公开(公告)号：US12278318B2

公开(公告)日：2025-04-15

申请号：US17626082

申请日：2020-06-19

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Thomas Schwarz

IPC: H01L33/62 ,  H01L23/00 ,  H01L25/075 ,  H01L33/54

Abstract: A component comprising a structural element, a leadframe and a shaped body, in which component the structural element and the leadframe are enclosed at least in regions by the shaped body in lateral directions and the leadframe does not project beyond side faces of the shaped body. The leadframe has at least one first subregion and at least one second subregion which is laterally spaced apart from the first subregion, wherein the structural element is electrically conductively connected to the second subregion by a planar contact structure. Furthermore, the structural element is arranged, in plan view, on the first subregion and projects laterally beyond the first subregion at least in regions, so that the structural element and the first subregion form an anchoring structure at which the structural element and the first subregion are anchored to the shaped body. Further specified is a method for producing such a component.

公开(公告)号：US20240278645A1

公开(公告)日：2024-08-22

申请号：US18652629

申请日：2024-05-01

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Matthias GOLDBACH ,  Stefan Grötsch ,  Lugwig Hofbauer ,  Sebastian Wittmann ,  Robert Regensburger ,  Thomas Schwarz ,  Michael Brandl ,  Andreas Dobner ,  Sebastian Stigler

IPC: B60K35/00 ,  B60K35/60 ,  H01B3/30 ,  H01B7/00 ,  H01B13/10 ,  H01L33/62

CPC classification number: B60K35/00 ,  H01B3/30 ,  H01B7/0018 ,  H01B13/103 ,  H01L33/62 ,  B60K35/60 ,  B60K2360/332 ,  B60K2360/47 ,  B60K2360/48 ,  B60K2360/785 ,  H01L2933/0066

Abstract: It is provided a window of a vehicle, optoelectronic circuits, in particular optoelectronic circuits for a window of a vehicle and a method for manufacturing a window of a vehicle including at least one optoelectronic component. It is further provided a display comprising at least one display module each comprising at least one optoelectronic array with a plurality of optoelectronic components, each optoelectronic component forming a pixel comprising at least one subpixel, in particular a μLED. In addition, a method for manufacturing a display module comprising at least one optoelectronic array with a plurality of optoelectronic components, each optoelectronic component forming a pixel comprising at least one subpixel, in particular a μLED, is provided.

公开(公告)号：US20230335690A1

公开(公告)日：2023-10-19

申请号：US18326801

申请日：2023-05-31

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Siegfried HERRMANN ,  Hubert Halbritter ,  Peter Brick ,  Thomas Schwarz ,  Laura Kreiner ,  Petrus Sundgren ,  Jean-Jacques Drolet ,  Michael Brandl ,  Xue Wang ,  Andreas Biebersdorf ,  Christoph Klemp ,  Ines Pietzonka ,  Julia Stolz ,  Simon Schwalenberg ,  Andreas Leber ,  Christine Rafael ,  Eva-Maria Rummel ,  Nicole Heitzer ,  Marie Assmann ,  Erwin Lang ,  Andreas Rausch ,  Marc Philippens ,  Karsten Diekmann ,  Stefan Illek ,  Christian Berger ,  Felix Feix ,  Ana Kanevce ,  Georg Bogner ,  Karl Engl

IPC: H01L33/52 ,  H01L33/50 ,  H01L33/60 ,  H01L33/04 ,  H01L25/075

CPC classification number: H01L33/52 ,  H01L33/502 ,  H01L33/60 ,  H01L33/04 ,  H01L25/0753 ,  B60K2370/1523 ,  B60K35/00

Abstract: The invention relates to various aspects of a μ-LED or a μ-LED array for augmented reality or lighting applications, in particular in the automotive field. The μ-LED is characterized by particularly small dimensions in the range of a few μm.

公开(公告)号：US11776468B2

公开(公告)日：2023-10-03

申请号：US17614061

申请日：2020-05-19

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Thomas Schwarz

IPC: G09G3/3208

CPC classification number: G09G3/3208 ,  G09G2310/0213 ,  G09G2320/064

Abstract: An optoelectronic light emitting device includes a plurality of programmable pixels arranged in a matrix of rows and columns, each pixel including at least one optoelectronic semiconductor component, and programming device configured to program the pixels in a plurality of successive time intervals. A row pattern including a subset of the rows of the matrix is given. The programming device is configured to program the pixels of those rows per time interval which are comprised by the row pattern. The row pattern is shifted by at least one row per time interval.

公开(公告)号：US20220149019A1

公开(公告)日：2022-05-12

申请号：US17541798

申请日：2021-12-03

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Michael Brandl ,  Andreas Dobner ,  Matthias Goldbach ,  Sebastian Wittmann ,  Uli Hiller ,  Markus Klein ,  Thomas Schwarz ,  Andreas Waldschik ,  Michael Wittmann ,  Matthias Bruckschloegl ,  Stefan Groetsch ,  Rainer Huber ,  Peter Brick ,  Ludwig Hofbauer

IPC: H01L25/075 ,  H01L33/46 ,  H01L33/62 ,  H01L33/64

Abstract: An optoelectronic device comprises a layer stack, which includes a carrier layer, a cover layer, and a first layer. The first layer is in particular an intermediate layer, arranged between the cover layer and the carrier layer. At least one electronic or optoelectronic element, in particular an optoelectronic light source, is arranged on the first layer and at least one layer of the layer stack and preferably all layers of the layer stack are at least partially transparent. The layer stack comprises at least one layer which comprises particles with a high thermal conductivity and/or at least one thermally conductive layer which is arranged between two adjacent layers of the layer stack.

