the alumina ceramic body, filling the via hole with the CRMC paste, drying the ceramic body including the CRMC paste to form a first CRMC material filling the via hole, forming a second via hole through the first CRMC material, providing a metal core in the second via hole, and subjecting the ceramic body including the first CRMC material and the metal core to a second sintering step to thereby form the dielectric body. The dielectric body is then sealed in a ferrule opening to form a feedthrough.
-
公开(公告)号:US20200030614A1
公开(公告)日:2020-01-30
申请号:US16589752
申请日:2019-10-01
Applicant: Greatbatch Ltd.
Inventor: Robert A. Stevenson , Christine A. Frysz , Keith W. Seitz , Thomas Marzano , Marc Gregory Martino
IPC: A61N1/375 , A61N1/05 , H01G4/40 , H01G4/005 , A61N1/08 , H01R43/00 , C22C29/12 , H02G3/22 , H01G4/30 , B23K35/30 , H01G2/10 , H01G4/35 , H01R13/52 , H01G4/236 , B23K35/32 , H01R4/02 , H01R13/719 , B23K35/02
Abstract: A hermetically sealed filtered feedthrough assembly attachable to an AIMD includes an insulator hermetically sealing the opening of a ferrule with a gold braze. The ferrule includes a peninsula extending into the ferrule opening and the insulator has a cutout matching the peninsula. A sintered platinum-containing paste hermetically seals at least one via hole extending through the insulator. At least one capacitor is disposed on the device side. An active electrical connection electrically connects the capacitor active metallization to the sintered paste. A ground electrical connection electrically connects the capacitor ground metallization disposed within a capacitor ground passageway to the portion of the gold braze along the ferrule peninsula. The dielectric of the capacitor may be less than 1,000 k.
-
公开(公告)号:US20190255319A1
公开(公告)日:2019-08-22
申请号:US16391801
申请日:2019-04-23
Applicant: Greatbatch Ltd.
Inventor: Robert A. Stevenson , Christine A. Frysz , Thomas Marzano , Keith W. Seitz , Marc Gregory Martino
Abstract: A filtered feedthrough assembly for an active implantable medical device (AIMD) includes an insulator hermetically sealed to an opening of an electrically conductive ferrule. A ceramic reinforced metal composite of platinum and alumina (CRMC) material is disposed in an insulator via hole surrounding a substantially pure platinum fill. A capacitor disposed on the insulator device side has a capacitor dielectric with a dielectric constant k that is greater than 0 and less than 1000. Coming from the body fluid side to the device side of the AIMD, the capacitor is the first filter capacitor electrically connected to the substantially pure platinum fill. An active electrical connection electrically connects the substantially pure platinum fill to the capacitor active metallization. A ground electrical connection electrically connects the capacitor ground metallization to the ferrule and subsequently to the housing of the AIMD
-
公开(公告)号:US20190001123A1
公开(公告)日:2019-01-03
申请号:US16121716
申请日:2018-09-05
Applicant: Greatbatch Ltd.
Inventor: Robert A. Stevenson , Christine A. Frysz , Thomas Marzano , Keith W. Seitz , Marc Gregory Martino
Abstract: A hermetically sealed filtered feedthrough assembly includes an electrically conductive ferrule sealed by a first gold braze to an insulator disposed at least partially within a ferrule opening. A conductive wire is disposed within a via hole disposed through the insulator extending from a body fluid side to a device side. A second gold braze hermetically seals the conductive leadwire to the via hole. A capacitor is disposed on the device side having a capacitor dielectric body with a dielectric constant k that is greater than 0 and less than 1000. The capacitor is the first filter capacitor electrically connected to the conductive leadwire coming from the body fluid side into the device side. An active electrical connection electrically connects the conductive leadwire to the capacitor active metallization. A ground electrical connection electrically connects the capacitor ground metallization to the ferrule and housing of the active implantable medical device.
-
公开(公告)号:US10046166B2
公开(公告)日:2018-08-14
申请号:US15164945
申请日:2016-05-26
Applicant: Greatbatch Ltd.