公开(公告)号：US11114411B2

公开(公告)日：2021-09-07

申请号：US16345449

申请日：2017-10-25

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Thomas Schwarz ,  Jürgen Moosburger ,  Frank Singer

IPC: H01L23/00 ,  H01L33/00 ,  H01L21/67 ,  B65G47/90 ,  H01L21/683

Abstract: A method of transferring semiconductor chips includes providing a transfer tool having a plurality of segments, each segment having a liquid receiving area; providing a plurality of semiconductor chips in a regular array on a source carrier; providing a target carrier; selectively arranging liquid drops on the liquid receiving areas of some of the segments; causing the transfer tool to approach the source carrier, each liquid drop contacting and wetting a semiconductor chip; lifting the transfer tool from the source carrier, wherein semiconductor chips wetted by liquid drops are lifted from the source carrier by the transfer tool; causing the target carrier by the transfer tool, to approach the semiconductor chips arranged on the transfer tool contacting the target carrier; and lifting the transfer tool from the target carrier, the semiconductor chips contacting the target carrier remaining on the target carrier

公开(公告)号：US10861837B2

公开(公告)日：2020-12-08

申请号：US16467480

申请日：2017-12-19

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Thomas Schwarz

IPC: H01L25/16 ,  H01L25/075 ,  H01L33/62 ,  H01L33/64 ,  G09F9/302 ,  G09G3/32

Abstract: A video-wall module is disclosed. In an embodiment a video-wall module includes a printed-circuit board, a plurality of light-emitting diode chips arranged at the printed-circuit board, a circuit chip fixed to the printed-circuit board, wherein the circuit chip is connected with electrical connections of the light-emitting diode chips in order to electrically actuate the light-emitting diode chips and a housing for the circuit chip at least partially formed by the printed circuit board, wherein the light-emitting diode chips are divided into a first area and a first edge area surrounding the first area, and wherein the light-emitting diode chips in the first area comprise a smaller radiation wavelength than the light-emitting diode chips in the first edge area on average at the same temperature.

公开(公告)号：US10535806B2

公开(公告)日：2020-01-14

申请号：US15742106

申请日：2016-07-11

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Christian Leirer ,  Korbinian Perzlmaier ,  Anna Kasprzak-Zablocka ,  Berthold Hahn ,  Thomas Schwarz

IPC: H01L33/62 ,  H01L33/48 ,  H01L33/52 ,  H01L33/00 ,  H01L33/22 ,  H01L33/38 ,  H01L33/44 ,  H01L33/50 ,  H01L33/64

Abstract: A component includes a carrier having a front side facing towards a semiconductor body and a rear side facing away from the semiconductor body, each of which is formed at least in places by a surface of a shaped body, a metal layer contains a first sub-region and a second sub-region, wherein the first sub-region and the second sub-region adjoin the shaped body in a lateral direction, are electrically connectable in a vertical direction on the front side of the carrier, are assigned to different electrical polarities of the component and are thus configured to electrically contact the semiconductor body, and the carrier has a side face running perpendicularly or obliquely to the rear side of the carrier and is configured as a mounting surface of the component, wherein at least one of the sub-regions is electrically connectable via the side face and exhibits singulation traces.

公开(公告)号：US20190237443A1

公开(公告)日：2019-08-01

申请号：US16318279

申请日：2017-07-13

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Thomas Schwarz ,  Alexander Martin ,  Jürgen Moosburger ,  Karl Engl

IPC: H01L25/075

CPC classification number: H01L25/0753 ,  G09F9/00 ,  H01L33/62 ,  H01L2933/0091

Abstract: A module for a video wall includes a plurality of light-emitting components; and a carrier including conduction regions, wherein the light-emitting components each include a top side including a top-side contact and an underside including an underside contact, the light-emitting components are configured to emit electromagnetic radiation via the top side, the underside contacts of the light-emitting components electrically conductively connect to the conduction regions, the top-side contacts electrically contact a conductive layer, the light-emitting components each include at least four light-emitting semiconductor chips, the light-emitting semiconductor chips within a light-emitting component interconnect in parallel with one another, the light-emitting semiconductor chips within a light-emitting component each electrically conductively connect to the top-side contacts and the underside contacts of the light-emitting component, a plurality of adjacent light-emitting components constitute a cluster, and the light-emitting semiconductor chips of the light-emitting components of a cluster includes an identical nominal wavelength.

公开(公告)号：US10355174B2

公开(公告)日：2019-07-16

申请号：US15738427

申请日：2016-07-12

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Markus Maute ,  Lutz Höppel ,  Jürgen Moosburger ,  Thomas Schwarz ,  Matthias Sabathil ,  Ralph Wirth ,  Alexander Linkov ,  Johannes Baur

IPC: H01L33/20 ,  H01L33/24 ,  H01L33/30 ,  H01L33/38 ,  H01L33/40 ,  H01L33/46 ,  H01L33/60 ,  H01L33/62

Abstract: A component includes a carrier and a semiconductor body arranged on the carrier, wherein the semiconductor body has an active layer arranged between the first and second semiconductor layers and is configured to generate, during operation of the component, an electromagnetic radiation that can be coupled out from the component through a first main surface, the first main surface of the component has an electrical contact layer configured to electrically contact a first semiconductor layer and in a plan view the carrier covers the first main surface in places, and in direct vicinity of the electrical contact layer the component includes a shielding structure configured to prevent electromagnetic radiation generated by the active layer from impinging onto the contact layer.