Inventor: Robert A. Stevenson , Thomas Marzano , Keith W. Seitz , Christine A. Frysz
IPC: H01G4/35 , A61N1/375 , H01G4/12 , H01G4/40 , H05K1/11 , H05K1/09 , H05K5/06 , H05K1/03 , H05K3/40 , A61N1/05 , A61N1/08 , H01G2/10 , H01G4/005 , H01R43/00 , A61N1/372 , C22C29/12 , C22C32/00
Abstract: A hermetically sealed feedthrough filter assembly is attachable to an active implantable medical device and includes an insulator substrate assembly and a feedthrough filter capacitor disposed on a device side. A conductive leadwire has a proximal leadwire end extending to a distal leadwire end, wherein the proximal leadwire end is connectable to electronics internal to the AIMD. The distal leadwire end is disposed at least partially through a first passageway of the feedthrough filter capacitor and is in contact with, adjacent to or near a device side conductive fill. A first electrically conductive material makes a three-way electrically connection that electrically connects the device side conductive fill to an internal metallization of the feedthrough filter capacitor and to the distal leadwire end. A second electrically conductive material electrically connects an external metallization of the feedthrough filter capacitor to a ferrule or an AIMD housing.
-
79.
公开(公告)号:US20180178017A1
公开(公告)日:2018-06-28
申请号:US15894239
申请日:2018-02-12
Applicant: Greatbatch Ltd.
Inventor: Robert A. Stevenson , Xiaohong Tang , William C. Thiebolt , Christine A. Frysz , Keith W. Seitz , Richard L. Brendel , Thomas Marzano , Jason Woods , Dominick J. Frustaci , Steven W. Winn
CPC classification number: A61N1/3754 , A61N1/05 , A61N1/372 , A61N1/375 , B22F2998/10 , C22C29/12 , H01G2/103 , H01G4/35 , H01R43/00 , Y10T156/1052 , B22F1/0059 , B22F3/10
Abstract: A hermetically sealed feedthrough for attachment to an active implantable medical device includes a dielectric substrate configured to be hermetically sealed to a ferrule or an AIMD housing. A via hole is disposed through the dielectric substrate from a body fluid side to a device side. A conductive fill is disposed within the via hole forming a filled via electrically conductive between the body fluid side and the device side. A conductive insert is at least partially disposed within the conductive fill. Then, the conductive fill and the conductive insert are co-fired with the dielectric substrate to form a hermetically sealed and electrically conductive pathway through the dielectric substrate between the body fluid side and the device side.
-
80.
公开(公告)号:US20180178016A1
公开(公告)日:2018-06-28
申请号:US15844683
申请日:2017-12-18
Applicant: Greatbatch Ltd.
Inventor: Dominick J. Frustaci , Keith W. Seitz , Thomas Marzano , Robert A. Stevenson , Christine A. Frysz , Richard L. Brendel , Jason Woods
IPC: A61N1/375 , H01G4/35 , H01R13/7195 , H01G2/22 , H05K1/02 , A61N1/05 , H01G2/10 , A61N1/08 , H01G4/40
CPC classification number: A61N1/3754 , A61N1/05 , A61N1/08 , H01G2/103 , H01G2/22 , H01G4/35 , H01G4/40 , H01R13/7195 , H01R2201/12 , H05K1/0231 , H05K2201/10015 , H05K2201/10189 , H05K2201/10303
Abstract: A hermetically sealed feedthrough subassembly attachable to an active implantable medical device includes a first conductive leadwire extending from a first end to a second end, the first conductive leadwire first end disposed past a device side of an insulator body. A feedthrough filter capacitor is disposed on the device side. A second conductive leadwire is disposed on the device side having a second conductive leadwire first end at least partially disposed within a first passageway of the feedthrough filter capacitor and having a second conductive leadwire second end disposed past the feedthrough filter capacitor configured to be connectable to AIMD internal electronics. The second conductive leadwire first end is at, near or adjacent to the first conductive leadwire first end. A first electrically conductive material forms a three-way electrical connection electrically connecting the second conductive leadwire first end, the first conductive leadwire first end and a capacitor internal metallization.
-
-
-
-
-
-
-
-
-